JPS63105879A - Grinding method - Google Patents
Grinding methodInfo
- Publication number
- JPS63105879A JPS63105879A JP25192486A JP25192486A JPS63105879A JP S63105879 A JPS63105879 A JP S63105879A JP 25192486 A JP25192486 A JP 25192486A JP 25192486 A JP25192486 A JP 25192486A JP S63105879 A JPS63105879 A JP S63105879A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- cylindrical body
- short cylindrical
- vibration
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 8
- 239000006061 abrasive grain Substances 0.000 claims description 14
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 8
- 230000009467 reduction Effects 0.000 abstract description 2
- 239000004576 sand Substances 0.000 abstract 3
- 238000005266 casting Methods 0.000 description 18
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000009933 burial Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的コ
（産業上の利用分野）
本発明は砥粒、好ましくはダイヤモンド粒を固着した研
削具を用いて、切断、溝加工、研摩等を行なう研削方法
に関するものである。[Detailed Description of the Invention] [Purpose of the Invention (Field of Industrial Application) The present invention relates to a grinding method for cutting, grooving, polishing, etc. using a grinding tool to which abrasive grains, preferably diamond grains, are fixed. It is something.
（従来の技術）
従来、セラミックスのような硬度が大きく、脆い材料に
、切断加工、スリット加工、溝加工等の加工を施こす場
合、比較的薄い円盤状の金属板にダイヤモンド粒のよう
な砥粒を固着した研削具（砥石）が用いられたが、次の
ような問題点かあった。(Conventional technology) Conventionally, when cutting, slitting, grooving, or other processing is performed on a highly hard and brittle material such as ceramics, a relatively thin disk-shaped metal plate is coated with abrasive particles such as diamond grains. A grinding tool (grindstone) with fixed grains was used, but it had the following problems.
（１）薄い金属板を使用するため研削具の剛性が小さく
、研削具を高速で回転させることか困難であり、大きい
研削速度をうることかてきない。(1) Since a thin metal plate is used, the rigidity of the grinding tool is low, and it is difficult to rotate the grinding tool at high speed, making it impossible to achieve a high grinding speed.
（２）研削面の精度を向上させようとすると研削速度を
特に小さくする必要が生じ、研削加工に長時間を要する
。(2) In order to improve the accuracy of the ground surface, it is necessary to particularly reduce the grinding speed, and the grinding process takes a long time.
金属板に超音波振動を与えつつ研削を行なうことにより
研削速度を向上させることはできるが、超音波振動によ
り金属板に横方向の振動が発生したり金属板の厚み方向
の超音波振動の振幅にバラツキが生じたりし易く、精度
のよい研削は困難であった。Grinding speed can be improved by applying ultrasonic vibrations to the metal plate while grinding, but ultrasonic vibrations may generate lateral vibrations in the metal plate or increase the amplitude of the ultrasonic vibrations in the thickness direction of the metal plate. It was difficult to grind with good precision because of variations in the grinding process.
又１表面研削加工を行なう場合カップ状の研削具が使用
される。研削具に超音波振動を伝えることにより加工能
率を向上させることは知られているが、このような形状
の研削具に超音波振動を与える適切な手段は知られてお
らず、高い加工能率をうろことはできなかった。Also, when performing surface grinding, a cup-shaped grinding tool is used. It is known that machining efficiency can be improved by transmitting ultrasonic vibrations to a grinding tool, but there is no known appropriate means for applying ultrasonic vibrations to a grinding tool with this shape, and it is difficult to achieve high machining efficiency. I couldn't scale.
（発明か解決しようとする問題点）
本発明は従来技術の有していた前述の問題点を解決し、
能率も高く、精度の良好な研削方法を提供することを目
的とするものである。(Problems to be solved by the invention) The present invention solves the above-mentioned problems of the prior art,
The purpose is to provide a grinding method that is highly efficient and has good accuracy.
［発明の構成］
（問題点を解決するための手段）
本発明者はこのような問題点を解決すべく各種形状の円
体形状を有する研削具を用いて実験を重ね、次のよう
な知見を得た。[Structure of the Invention] (Means for Solving the Problems) In order to solve these problems, the present inventor has repeatedly conducted experiments using grinding tools having various shapes of circular shapes, and has made the following findings. I got it.
