JPS629871A - Sand blast construction method - Google Patents

Abstract

PURPOSE:To enable a mold releasing film and/or a processed surface to use even a material with no heat resisting property, by transcribing an adhesive agent layer to the mold releasing film and/or the processed surface under the normal temperature so as to prevent energy from wasting. CONSTITUTION:After the surface of a base mold 1, forming a predetermined rugged shape, is mold release processed, the method, melting a hot melt type adhesive agent 2A to be poured, glues a permeable sheet 3 to be attached from the upper of said agent 2A. The method, after cooling said poured adhesive agent 2A to be solidified, exfoliates the adhesive agent 2A with the sheet 3 from the base mold 1. Next the method, adapting a hot melt type adhesive agent layer 2 to a mold releasing sheet 4, glues the permeable sheet 3 to be attached. The method, impregnating said permeable sheet 3 with a solvent of the adhesive agent 2A and slightly melting a contact surface of the adhesive agent layer 2 with the permeable sheet 3 thereafter exfoliating the permeable sheet 3, transcribes the adhesive agent layer 2 to the mold releasing sheet 4. Said adhesive agent layer 2 is left on a processed surface 5, and the method, exfoliating the mold releasing sheet 4 from the adhesive agent layer 2 and transcribing it to the processed surface 5, sand blast processes the processed surface 5.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a sandblasting method for forming predetermined patterns, characters, etc. on the surface of glass, wood, metal, ceramics, etc. to be treated.

[Background of the invention]

In this type of sandblasting method, sandblasting is performed after the surface to be buried is covered with a protective layer of a predetermined shape, and the surface to be treated other than the protective layer is removed to create a predetermined unevenness on the surface to be treated. Shapes are being formed.

[Conventional technology]

Conventionally, a protective layer was formed by directly printing a predetermined shape on the surface to be treated using ink.

Alternatively, a protective layer has been formed by applying a photosensitive resin to the surface to be treated, masking it in a predetermined shape, exposing it to light, and removing the semi-photosensitive uncured portion.

[Problem that the invention seeks to solve]

However, in the above-mentioned conventional methods, printing is difficult in the former method when the surface to be treated is a curved surface, and in the latter method, the photosensitive resin is expensive and the number of steps is large, which is time-consuming. Furthermore, in the conventional method, the protective film is relatively hard and easily abraded during sandblasting, and furthermore, it is difficult to ensure a sufficient thickness of the printed layer, making it difficult to sandblast the surface to be treated deeply.

[Means for solving problems]

As a means for solving the above-mentioned conventional problems, the present invention provides a step (1) of melting and pouring a hot-melt adhesive (2) after releasing the base (1) surface on which a predetermined uneven shape is formed. , the hot melt adhesive (2) A is used as a base mold (1)
After pouring into the base mold, the transparent sheet (3) is pasted on top of it.
) After cooling and solidifying A, the base shape (
Step 3 of peeling off from 1), the releasable sheet (4) K the hot melt) W adhesive layer (2) is brought into contact with the transparent sheet (
Step 4 of pasting 3), impregnating the transparent sheet (3) with the solvent of the hot melt adhesive (2) A to form the hot melt adhesive (2)! step 5 of slightly dissolving the contact surface of the adhesive layer (2) with the transparent sheet (3) and then peeling off the transparent sheet (3); applying the hot melt adhesive layer (2) to the surface to be treated; (
5) Step 6 of attaching the releasable sheet (4) by contacting K;
The hot melt adhesive layer (2) is applied to the surface to be treated (5) IC.
Step 7 of peeling off the release sheet (4), and then sandblasting the surface to be treated (5) coated with the hot melt adhesive layer (2) into a predetermined shape and hot melting. Step 8 of removing parts other than the mold adhesive layer (2); Step 9 of removing the hot melt adhesive layer (2)
, provides a sandblasting method consisting of the above steps 1, 2, 3° 4.5, 6, 7, and 8.9.

The above method of the present invention will be explained in detail below in the order of steps □
do.

The base mold used in step 1 is made by applying a photosensitive resin to the surface of a metal plate such as a zinc plate or a copper plate, masking it into a predetermined shape, photocuring it, and then removing the uncured portion. A photosensitive resin protective film of a predetermined shape is formed on the surface of a multi-metal plate, the parts of the metal plate surface that are not protected by the protective film are corroded with an etchant, and then the protective film is removed to create an uneven shape on the surface. The surface of the molded plastic is formed into an uneven shape by casting, injection molding, press molding, etc.), or metal,
It is manufactured by carving the surface of plastic, wood, etc., and the surface of the board is coated with silicone resin, fluororesin, etc. and subjected to mold release treatment.

The hot melt adhesive used in step 1 is synthetic rubber and ethylene-vinyl acetate copolymer.

Polyamide, polyvinylidene chloride, acrylic resin.

