JPS629287U - - Google Patents
Info
- Publication number
- JPS629287U JPS629287U JP1985025109U JP2510985U JPS629287U JP S629287 U JPS629287 U JP S629287U JP 1985025109 U JP1985025109 U JP 1985025109U JP 2510985 U JP2510985 U JP 2510985U JP S629287 U JPS629287 U JP S629287U
- Authority
- JP
- Japan
- Prior art keywords
- light
- insulating substrate
- conductive wires
- view
- emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985025109U JPH036938Y2 (US07922777-20110412-C00004.png) | 1985-02-22 | 1985-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985025109U JPH036938Y2 (US07922777-20110412-C00004.png) | 1985-02-22 | 1985-02-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS629287U true JPS629287U (US07922777-20110412-C00004.png) | 1987-01-20 |
| JPH036938Y2 JPH036938Y2 (US07922777-20110412-C00004.png) | 1991-02-21 |
Family
ID=30824955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985025109U Expired JPH036938Y2 (US07922777-20110412-C00004.png) | 1985-02-22 | 1985-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH036938Y2 (US07922777-20110412-C00004.png) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004038289A1 (ja) * | 2002-10-25 | 2004-05-06 | Moriyama Sangyo Kabushiki Kaisha | 発光モジュール |
| WO2009054048A1 (ja) * | 2007-10-23 | 2009-04-30 | Kazuhiro Miyashita | 発光ダイオードを光源とする軟性発光帯 |
| JP2010529645A (ja) * | 2007-06-01 | 2010-08-26 | ワッカー ケミー アクチエンゲゼルシャフト | 発光体を有するシリコン成形部材 |
| WO2010119872A1 (ja) * | 2009-04-13 | 2010-10-21 | パナソニック電工株式会社 | Ｌｅｄユニット |
| JP2011090849A (ja) * | 2009-10-21 | 2011-05-06 | Atex Co Ltd | フレキシブル発光装置およびその製造方法 |
| JP2014139934A (ja) * | 2005-10-28 | 2014-07-31 | Proteras Co Ltd | フレキシブル発光体 |
-
1985
- 1985-02-22 JP JP1985025109U patent/JPH036938Y2/ja not_active Expired
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004038289A1 (ja) * | 2002-10-25 | 2004-05-06 | Moriyama Sangyo Kabushiki Kaisha | 発光モジュール |
| JP2014139934A (ja) * | 2005-10-28 | 2014-07-31 | Proteras Co Ltd | フレキシブル発光体 |
| JP2020025108A (ja) * | 2005-10-28 | 2020-02-13 | 株式会社テラスホールディングス | フレキシブル発光体 |
| JP2010529645A (ja) * | 2007-06-01 | 2010-08-26 | ワッカー ケミー アクチエンゲゼルシャフト | 発光体を有するシリコン成形部材 |
| WO2009054048A1 (ja) * | 2007-10-23 | 2009-04-30 | Kazuhiro Miyashita | 発光ダイオードを光源とする軟性発光帯 |
| WO2010119872A1 (ja) * | 2009-04-13 | 2010-10-21 | パナソニック電工株式会社 | Ｌｅｄユニット |
| US8592830B2 (en) | 2009-04-13 | 2013-11-26 | Panasonic Corporation | LED unit |
| JP2011090849A (ja) * | 2009-10-21 | 2011-05-06 | Atex Co Ltd | フレキシブル発光装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH036938Y2 (US07922777-20110412-C00004.png) | 1991-02-21 |