（１）この円埼体の厚みｄと直径ａの比（ｄ／ａ）を小
さくすると、この円埼体に超音波振動を与えた場合の厚
み方向の振動が小さく、径方向の振動か大きくなり、こ
の円埼体形状の研削具を回転させて研削を行なう場合の
精度か向上すること。(1) If the ratio (d/a) between the thickness d and the diameter a of this cylindrical body is made small, the vibration in the thickness direction will be small when ultrasonic vibration is applied to this cylindrical body, and the vibration in the radial direction will be large. Therefore, the accuracy when grinding is performed by rotating this cylindrical grinding tool is to be improved.
（２）ｄ／ａを小さくすると径方向の振幅の厚み方向の
分布（バラツキ）も又減少し、（１）の効果と相俟って
研削精度を著しく向上させうろこと。(2) When d/a is decreased, the distribution (variation) of the radial amplitude in the thickness direction also decreases, and together with the effect of (1), the grinding accuracy is significantly improved.
（３）しかしながら、ｄ ／ ａをあまり小さくすると
厚み方向の振動か逆に増加すること。(3) However, if d/a is too small, vibration in the thickness direction will increase.
本発明者はこのような知見に基づいて種々検討の結果、
ｄ ／ ａを０．０５〜０．６好ましくは０．０５〜０
．２５の範囲とすることにより極めて好適な結果の得ら
れることを見出し本発明を完成した。As a result of various studies based on such knowledge, the present inventor has found that
d/a 0.05-0.6 preferably 0.05-0
．． The present invention was completed based on the discovery that very suitable results could be obtained by setting the value in the range of 25.
本発明は即ち、厚さと直径の比が０．０５〜０．６であ
り、且つその表面に砥粒を固着した短円鋳体に、該短円
鋳体の共振周波数と同一の周波数を有する超音波振動を
伝送しつつ、この短円鋳体を円埼軸を軸として回転させ
、上記砥粒を被研削体と接触させて研削することを特徴
とする研削方法を提供するものである。In other words, the present invention provides a short circular casting having a thickness to diameter ratio of 0.05 to 0.6 and having abrasive grains fixed to its surface, which has a frequency that is the same as the resonant frequency of the short circular casting. The present invention provides a grinding method characterized in that the short circular casting body is rotated about a circular axis while transmitting ultrasonic vibrations, and the abrasive grains are brought into contact with the object to be ground for grinding.
次に本発明を添附図面に基づき、更に具体的に説明する
。Next, the present invention will be explained in more detail based on the accompanying drawings.
ｌは、厚さｄと直径ａの比（ｄ／ａ）が前述した理由に
より０．０５〜０．６好ましくは０．０５〜０．２５の
範囲に保たれた短円鋳体で、鋼、アルミ、チタン等の材
料で構成される。l is a short circular casting whose ratio of thickness d to diameter a (d/a) is kept in the range of 0.05 to 0.6, preferably 0.05 to 0.25, for the reason mentioned above, and is made of steel. , aluminum, titanium, and other materials.
２は、好ましくはダイヤモンド粒て構成された砥粒で、
短円鋳体１の表面に銀ロー付、焼去め、接若、一体成型
等の手段で固着されている。2 is an abrasive grain preferably composed of diamond grains,
It is fixed to the surface of the short circular casting body 1 by means of silver brazing, burning away, attachment, integral molding, etc.
砥粒２は第１図に示すように短円鋳体ｌの周面３に設け
てもよく、或は第２図、第３図に示すように短円鋳体１
の端面４に設けることもてきる。The abrasive grains 2 may be provided on the circumferential surface 3 of the short circular casting body 1 as shown in FIG. 1, or on the circumferential surface 3 of the short circular casting body 1 as shown in FIGS.
It can also be provided on the end face 4 of.