Urethane resin, rosin, petroleum resin, etc. should be appropriately blended, and K should be a synthetic rubber that melts when heated to a certain temperature and is sticky at room temperature. Adhesives that are mainly used in this category are highly recommended. The adhesive is heated to its melting point, for example, about 180° C., to melt it, and the melt is poured onto the surface of the base mold that has been subjected to the mold release treatment. This situation is shown in FIG. In the figure,
Base 2! ! The surface of the base mold (1) is provided with an uneven shape (1)A, and after the surface of the base mold (1) is subjected to mold release treatment, the melted hot melt adhesive (2)A is poured into the base mold (1). At this time, if the uneven shape (1) A of the substrate (1) is made deep, the thickness of the adhesive layer (2) obtained later can be increased.

In step 2, the base mold (1) KiL-loaded adhesive (
2) Before the molten material A solidifies, a transparent sheet (3) is pasted on top of it as shown in Figure 2. Then, if desired, it is pressed and fixed with a roll (4). Examples of the transparent sheet (3) include paper, nonwoven fabric, and woven fabric.

A porous plastic film or the like is used.

In step 3, the adhesive (
2) After A has solidified, it is peeled off from the base mold (1) together with the transparent sheet (3), and as shown in FIG. ) is formed. As mentioned above, the uneven shape (1) of the base mold (1)
If A is made deep, the thickness of the pressure-sensitive adhesive layer (2) can be made sufficiently large.

In step 4, as shown in FIG.
), the adhesive layer (2) is brought into contact with the transparent sheet (3). The releasable sheet (4) is a sheet having releasable properties such as a polyethylene sheet, a polypropylene sheet, a polyfluorinated vinyl sheet, or a release paper.

In step 5, a transparent sheet) (3) a solvent for K adhesive,
For example, doluol, quijirole, ethyl acetate.

n-butyl acetate, acetone, methyl ethyl ketone.

Methyl isobutyl ketone, cellosolve acetate.

The transparent sheet (3) can be peeled off from the adhesive layer (2) by impregnating it with n-butyl cellosolve or the like and slightly dissolving the contact surface of the adhesive layer (2) with the transparent sheet (3). When the release sheet (3) is peeled off, the adhesive layer (2) is transferred to the release sheet (4) as shown in FIG.

In step 6, the adhesive layer (
2) is brought into contact with the surface to be treated (5) and the releasable sheet (4) is attached. At this time, since the release sheet (4) is soft and the adhesive layer (2) is also soft, even if the surface to be treated (5) is a curved surface as shown in the opening in Figure 6, the release sheet (4) is soft. When 4) is attached, a bond is formed, and since the adhesive layer (2) is sticky at room temperature, no heating is required when attaching the release sheet (4). Note that the surface to be treated (5) includes surfaces of glass, wood, metal, ceramics, plastic, and the like.

In step 7, the release sheet (4) is peeled off from the adhesive layer (2), leaving the adhesive layer (2) on the surface to be treated (5).

In this way, the adhesive layer (2) is further transferred to the treated surface (5) as shown in FIG.

In step 8, sandblasting is performed on the surface to be treated (5) onto which the adhesive layer (2) has been transferred in this manner.

At this time, the adhesive layer (2) protects the surface to be treated (5) from sandblasting, and the portion of the surface to be treated (5) other than the adhesive layer (2) is removed by sandblasting, as shown in Figure 8. A predetermined uneven shape 6D is formed on the surface to be processed (5) as shown in FIG. At this time, the adhesive layer (2) has a sufficiently large film thickness and has viscoelasticity, so it absorbs the impact caused by sandblasting and is hardly abraded by sandblasting, so deep unevenness occurs. It is possible to form a shape of 6°C.

In step 9, the adhesive layer (2) is removed by grinding, washing with an organic solvent, etc., and thus a treated surface (5) on which a predetermined uneven shape @1) as shown in FIG. 9 is formed is obtained.

In step 4, as shown in FIG.
) is formed with an abrasive synthetic resin layer (6) such as silicone resin, urethane resin, acrylic resin, styrene resin, vinyl acetate resin, polyvinyl chloride, polyethylene, polypropylene, etc., which is easily abraded by sandblasting. Good too. When the releasable sheet (4) is peeled off in step 7, the abrasive synthetic resin layer (6) is transferred to the hot-melt adhesive layer (2) as shown in FIG.

The abrasive synthetic resin layer (6) protects the easily deformable adhesive layer (2) to prevent it from deforming or shifting its position, and is easily abraded and removed by sandblasting in step 8. It is.

[Effect]

The present invention has the following effects based on the above configuration.

The uneven shape formed on the base surface can be made arbitrarily deep. Accordingly, it is possible to correspondingly increase the thickness of the hot-melt adhesive layer formed by pouring into the base mold.

