JPH0328684U - - Google Patents

Info

Publication number
JPH0328684U
JPH0328684U JP8972189U JP8972189U JPH0328684U JP H0328684 U JPH0328684 U JP H0328684U JP 8972189 U JP8972189 U JP 8972189U JP 8972189 U JP8972189 U JP 8972189U JP H0328684 U JPH0328684 U JP H0328684U
Authority
JP
Japan
Prior art keywords
socket
integrated circuit
semiconductor integrated
circuit device
compatible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8972189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8972189U priority Critical patent/JPH0328684U/ja
Publication of JPH0328684U publication Critical patent/JPH0328684U/ja
Pending legal-status Critical Current

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Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の第1の実施例の中継ソケツト
を示す断面図、第2図は第1図の断面図、第3図
は本考案の第2の実施例の中継ソケツトを示す断
面図、第4図は第3図の正面図、第5図は従来の
中継構造を示す断面図、第6図は第5図の正面図
である。 1,21……SOP IC、2,8,13,1
9,22,26……ソケツト、5,16……中継
ソケツト、3,6,9,14,17,20,23
,27……引き出しピン、4,7,12,15,
25……コンタクトピン、24……被膜導線。
Fig. 1 is a cross-sectional view showing a relay socket according to a first embodiment of the present invention, Fig. 2 is a cross-sectional view of Fig. 1, and Fig. 3 is a cross-sectional view showing a relay socket according to a second embodiment of the present invention. , FIG. 4 is a front view of FIG. 3, FIG. 5 is a sectional view showing a conventional relay structure, and FIG. 6 is a front view of FIG. 5. 1, 21...SOP IC, 2, 8, 13, 1
9, 22, 26...Socket, 5, 16...Relay socket, 3, 6, 9, 14, 17, 20, 23
, 27...Drawer pin, 4, 7, 12, 15,
25...Contact pin, 24...Coated conductor.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 第1の半導体集積回路装置に適合する第1のソ
ケツトと、第2の半導体集積回路装置に適合する
第2のソケツトとを電気的及び機械的に着脱でき
るように接続するピン配置を備えていることを特
徴とする中継ソケツト。
A pin arrangement is provided for electrically and mechanically removably connecting a first socket compatible with the first semiconductor integrated circuit device and a second socket compatible with the second semiconductor integrated circuit device. A relay socket characterized by:
JP8972189U 1989-07-28 1989-07-28 Pending JPH0328684U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8972189U JPH0328684U (en) 1989-07-28 1989-07-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8972189U JPH0328684U (en) 1989-07-28 1989-07-28

Publications (1)

Publication Number Publication Date
JPH0328684U true JPH0328684U (en) 1991-03-22

Family

ID=31639290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8972189U Pending JPH0328684U (en) 1989-07-28 1989-07-28

Country Status (1)

Country Link
JP (1) JPH0328684U (en)

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