砥粒２を周面３に設ける場合、周面３の中央に、台座５
を介して、１〜４０ｎｍ程度の間隔に設けることもでき
る。When the abrasive grains 2 are provided on the circumferential surface 3, a pedestal 5 is placed in the center of the circumferential surface 3.
They can also be provided at intervals of about 1 to 40 nm.
台座５としては円環状のものを用いるのが適当である。It is appropriate to use a ring-shaped pedestal 5.
そしてこのような台座を使用し、その幅を小さくするこ
とにより、短円鋳体の厚みを本発明の目的を達成するの
に充分な大きさとし、本発明の効果を損うことなく、狭
い溝加工を行なうことが可能となる。By using such a pedestal and reducing its width, the thickness of the short circular casting body can be made large enough to achieve the purpose of the present invention, and a narrow groove can be formed without impairing the effect of the present invention. It becomes possible to perform processing.
なお、台座の幅、高さは２０ ＫＨｚの場合夫々０．５
〜１０ｍｏ＋、Ｏ〜２０ｍｍ程度とするのが適当である
。In addition, the width and height of the pedestal are 0.5 each in the case of 20 KHz.
Appropriately, it is approximately 10mo+ and 0 to 20mm.
又砥粒２を端面４に設ける場合、第３図に示すよう端面
４の外周に配置するのが適当である。Further, when the abrasive grains 2 are provided on the end surface 4, it is appropriate to arrange them on the outer periphery of the end surface 4 as shown in FIG.
砥粒の粒度は、被研削体の種類等に応じて定められるが
、通常１１１００〜６００程度である。The particle size of the abrasive grains is determined depending on the type of object to be ground, etc., but is usually about 11,100 to 600.
６は、超音波振子で、砥粒２を固着した短円鋳体ｌの共
振周波数の超音波を発生させ、この超音波は、ブースタ
ー７、ホーン８を介して短円鋳体１に伝送される。ブー
スター７、ホーン８は短円鋳体１と同一の共振周波数を
有するようその形状を定められ、又その長さは伝送すべ
き超音波振動の波長の４ｘ整数倍長となるよう定められ
ている。6 is an ultrasonic pendulum that generates ultrasonic waves at the resonant frequency of the short circular casting body 1 to which the abrasive grains 2 are fixed, and this ultrasonic wave is transmitted to the short circular casting body 1 via the booster 7 and the horn 8. Ru. The shape of the booster 7 and the horn 8 is determined to have the same resonant frequency as that of the short circular casting body 1, and the length thereof is determined to be 4x an integral multiple of the wavelength of the ultrasonic vibration to be transmitted. .
又超音波振動子６、ブースター７、ホーン８は夫々軸（
図示せず）に垂直な断面が円形である回転体形状を具え
ている。In addition, the ultrasonic transducer 6, booster 7, and horn 8 each have a shaft (
It has the shape of a rotating body whose cross section perpendicular to (not shown) is circular.
超音波振動子６、ブースター７、ホーン８、短円鋳体ｌ
は螺合によりてこの順序で互いに同軸に結合され、又超
音波振動子６、ブースター７は、そのノート部において
、軸受９，９を介してハウジング１０に回転自在に支持
されている。Ultrasonic vibrator 6, booster 7, horn 8, short circular casting l
are coaxially coupled to each other in this order by screwing, and the ultrasonic vibrator 6 and booster 7 are rotatably supported by the housing 10 via bearings 9, 9 at their notebook portions.
１１は高周波電流発生器で、発生器１１て発生した高周
波電流は、ケーブル１２、カーボンブラシ１３、スリッ
プリング４を介して超音波振動子６の内蔵する磁歪振動
子（図示せず）に伝えられ、超音波振動を発生する。11 is a high frequency current generator, and the high frequency current generated by the generator 11 is transmitted to a magnetostrictive vibrator (not shown) built in the ultrasonic vibrator 6 via a cable 12, a carbon brush 13, and a slip ring 4. , generates ultrasonic vibrations.
