JPS629641B2 - - Google Patents
Info
- Publication number
- JPS629641B2 JPS629641B2 JP54014000A JP1400079A JPS629641B2 JP S629641 B2 JPS629641 B2 JP S629641B2 JP 54014000 A JP54014000 A JP 54014000A JP 1400079 A JP1400079 A JP 1400079A JP S629641 B2 JPS629641 B2 JP S629641B2
- Authority
- JP
- Japan
- Prior art keywords
- friction material
- copper
- mounting plate
- bonding
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002783 friction material Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 24
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 229910052742 iron Inorganic materials 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 5
- 238000001272 pressureless sintering Methods 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims 2
- 239000010949 copper Substances 0.000 description 13
- 238000005245 sintering Methods 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000002156 mixing Methods 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Braking Arrangements (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Powder Metallurgy (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1400079A JPS55107702A (en) | 1979-02-09 | 1979-02-09 | Pressureless bonding method of friction material and adhesive agent used for this |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1400079A JPS55107702A (en) | 1979-02-09 | 1979-02-09 | Pressureless bonding method of friction material and adhesive agent used for this |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55107702A JPS55107702A (en) | 1980-08-19 |
| JPS629641B2 true JPS629641B2 (US20030220297A1-20031127-C00074.png) | 1987-03-02 |
Family
ID=11848946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1400079A Granted JPS55107702A (en) | 1979-02-09 | 1979-02-09 | Pressureless bonding method of friction material and adhesive agent used for this |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55107702A (US20030220297A1-20031127-C00074.png) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8305189D0 (en) * | 1983-02-24 | 1983-03-30 | Lucas Ind Plc | Friction element |
| JPH0756310B2 (ja) * | 1985-04-23 | 1995-06-14 | 日立化成工業株式会社 | 摩擦材 |
| JP2859888B2 (ja) * | 1989-04-21 | 1999-02-24 | 東芝タンガロイ株式会社 | 二層構造焼結摩擦材 |
| CN111001815A (zh) * | 2019-11-29 | 2020-04-14 | 南通伊思帝摩擦材料有限公司 | 连续式无压力烧结的干式铜基摩擦片的制备方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501330A (US20030220297A1-20031127-C00074.png) * | 1973-05-11 | 1975-01-08 |
-
1979
- 1979-02-09 JP JP1400079A patent/JPS55107702A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501330A (US20030220297A1-20031127-C00074.png) * | 1973-05-11 | 1975-01-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55107702A (en) | 1980-08-19 |
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