JPS6298244U - - Google Patents
Info
- Publication number
- JPS6298244U JPS6298244U JP19090985U JP19090985U JPS6298244U JP S6298244 U JPS6298244 U JP S6298244U JP 19090985 U JP19090985 U JP 19090985U JP 19090985 U JP19090985 U JP 19090985U JP S6298244 U JPS6298244 U JP S6298244U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lead
- sealing resin
- lead parts
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Electric Clocks (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19090985U JPS6298244U (enExample) | 1985-12-11 | 1985-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19090985U JPS6298244U (enExample) | 1985-12-11 | 1985-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6298244U true JPS6298244U (enExample) | 1987-06-23 |
Family
ID=31144559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19090985U Pending JPS6298244U (enExample) | 1985-12-11 | 1985-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6298244U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS569756B2 (enExample) * | 1972-03-29 | 1981-03-03 | ||
| JPS5989447A (ja) * | 1982-11-15 | 1984-05-23 | Matsushita Electric Ind Co Ltd | 半導体装置 |
-
1985
- 1985-12-11 JP JP19090985U patent/JPS6298244U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS569756B2 (enExample) * | 1972-03-29 | 1981-03-03 | ||
| JPS5989447A (ja) * | 1982-11-15 | 1984-05-23 | Matsushita Electric Ind Co Ltd | 半導体装置 |