１５はスピンドルモーターて、カップリング１６を介し
て超音波振動子６に連結され、超音波振動子６並びにこ
れに結合されたブースター７、ホーン８、短円鋳体ｌを
所定速度（通常５００〜１０．０００ｒｐｍ程度）て回
転させる。１７はスピンドルモーターの回転を制御する
ためのサーボユニットである。A spindle motor 15 is connected to the ultrasonic transducer 6 via a coupling 16, and moves the ultrasonic transducer 6, the booster 7 coupled thereto, the horn 8, and the short circular casting l at a predetermined speed (usually 500~ 10,000 rpm). 17 is a servo unit for controlling the rotation of the spindle motor.
１８は研削加工を施こすべき被研削体、１９は被研削体
１８を保持するためのテーブルで、送り機構（図示せず
）を備えている。Reference numeral 18 denotes a workpiece to be ground, and reference numeral 19 denotes a table for holding the workpiece 18, which is equipped with a feeding mechanism (not shown).
本発明においては超音波振動子６で発生せしめた超音波
振動をブースター７、ホーン８を介して短円鋳体ｌに伝
送して短円鋳体１を振動させフっ短円鋳体１を矢印て示
すように円坊軸を軸として回転させ、砥粒２を被研削体
１８と接触させて研削を行なう。In the present invention, the ultrasonic vibrations generated by the ultrasonic vibrator 6 are transmitted to the short circular casting body 1 via the booster 7 and the horn 8 to vibrate the short circular casting body 1, thereby making the flat circular casting body 1. As shown by the arrow, the abrasive grains 2 are brought into contact with the object to be ground 18 to perform grinding.
回転数は１，０００〜５，０００ ｒｐｍ程度とするの
が適当であり、又超音波の振動数は１５〜６０ ＫＨｚ
程度とするのが望ましく、極めて好適な結果をうろこと
ができる。It is appropriate that the rotational speed is approximately 1,000 to 5,000 rpm, and the frequency of the ultrasonic wave is 15 to 60 KHz.
It is desirable to achieve a certain degree, and very favorable results can be obtained.
（作 用）
上述のようにして研削を行なうと、短円鋳体ｌには径方
向の超音波振動が与えられ、この径方向の振動の厚み方
向のバラツキも小さく、しかも、厚み方向の振動は僅か
であり、この振動に基づく研削抵抗の減少、研削油のキ
ャビテーション効果と短円鋳体１の機械的回転に基づく
研削効果とか複合され、この相乗効果により速い研削速
度と高品質、高精度の研削面が得られるものと思われる
。(Function) When grinding is performed as described above, ultrasonic vibrations are applied to the short circular casting body l in the radial direction, and the variation in the thickness direction of this radial vibration is small, and the vibration in the thickness direction is The reduction in grinding resistance based on this vibration, the cavitation effect of the grinding oil, and the grinding effect based on the mechanical rotation of the short circular casting body 1 are combined, and this synergistic effect results in high grinding speed, high quality, and high precision. It is thought that a ground surface of
（実施例１）
第１図に示すように、鋼製の厚み３４ｍｍ、直径１８０
ｍｍの短円墳体の周面中央に設けた幅２１１１１１、高
さ５１１１１の円環状台座に１０ｍｍ間隔で大きさ１０
０ミクロンのダイヤモンド粒を一体成型で固着した研削
具に、超音波振動子で発生させた２０．５ＫＨｚの超音
波振動をブースター、ホーンを介して伝送しつつ１，０
００ ｒｐｍの速度で回転させ、アルミナ酸の被研削体
の溝加工を、研削油を附与しつつ行ない、＠２ ｒｒｒ
ｒｎ、深さ４ ｍｍ、長さ１００ ｍｍの溝を形成させ
た。(Example 1) As shown in Figure 1, a steel plate with a thickness of 34 mm and a diameter of 180
A circular pedestal with a width of 211111 and a height of 51111 provided at the center of the circumferential surface of a short circular burial mound with a diameter of 10 mm is placed at intervals of 10 mm.
A 20.5 KHz ultrasonic vibration generated by an ultrasonic vibrator is transmitted through a booster and a horn to a grinding tool that has 0 micron diamond grains fixed to it by integral molding.
Rotate at a speed of 00 rpm, groove the alumina acid workpiece while applying grinding oil, @2 rrr
rn, a groove with a depth of 4 mm and a length of 100 mm was formed.
