JPS629385U - - Google Patents
Info
- Publication number
- JPS629385U JPS629385U JP10097485U JP10097485U JPS629385U JP S629385 U JPS629385 U JP S629385U JP 10097485 U JP10097485 U JP 10097485U JP 10097485 U JP10097485 U JP 10097485U JP S629385 U JPS629385 U JP S629385U
- Authority
- JP
- Japan
- Prior art keywords
- pin
- package
- probe pin
- socket
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
Description
第１図は本考案の一実施例を示す解放図の平面
図、第２図は本考案の圧着時の側面図、第３図は
プローブピンとリードの接続状態を示す図、第４
図は従来のＰＧＡ用ソケツトの図、第５図は従来
のソケツトにパツケージを挿入した時の電極とリ
ードの位置を示す図、第６図はソケツトを挿入し
固定した時の電極とリードの位置を示す図、第７
図は第５図の断面図、第８図は第６図の断面図で
ある。
１……半導体集積回路装置のパツケージ、２…
…リード、３……プローブピン、４……外部ピン
、５……支持台、６……スプリング、７……ホル
ダー、８……レバー、９……押え、１０……電極
、１１……ガイド、１２……ガイド穴、１３……
ホルダー、１４……スプリング、１５……コンタ
クトピン。
Fig. 1 is a plan view of an open view showing an embodiment of the present invention, Fig. 2 is a side view of the present invention during crimping, Fig. 3 is a diagram showing the connection state of the probe pin and lead, Fig. 4
The figure shows a conventional PGA socket, Figure 5 shows the position of the electrodes and leads when the package is inserted into the conventional socket, and Figure 6 shows the position of the electrodes and leads when the socket is inserted and fixed. Figure 7 showing
The figure is a sectional view of FIG. 5, and FIG. 8 is a sectional view of FIG. 6. 1... Package of semiconductor integrated circuit device, 2...
... Lead, 3 ... Probe pin, 4 ... External pin, 5 ... Support stand, 6 ... Spring, 7 ... Holder, 8 ... Lever, 9 ... Presser, 10 ... Electrode, 11 ... Guide , 12... guide hole, 13...
Holder, 14...spring, 15...contact pin.
Claims (1)
おいて、パツケージのリード先端部から電気的導
通を得るプローブピンと、パツケージを保持しそ
のリード先端部をプローブピンに該ピンの軸線方
向から当接させる機構と、パツケージのリードを
無負荷状態でプローブピンより完全解放する機構
とによつて構成されることを特徴とするＰＧＡタ
イプ半導体集積回路装置用ソケツト。 A socket for a PGA type semiconductor integrated circuit device includes a probe pin that obtains electrical continuity from the lead tip of the package, a mechanism that holds the package and brings the lead tip into contact with the probe pin from the axial direction of the pin, and a mechanism that holds the package and brings the lead tip into contact with the probe pin from the axial direction of the pin. 1. A socket for a PGA type semiconductor integrated circuit device, comprising a mechanism for completely releasing a lead from a probe pin in a no-load state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10097485U JPS629385U (en) | 1985-07-02 | 1985-07-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10097485U JPS629385U (en) | 1985-07-02 | 1985-07-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS629385U true JPS629385U (en) | 1987-01-20 |
Family
ID=30971288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10097485U Pending JPS629385U (en) | 1985-07-02 | 1985-07-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS629385U (en) |
-
1985
- 1985-07-02 JP JP10097485U patent/JPS629385U/ja active Pending