JPS63105331U - - Google Patents
Info
- Publication number
- JPS63105331U JPS63105331U JP20406486U JP20406486U JPS63105331U JP S63105331 U JPS63105331 U JP S63105331U JP 20406486 U JP20406486 U JP 20406486U JP 20406486 U JP20406486 U JP 20406486U JP S63105331 U JPS63105331 U JP S63105331U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- soldering
- mesh member
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
- 239000007769 metal material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20406486U JPS63105331U (pt) | 1986-12-24 | 1986-12-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20406486U JPS63105331U (pt) | 1986-12-24 | 1986-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63105331U true JPS63105331U (pt) | 1988-07-08 |
Family
ID=31169973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20406486U Pending JPS63105331U (pt) | 1986-12-24 | 1986-12-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63105331U (pt) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012064845A (ja) * | 2010-09-17 | 2012-03-29 | Mitsubishi Electric Corp | 半導体装置とその製造方法 |
-
1986
- 1986-12-24 JP JP20406486U patent/JPS63105331U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012064845A (ja) * | 2010-09-17 | 2012-03-29 | Mitsubishi Electric Corp | 半導体装置とその製造方法 |