加工所用時間は約２分て、従来法の６０％であり、又精
度は±１０ミクロンで、従来法に比し大幅に向上した。The processing time was approximately 2 minutes, which was 60% of the conventional method, and the accuracy was ±10 microns, which was significantly improved compared to the conventional method.
（実施例２）
実施例１と同一の短円特休の端面外周に、大きさ直径１
０ｍｍのダイヤモンド粒ベレット（粒度は材１０００）
を３４個、接着法で固着した研削具を使用し、実施例１
と同一条件でソーダガラス製の被研削体の表面研摩を行
なった。(Example 2) On the outer periphery of the end face of the same short circular special holiday as in Example 1, a diameter of 1
0mm diamond grain pellet (grain size is material 1000)
Example 1
The surface of the object to be ground made of soda glass was polished under the same conditions as described above.
加工所用時間は従来法の５０％であり、又精度は土０．
５ミクロンで従来法に比し大幅に向上した。The processing time is 50% of the conventional method, and the accuracy is 0.
5 microns, which is a significant improvement over the conventional method.
（効 果） 研削速度、研削精度を大幅に向上させることができる。(effect) Grinding speed and grinding accuracy can be significantly improved.
第１図は本発明の詳細な説明するための第１実なお図中
、ｌは短円涛体、２は砥粒、３は周面、４は端面、５は
台座、６は超音波振動子、７はブースター、８はホーン
、９は軸受、１０はハウジング、１１は高周波電流発生
器、１２はケーブル、１３はカーボンブラシ、１４はス
リップリング、１５はスピンドルモーター、１６はカッ
プリング、１７はサーボユニット、１８は被研削体、１
９はテーブルを示す。FIG. 1 is a first diagram for explaining the present invention in detail, where l is a short circular body, 2 is an abrasive grain, 3 is a peripheral surface, 4 is an end surface, 5 is a pedestal, and 6 is an ultrasonic vibration. 7 is a booster, 8 is a horn, 9 is a bearing, 10 is a housing, 11 is a high frequency current generator, 12 is a cable, 13 is a carbon brush, 14 is a slip ring, 15 is a spindle motor, 16 is a coupling, 17 is the servo unit, 18 is the object to be ground, 1
9 indicates a table.
Claims (2)
その表面に砥粒を固着した短円■体に、該短円■体の共
振周波数と同一の周波数を有する超音波振動を伝送しつ
つ、この短円■体を円■軸を軸として回転させ、上記砥
粒を被研削体と接触させて研削することを特徴とする研
削方法。(1) An ultrasonic wave having the same frequency as the resonant frequency of the short circular body with a thickness-to-diameter ratio of 0.05 to 0.6 and abrasive grains fixed to its surface. A grinding method characterized by rotating this short circular body around a circular axis while transmitting vibrations, bringing the abrasive grains into contact with the object to be ground, and grinding.
許請求の範囲第１項記載の研削方法。(2) The grinding method according to claim 1, wherein the abrasive grains are diamond grains.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25192486A JPS63105879A (en) | 1986-10-24 | 1986-10-24 | Grinding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25192486A JPS63105879A (en) | 1986-10-24 | 1986-10-24 | Grinding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63105879A true JPS63105879A (en) | 1988-05-11 |
Family
ID=17229995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25192486A Pending JPS63105879A (en) | 1986-10-24 | 1986-10-24 | Grinding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63105879A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115674001A (en) * | 2022-10-24 | 2023-02-03 | 苏州三环科技有限公司 | Internal chamfer grinding process for riving knife |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62108994A (en) * | 1985-11-06 | 1987-05-20 | 川崎製鉄株式会社 | Sintering feeder |
-
1986
- 1986-10-24 JP JP25192486A patent/JPS63105879A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62108994A (en) * | 1985-11-06 | 1987-05-20 | 川崎製鉄株式会社 | Sintering feeder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115674001A (en) * | 2022-10-24 | 2023-02-03 | 苏州三环科技有限公司 | Internal chamfer grinding process for riving knife |
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