JPS6310484Y2 - - Google Patents

Description

[Detailed description of the invention] This invention targets measuring instruments, precision instruments, etc. that use optical sensors, and the sensor is mounted directly on a printed circuit board for easy and accurate positioning.
This invention relates to an optical sensor mounting structure that eliminates the need for a special cut ring case.

Conventionally, as shown in Fig. 1, a photo sensor has a light emitting diode 1 and a photo transistor 2 coupled in a coupling case 3 in order to improve detection accuracy.
It was used as an integral coupling.

Therefore, there were the following drawbacks.

(1) Because the originally small sensor is housed in a casing, it becomes bulky.

(2) The cost increases due to the coupling case.

(3) Since the coupling case must be further attached to the base plate of the product, the sensor becomes secondarily positioned relative to the object, reducing accuracy.

(4) Also, when used alone without a coupling case, it is difficult to position it.

The present invention has been devised in view of the above points, and its contents will be explained below based on the illustrated embodiments.

FIGS. 2 to 8 show embodiments in which the optical sensor is mounted on the base plate, and FIGS. 9 to 14 show embodiments in which the optical sensor is coupled to the base plate.

In each of the embodiments described below, substantially the same parts are all given the same numbers.

Regarding the first embodiment (FIGS. 2 and 3).

Reference numeral 10 denotes a printed circuit board, and a lead wire 12 having spring properties of the optical sensor 11 is connected to the printed circuit board 1.
It is soldered 13 to 0.

14 is the main plate with a through hole 15 for receiving and emitting light.
A sensor positioning hole 16 is formed in series with this hole.

When the optical sensor 11 mounted on the printed circuit board 10 is pushed into the sensor positioning hole 16 of the base plate 14 as shown in FIG.
1 is pressed into position within the sensor positioning hole 16.

Therefore, the positioning can be performed easily and accurately.

Regarding the second embodiment (FIGS. 4 and 5).

The feature of this embodiment is that the optical sensor 11 is positioned within the sensor positioning hole 16 as shown in FIG. 5 by utilizing the expansion elasticity caused by bending the lead wire 12 having spring properties.

Regarding the third embodiment (FIGS. 6 to 8).

The feature of this embodiment is that the optical sensor 11 is positioned in the sensor positioning hole 16 using the horizontal pressing force of the lead wire 12 having spring properties.

Regarding the fourth embodiment (Fig. 9).

Reference numeral 17 indicates that when the upper base plate 14 and the lower base plate 14 are connected, the upper optical sensor 11, specifically the light emitting element 11A, and the lower optical sensor 11, specifically the light receiving element 11B, are connected to the optical axis thereof. This is a positioning fitting part for aligning P without shifting.

18 is a sensor target.

Thus, in this embodiment, the optical sensors 11 are attached to the two base plates 14, respectively, and positioning is performed by connecting the base plates 14.

This allows easy positioning of the optical sensor.

Regarding the fifth embodiment (Fig. 10).

The feature of this embodiment is that a light sensor 11 as a light emitting element 11A and a light receiving element 11B are mounted on one base plate 14.
The sensor is a reflection type sensor in which a light sensor 11 and a light sensor 11 are positioned at a certain angle to each other.

Regarding the sixth embodiment (Fig. 11).

The feature of this embodiment is that the light emitting element 11A and the light receiving element 11B are attached to the lower base plate 14, and the light emitting element 11A and the light receiving element 11B are attached to the lower base plate 14.
The point is that the light from A is guided to enter the light receiving element 11B.

Regarding the seventh embodiment (FIGS. 12 to 14).

The feature of this embodiment is that a light emitting element 11A and a light receiving element 11B are mounted in one base plate 14, and FIG. 13 shows a transmission type, and FIG. 14 shows a reflection type.

Therefore, the present invention has the above-mentioned configuration and function, and in particular utilizes the spring properties of the lead wire attached to the optical sensor to easily and accurately position the optical sensor within the sensor positioning hole. It is possible to provide a small and inexpensive product without the need for a special or dedicated coupling case as in the past, and because there is no need to perform secondary positioning with the coupling case, the positioning accuracy can be improved. There are many practical benefits such as improvement.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of the prior art, and FIGS. 2 to 8 show each embodiment in which the optical sensor is mounted on the base plate,
FIGS. 9 to 14 show various embodiments of the coupling of the optical sensor mounted on the base plate. 2 and 3 are longitudinal sectional side views of the first embodiment, with FIG. 2 showing the state before mounting, and FIG. 3 showing the state after mounting. 4 and 5 are longitudinal sectional side views of the second embodiment, with FIG. 4 showing the state before mounting, and FIG. 5 showing the state after mounting. 6 to 8 show the third embodiment, FIG. 6 shows the state before mounting, and FIG.
The figure shows the state after mounting, and FIG. 8 is a view seen from the R direction of FIG. 7. FIG. 9 is a vertical side view of the main part of the fourth embodiment, FIG. 10 is a vertical side view of the fifth embodiment, FIG. 11 is a vertical side view of the sixth embodiment,
12 to 14 show vertical sectional side views of the main parts of the seventh embodiment, FIGS. 12 and 13 show the transmission type, and FIG. 14 shows the reflection type. 10... Printed circuit board, 11... Optical sensor,
12...Lead wire, 14...Main plate, 16...
...Sensor positioning hole, 17...Positioning fitting part.

Claims (1)

[Claims for Utility Model Registration] (1) Soldering 13 a lead wire 12 having spring properties of an optical sensor 11 to a printed circuit board 10
On the other hand, the optical sensor mounting structure is such that the optical sensor 11 is pushed into the sensor positioning hole 16 of the base plate 14 in which the sensor positioning hole 16 is formed using the spring properties of the lead wire 12. (2) A mounting structure for an optical sensor, as set forth in claim 1 of the utility model registration, in which a positioning fitting part 17 is formed at the joint between the printed circuit board 10 and the base plate 14.