JPS63105691U - - Google Patents

Info

Publication number
JPS63105691U
JPS63105691U JP20194486U JP20194486U JPS63105691U JP S63105691 U JPS63105691 U JP S63105691U JP 20194486 U JP20194486 U JP 20194486U JP 20194486 U JP20194486 U JP 20194486U JP S63105691 U JPS63105691 U JP S63105691U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
packaging container
container
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20194486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20194486U priority Critical patent/JPS63105691U/ja
Publication of JPS63105691U publication Critical patent/JPS63105691U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の集積回路装置を収納したとこ
ろの包装容器の断面図。第2図は本包装容器を上
からみたところ。第3図は従来の包装容器。 1……集積回路装置の樹脂部、2……リードフ
ラツト部、3……包装容器(樹脂部を固定できる
穴を有している)、4……固定穴、5……従来の
包装容器。
FIG. 1 is a cross-sectional view of a packaging container housing an integrated circuit device of the present invention. Figure 2 shows the packaging container viewed from above. Figure 3 shows a conventional packaging container. DESCRIPTION OF SYMBOLS 1... Resin part of integrated circuit device, 2... Lead flat part, 3... Packaging container (having a hole for fixing the resin part), 4... Fixing hole, 5... Conventional packaging container.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フラツト系パツケージ集積回路装置を運搬する
際用いる包装容器に関して、ケース底面に集積回
路装置の樹脂部が入る穴があいている構造になつ
ており、集積回路のリード部を上面に向け、樹脂
部で集積回路装置を固定し、リード部を包装容器
から浮した状態で収納できることを特徴とした集
積回路装置用容器。
Flat package The packaging container used to transport integrated circuit devices has a structure in which there is a hole in the bottom of the case into which the resin part of the integrated circuit device can be placed. A container for an integrated circuit device, characterized in that the integrated circuit device can be fixed and stored with the lead part floating above the packaging container.
JP20194486U 1986-12-25 1986-12-25 Pending JPS63105691U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20194486U JPS63105691U (en) 1986-12-25 1986-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20194486U JPS63105691U (en) 1986-12-25 1986-12-25

Publications (1)

Publication Number Publication Date
JPS63105691U true JPS63105691U (en) 1988-07-08

Family

ID=31165873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20194486U Pending JPS63105691U (en) 1986-12-25 1986-12-25

Country Status (1)

Country Link
JP (1) JPS63105691U (en)

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