JPH0271982U - - Google Patents
Info
- Publication number
- JPH0271982U JPH0271982U JP15270788U JP15270788U JPH0271982U JP H0271982 U JPH0271982 U JP H0271982U JP 15270788 U JP15270788 U JP 15270788U JP 15270788 U JP15270788 U JP 15270788U JP H0271982 U JPH0271982 U JP H0271982U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- integrated circuit
- circuit device
- semiconductor integrated
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 4
- 210000000078 claw Anatomy 0.000 description 1
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Connecting Device With Holders (AREA)
Description
第１図は本考案の一実施例のＩＣソケツトの斜
視図、第２図は第１図のＩＣソケツト構造の要部
を示す斜視図、第３図は第１図のＩＣソケツトの
使用例を示す断面図、第４図は従来のＩＣソケツ
トの一例を示す斜視図である。
１……ＩＣソケツト本体、２……フレーム、３
……ＩＣ用コンタクト、４……接地用コンタクト
、５……導体部、６……カバー、７……切欠き部
、８……ツメ、９，１３……ＤＩＰ型ＩＣ、１０
……ＩＣのピン、１１……従来のＩＣソケツト、
１２……コンタクト。
Fig. 1 is a perspective view of an IC socket according to an embodiment of the present invention, Fig. 2 is a perspective view showing the main parts of the IC socket structure of Fig. 1, and Fig. 3 is an example of the use of the IC socket of Fig. 1. The sectional view shown in FIG. 4 is a perspective view showing an example of a conventional IC socket. 1...IC socket body, 2...frame, 3
...IC contact, 4...Grounding contact, 5...Conductor part, 6...Cover, 7...Notch part, 8...Claw, 9, 13...DIP type IC, 10
...IC pin, 11... Conventional IC socket,
12...Contact.
Claims (1)
タクトが配列されたフレームを設け、前記コンタ
クトのうち所定のコンタクトと電気的に接続され
た導体部を前記フレーム上に設け、前記半導体部
と接触しかつ挿入された前記半導体集積回路装置
を覆うカバーを設けたことを特徴とする半導体集
積回路装置ソケツト。 A frame is provided in which contacts into which pins of a semiconductor integrated circuit device are inserted are arranged, and a conductor portion electrically connected to a predetermined contact among the contacts is provided on the frame, and a conductor portion is provided on the frame and is in contact with the semiconductor portion. A semiconductor integrated circuit device socket characterized in that a cover is provided to cover the inserted semiconductor integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15270788U JPH0271982U (en) | 1988-11-22 | 1988-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15270788U JPH0271982U (en) | 1988-11-22 | 1988-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0271982U true JPH0271982U (en) | 1990-05-31 |
Family
ID=31427878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15270788U Pending JPH0271982U (en) | 1988-11-22 | 1988-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0271982U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011078350A1 (en) * | 2009-12-24 | 2011-06-30 | 京セラ株式会社 | Imaging device |
-
1988
- 1988-11-22 JP JP15270788U patent/JPH0271982U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011078350A1 (en) * | 2009-12-24 | 2011-06-30 | 京セラ株式会社 | Imaging device |
| EP2518999A1 (en) * | 2009-12-24 | 2012-10-31 | Kyocera Corporation | Imaging device |
| JP5324667B2 (en) * | 2009-12-24 | 2013-10-23 | 京セラ株式会社 | Imaging device |
| EP2518999A4 (en) * | 2009-12-24 | 2014-01-01 | Kyocera Corp | Imaging device |
| US8866067B2 (en) | 2009-12-24 | 2014-10-21 | Kyocera Corporation | Imaging device with an imaging element and an electronic component |