JPS629730Y2 - - Google Patents

Description

[Detailed explanation of the idea] (b) Technical field The present invention relates to a sealing structure for a hybrid integrated circuit.

(B) Background Art Conventionally, the sealing structure of a hybrid integrated circuit is as shown in FIG. A sealing lid 7 was adhered to and sealed with adhesive resin 6 to 5.

In such a structure, the power transistor 4, which generates heat and requires particularly good sealing, is sealed by applying a silicone resin layer 8. However, in such a sealing structure, there is a risk that small holes may be formed due to gas generated inside when the adhesive resin 6 is heated and hardened, and there is a particular drawback that the power transistor 4 cannot be completely sealed.

(c) Disclosure of the invention The present invention realizes a sealing structure for a hybrid integrated circuit that completely eliminates such drawbacks, and a separation wall 18 is provided integrally with a sealing lid 17 to selectively seal only the power semiconductor element. It is characterized by complete resin sealing.

(d) Best Embodiment of the Invention Desired circuit elements such as a chip capacitor 11, a monolithic integrated circuit 12, and a power transistor 14 are placed on a heat sink 13 on a conductive path having a desired pattern on a hybrid integrated circuit board 15 made of aluminum, ceramics, etc. Attach. The feature of the present invention is the sealing lid 17. The sealing lid 17 is made of thermoplastic resin, such as Tetoron-based resin.
The end of the sealing lid 17, which is made of FRPET (trade name) that has been shaped in advance, comes into contact with the peripheral end of the substrate 15 and is bonded with adhesive resin 16. A separation wall 18 is formed on the sealing lid 17 by integral shaping so as to surround the power transistor 14 and reach the substrate 15. This isolation wall 18 and the substrate 1
5 forms an isolation chamber 19 completely separated from other circuit elements. After the sealing lid 17 is attached to the isolation chamber 19, a sealing resin 20 such as epoxy resin is filled into the isolation chamber 19 through a hole provided on the upper surface of the sealing lid 17.

Therefore, in the sealing structure of the present invention, it is possible to completely seal the power transistor 14, which requires particularly good sealing, with an epoxy resin or the like.

(e) Effects of the present invention According to the present invention, circuit elements that can be easily sealed using the conventional simple sealing structure can be left as they are, while power transistors, etc. that require good sealing can be selectively molded using a complete resin mold. can be done. As a result, the reliability of power semiconductor elements that generate heat can be greatly improved, and it is possible to incorporate them into hybrid integrated circuits in the form of pellets.

[Brief explanation of the drawing]

FIG. 1 is a sectional view illustrating a conventional example, and FIG. 2 is a sectional view illustrating the present invention. Explanation of main figure numbers, 14 is a power transistor,
15 is a hybrid integrated circuit board, 17 is a sealing lid, 18 is an isolation wall, 19 is an isolation chamber, 20 is a sealing resin, and 21 is an external lead.

Claims (1)

[Scope of utility model registration request] In a hybrid integrated circuit in which a power semiconductor element and other circuit elements are provided on a hybrid integrated circuit board and sealed using a sealing lid, an isolation wall is provided integrally with the sealing lid so as to surround the power semiconductor element. A sealing structure for a hybrid integrated circuit, characterized in that an isolation chamber formed by the isolation wall and the substrate is filled with a sealing resin.