JPS6292661U - - Google Patents

Info

Publication number
JPS6292661U
JPS6292661U JP18422885U JP18422885U JPS6292661U JP S6292661 U JPS6292661 U JP S6292661U JP 18422885 U JP18422885 U JP 18422885U JP 18422885 U JP18422885 U JP 18422885U JP S6292661 U JPS6292661 U JP S6292661U
Authority
JP
Japan
Prior art keywords
solid
image sensor
state image
storage recess
sensor storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18422885U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18422885U priority Critical patent/JPS6292661U/ja
Publication of JPS6292661U publication Critical patent/JPS6292661U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案固体撮像装置の実施の一例を示
す断面図、第２図は背景技術を示す分解斜視図で
ある。 符号の説明、１……セラミツク基板、２……固
体撮像素子収納凹部、４……固体撮像素子、７…
…シールガラス、８……吸収剤を含有する接着剤
。 FIG. 1 is a sectional view showing an example of the implementation of the solid-state imaging device of the present invention, and FIG. 2 is an exploded perspective view showing the background art. Explanation of symbols: 1...Ceramic substrate, 2...Solid-state image sensor housing recess, 4...Solid-state image sensor, 7...
...Sealing glass, 8...Adhesive containing absorbent.

Claims (1)

【実用新案登録請求の範囲】 表面に固体撮像素子収納凹部が形成されたセラ
ミツク基板の固体撮像素子収納凹部内に半導体か
らなる固体撮像素子を収納し、 セラミツク基板表面に上記固体撮像素子収納凹
部を閉塞するシールガラスを接着剤を介して固着
してなる固体撮像装置において、 上記接着剤が加熱エネルギーの吸収係数が上記
半導体のそれよりも大きな吸収剤を含有している ことを特徴とする固体撮像装置。[Scope of Claim for Utility Model Registration] A solid-state image sensor made of a semiconductor is housed in a solid-state image sensor storage recess of a ceramic substrate having a solid-state image sensor storage recess formed on the surface thereof, and the solid-state image sensor storage recess is formed on the surface of the ceramic substrate. A solid-state imaging device formed by fixing seal glass to be closed with an adhesive, wherein the adhesive contains an absorbent having a heating energy absorption coefficient larger than that of the semiconductor. Device.
JP18422885U 1985-11-29 1985-11-29 Pending JPS6292661U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18422885U JPS6292661U (en) 1985-11-29 1985-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18422885U JPS6292661U (en) 1985-11-29 1985-11-29

Publications (1)

Publication Number Publication Date
JPS6292661U true JPS6292661U (en) 1987-06-13

Family

ID=31131703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18422885U Pending JPS6292661U (en) 1985-11-29 1985-11-29

Country Status (1)

Country Link
JP (1) JPS6292661U (en)

Similar Documents

Publication Publication Date Title
JPS6292661U (en)
JPS6292660U (en)
JPS61177395U (en)
JPS6294650U (en)
JPS6289146U (en)
JPS597356U (en) solar heat collector
JPS5850650U (en) Solar heating nursery frame
JPS6253598U (en)
JPS5918447U (en) Amorphous silicon field effect transistor
JPS62192655U (en)
JPS62184760U (en)
JPH022852U (en)
JPS603432U (en) photodetector
JPS6294651U (en)
JPH043325U (en)
JPS6339204U (en)
JPS61112660U (en)
JPS6287461U (en)
JPS6144530U (en) Pyroelectric infrared sensor container
JPS6292657U (en)
JPS6260051U (en)
JPS6268251U (en)
JPH034232U (en)
JPS6441160U (en)
JPS61128066U (en)