JPS6292660U - - Google Patents

Info

Publication number
JPS6292660U
JPS6292660U JP18422785U JP18422785U JPS6292660U JP S6292660 U JPS6292660 U JP S6292660U JP 18422785 U JP18422785 U JP 18422785U JP 18422785 U JP18422785 U JP 18422785U JP S6292660 U JPS6292660 U JP S6292660U
Authority
JP
Japan
Prior art keywords
solid
state imaging
imaging device
storage recess
device storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18422785U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18422785U priority Critical patent/JPS6292660U/ja
Publication of JPS6292660U publication Critical patent/JPS6292660U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案固体撮像装置の実施の一例を示
す断面図、第２図は背景技術を示す分解斜視図で
ある。 符号の説明、１……セラミツク基板、２……固
体撮像素子収納凹部、４……固体撮像素子、１０
……酸化物との密着性の良い金属半田、１１……
シールガラス。 FIG. 1 is a sectional view showing an example of the implementation of the solid-state imaging device of the present invention, and FIG. 2 is an exploded perspective view showing the background art. Explanation of symbols, 1...Ceramic substrate, 2...Solid-state image sensor storage recess, 4...Solid-state image sensor, 10
...Metal solder with good adhesion to oxides, 11...
seal glass.

Claims (1)

【実用新案登録請求の範囲】 表面に固体撮像素子収納凹部を有し該固体撮像
素子収納凹部内に固体撮像責子が収納されたセラ
ミツク基板に上記固体撮像素子収納凹部を閉塞す
るようにシールガラスを固着した固体撮像装置に
おいて、 上記シールガラスを酸化物との密着性の良い金
属半田を介してセラミツク基板に固着した ことを特徴とする固体撮像装置。[Claim for Utility Model Registration] A ceramic substrate having a solid-state imaging device storage recess on its surface and a solid-state imaging sensor stored in the solid-state imaging device storage recess, and a sealing glass so as to close the solid-state imaging device storage recess. What is claimed is: 1. A solid-state imaging device in which the sealing glass is fixed to a ceramic substrate via a metal solder having good adhesion to an oxide.
JP18422785U 1985-11-29 1985-11-29 Pending JPS6292660U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18422785U JPS6292660U (en) 1985-11-29 1985-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18422785U JPS6292660U (en) 1985-11-29 1985-11-29

Publications (1)

Publication Number Publication Date
JPS6292660U true JPS6292660U (en) 1987-06-13

Family

ID=31131701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18422785U Pending JPS6292660U (en) 1985-11-29 1985-11-29

Country Status (1)

Country Link
JP (1) JPS6292660U (en)

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