Since hot-melt adhesives are heated and melted, they can be poured into a base mold without using a solvent. Since the adhesive layer has tackiness at room temperature, it can be transferred to a release sheet or a surface to be treated at room temperature.

Furthermore, since both the release sheet and the adhesive layer are soft, they can be easily applied to the shape of the surface to be treated, and the adhesive layer absorbs impact during sandblasting due to its viscoelasticity.

〔Effect of the invention〕

Therefore, in the present invention, the organic solvent is only used to a minimum when peeling off the transparent sheet, so the environment in the workplace is hardly deteriorated, and the releasable film of the adhesive layer and the surface to be treated are Since the transfer is carried out at room temperature, there is no need for heating, which prevents wasted energy, and can also be used with release films or materials with no heat resistance on the surface to be treated.Furthermore, the adhesive layer has a sufficient film thickness. Since it is thick and has wear resistance, it is possible to easily deepen the uneven pattern formed on the surface to be treated, and the present invention can be applied even if the surface to be treated is a curved surface.

[Brief explanation of drawings]

The drawings are process explanatory diagrams of the present invention. FIG. 1 is an explanatory diagram of process 1, FIG. 2 is an explanatory diagram of process 2, FIG. 3 is an explanatory diagram of process 3, and FIG. 4 is an explanatory diagram of process 4. Figure 5 is an explanatory diagram of process 5, Figure 6 is an explanatory diagram of process 6, A is an explanatory diagram when applied to a horizontal surface to be treated, and the opening is an explanatory diagram when applied to a curved surface to be treated, and Figure 7 is an explanatory diagram of process 7. 8 is an explanatory diagram of step 8, FIG. 9 is an explanatory diagram of step 9, FIG. 10 is an explanatory diagram of step 4 in another embodiment, and FIG. 11 is an explanatory diagram of step 7 in another embodiment. It is an explanatory diagram. In the figure: (1) Base mold, (2) Adhesive layer, (2
) A...hot melt adhesive, (3)...transparent sheet, (4)...releasable sheet, (5)...surface to be treated, (6) instep abrasion synthetic resin Layer patent applicant Fuji Seisakusho Co., Ltd. 2 8 Zuga 9 M O 10 Zusai 11 Figure

Claims (2)

[Claims] (1) Step 1 of melting and pouring a hot melt adhesive after releasing the base mold surface with a predetermined uneven shape After pouring the hot melt adhesive into the base mold, a transparent sheet is placed on top of the hot melt adhesive. Step 2: The hot-melt adhesive poured into the base mold is cooled and solidified, and then peeled off from the base together with the transparent sheet. Step 3: The hot-melt adhesive layer is brought into contact with the releasable sheet to remove the permeability. Step 4 of pasting the transparent sheet: Impregnate the transparent sheet with the solvent of the hot melt adhesive to slightly dissolve the contact surface of the hot melt adhesive layer with the transparent sheet, and then attach the transparent sheet. Peeling step 5 Step 6 of attaching a release sheet by bringing the hot melt adhesive layer into contact with the surface to be treated Step 6 Peeling off the release sheet while leaving the hot melt adhesive layer on the surface to be treated Step 7 Sandblasting the surface to be treated covered with the hot-melt adhesive layer of a predetermined shape to remove the portion other than the hot-melt adhesive layer.Step 8: Remove the hot-melt adhesive layer. Step 9 Sandblasting method consisting of the above steps 1, 2, 3, 4, 5, 6, 7, 8, and 9 (2) Step 1 of melting and pouring a hot melt adhesive after releasing the base mold surface on which a predetermined uneven shape has been formed After pouring the hot melt adhesive into the base mold, a transparent sheet is placed on top of the hot melt adhesive. Step 2: The hot-melt adhesive poured into the base mold is cooled and solidified, and then peeled off from the base together with the transparent sheet. Step 3: The hot-melt adhesive is applied to the releasable sheet, which has an abrasive synthetic resin layer formed on its surface. Step 4 of adhering the transparent sheet by contacting the mold adhesive layer. Impregnating the transparent sheet with the solvent of the hot melt adhesive to cover the contact surface of the hot melt adhesive layer with the transparent sheet. Step 5 of peeling off the permeable sheet after slightly dissolving it; Step 6 of bringing the hot melt adhesive layer into contact with the surface to be treated and pasting a release sheet; Step 6 of applying the hot melt adhesive layer to an abrasive composition. Step 7 of peeling off the release sheet while leaving it on the surface to be treated together with the resin layer 7 Sandblasting is performed on the surface to be treated that is coated with the hot-melt adhesive layer of a predetermined shape supported by the abrasive synthetic resin layer in this way. Step 8 of removing the portion other than the hot melt adhesive layer together with the abrasive synthetic resin layer Step 9 of removing the hot melt adhesive layer Above steps 1, 2, 3, 4, 5, 6, Sandblasting method consisting of 7, 8, and 9