JPS63100895U - - Google Patents
Info
- Publication number
- JPS63100895U JPS63100895U JP19552786U JP19552786U JPS63100895U JP S63100895 U JPS63100895 U JP S63100895U JP 19552786 U JP19552786 U JP 19552786U JP 19552786 U JP19552786 U JP 19552786U JP S63100895 U JPS63100895 U JP S63100895U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- heat
- board
- dissipation structure
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19552786U JPS63100895U (ar) | 1986-12-19 | 1986-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19552786U JPS63100895U (ar) | 1986-12-19 | 1986-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63100895U true JPS63100895U (ar) | 1988-06-30 |
Family
ID=31153498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19552786U Pending JPS63100895U (ar) | 1986-12-19 | 1986-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63100895U (ar) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008166531A (ja) * | 2006-12-28 | 2008-07-17 | Densei Lambda Kk | 放熱構造 |
| JP2008232862A (ja) * | 2007-03-20 | 2008-10-02 | Daitron Technology Co Ltd | 半導体素子の検査用治具及び検査装置 |
| JP2012028575A (ja) * | 2010-07-23 | 2012-02-09 | Mitsubishi Electric Corp | 電子機器 |
-
1986
- 1986-12-19 JP JP19552786U patent/JPS63100895U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008166531A (ja) * | 2006-12-28 | 2008-07-17 | Densei Lambda Kk | 放熱構造 |
| JP4494398B2 (ja) * | 2006-12-28 | 2010-06-30 | Ｔｄｋラムダ株式会社 | 放熱構造 |
| JP2008232862A (ja) * | 2007-03-20 | 2008-10-02 | Daitron Technology Co Ltd | 半導体素子の検査用治具及び検査装置 |
| JP2012028575A (ja) * | 2010-07-23 | 2012-02-09 | Mitsubishi Electric Corp | 電子機器 |