JPS6289156U - - Google Patents
Info
- Publication number
- JPS6289156U JPS6289156U JP18173285U JP18173285U JPS6289156U JP S6289156 U JPS6289156 U JP S6289156U JP 18173285 U JP18173285 U JP 18173285U JP 18173285 U JP18173285 U JP 18173285U JP S6289156 U JPS6289156 U JP S6289156U
- Authority
- JP
- Japan
- Prior art keywords
- contact pin
- semiconductor device
- package
- conductive plate
- lead terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
Landscapes
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Description
第１図は本考案に係る半導体装置の実施例を示
す部分切欠斜視図、第２図は上記半導体装置の断
面図、第３図は外部機器の装着部を示す斜視図、
第４図は半導体装置の装着過程を示す斜視図、第
５図は半導体装置の装着状態を示す断面図である
。
１……半導体装置、２……リード端子、３……
半導体素子、４……パツケージ、５……導電性板
、８……接続孔、９……接触ピン、１０……付勢
部材、１１……連通孔、１５……外部コネクタ。
FIG. 1 is a partially cutaway perspective view showing an embodiment of a semiconductor device according to the present invention, FIG. 2 is a cross-sectional view of the semiconductor device, and FIG. 3 is a perspective view showing a mounting portion of an external device.
FIG. 4 is a perspective view showing the mounting process of the semiconductor device, and FIG. 5 is a sectional view showing the mounting state of the semiconductor device. 1...Semiconductor device, 2...Lead terminal, 3...
Semiconductor element, 4... Package, 5... Conductive plate, 8... Connection hole, 9... Contact pin, 10... Biasing member, 11... Communication hole, 15... External connector.
Claims (1)
導体素子を保護するパツケージとを備えた半導体
装置において、上記リード端子に電気的に接続さ
れるとともにパツケージ内において昇降自在に配
設された接触ピンと、外部コネクタの先端部が嵌
入される連通孔が上記接触ピンに対応する位置に
形成されてなる導電性板と、上記接触ピンを導電
性板に付勢する付勢部材とを設けたことを特徴と
する半導体装置。 In a semiconductor device comprising a semiconductor element having a protruding lead terminal and a package for protecting the semiconductor element, a contact pin electrically connected to the lead terminal and disposed so as to be movable up and down within the package; A conductive plate having a communication hole into which the tip of the external connector is inserted is formed at a position corresponding to the contact pin, and a biasing member biasing the contact pin against the conductive plate. semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18173285U JPS6289156U (en) | 1985-11-25 | 1985-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18173285U JPS6289156U (en) | 1985-11-25 | 1985-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289156U true JPS6289156U (en) | 1987-06-08 |
Family
ID=31126875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18173285U Pending JPS6289156U (en) | 1985-11-25 | 1985-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289156U (en) |
-
1985
- 1985-11-25 JP JP18173285U patent/JPS6289156U/ja active Pending