JPS6294650U - - Google Patents

Info

Publication number
JPS6294650U
JPS6294650U JP1985186602U JP18660285U JPS6294650U JP S6294650 U JPS6294650 U JP S6294650U JP 1985186602 U JP1985186602 U JP 1985186602U JP 18660285 U JP18660285 U JP 18660285U JP S6294650 U JPS6294650 U JP S6294650U
Authority
JP
Japan
Prior art keywords
solid
imaging device
state imaging
resin
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985186602U
Other languages
Japanese (ja)
Other versions
JPH066511Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985186602U priority Critical patent/JPH066511Y2/en
Publication of JPS6294650U publication Critical patent/JPS6294650U/ja
Application granted granted Critical
Publication of JPH066511Y2 publication Critical patent/JPH066511Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は本考案固体撮像装置の第1
の実施例を示すもので、第1図は分解斜視図、第
2図は断面図、第3図は本考案固体撮像装置の第
2の実施例を示す断面図、第4図は本考案固体撮
像装置の第3の実施例を示す断面図、第5図は本
考案固体撮像装置の第4の実施例を示す断面図、
第6図は本考案固体撮像装置の第5の実施例を示
す断面図、第7図は本考案固体撮像装置の第6の
実施例を示す断面図、第8図は従来例を示す分解
斜視図である。 符号の説明、1,1a,1b,17……基板、
2,18……固体撮像装素子収納凹部、4,19
……固体撮像素子、9,9a,9b,9c,24
……シールガラス、10,25……樹脂、11〜
13,15,23……樹脂溜り。
Figures 1 and 2 show the first diagram of the solid-state imaging device of the present invention.
Fig. 1 is an exploded perspective view, Fig. 2 is a sectional view, Fig. 3 is a sectional view showing a second embodiment of the solid-state imaging device of the present invention, and Fig. 4 is an exploded perspective view of the solid-state imaging device of the present invention. A sectional view showing a third embodiment of the imaging device; FIG. 5 is a sectional view showing a fourth embodiment of the solid-state imaging device of the present invention;
FIG. 6 is a cross-sectional view showing a fifth embodiment of the solid-state imaging device of the present invention, FIG. 7 is a cross-sectional view of the sixth embodiment of the solid-state imaging device of the present invention, and FIG. 8 is an exploded perspective view showing a conventional example. It is a diagram. Explanation of symbols, 1, 1a, 1b, 17...Substrate,
2, 18... Solid-state imaging device storage recess, 4, 19
...solid-state image sensor, 9, 9a, 9b, 9c, 24
...Seal glass, 10,25...Resin, 11~
13, 15, 23...Resin pool.

Claims (1)

【実用新案登録請求の範囲】 表面に形成された固体撮像素子収納凹部に固体
撮像素子が収納された基板に上記固体撮像素子収
納凹部を閉塞するシールガラスを樹脂を介して固
着した固体撮像装置において、 上記基板表面とシールガラスとの間に上記樹脂
で満たされた樹脂溜りを設けた ことを特徴とする固体撮像装置。
[Claims for Utility Model Registration] A solid-state imaging device in which a sealing glass for closing the solid-state imaging device storage recess is fixed to a substrate on which the solid-state imaging device is stored in a solid-state imaging device storage recess formed on the surface via a resin. , A solid-state imaging device characterized in that a resin reservoir filled with the resin is provided between the surface of the substrate and the seal glass.
JP1985186602U 1985-12-03 1985-12-03 Solid-state imaging device Expired - Lifetime JPH066511Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985186602U JPH066511Y2 (en) 1985-12-03 1985-12-03 Solid-state imaging device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985186602U JPH066511Y2 (en) 1985-12-03 1985-12-03 Solid-state imaging device

Publications (2)

Publication Number Publication Date
JPS6294650U true JPS6294650U (en) 1987-06-17
JPH066511Y2 JPH066511Y2 (en) 1994-02-16

Family

ID=31136308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985186602U Expired - Lifetime JPH066511Y2 (en) 1985-12-03 1985-12-03 Solid-state imaging device

Country Status (1)

Country Link
JP (1) JPH066511Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641145U (en) * 1992-10-28 1994-05-31 株式会社巴川製紙所 Lid for sealing electronic components
JP2017045842A (en) * 2015-08-26 2017-03-02 京セラ株式会社 Package for housing semiconductor element and semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5652451A (en) * 1979-10-05 1981-05-11 Toshiba Corp Interruption display system
JPS5665656U (en) * 1979-10-23 1981-06-01
JPS56144561A (en) * 1980-04-11 1981-11-10 Hitachi Ltd Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5652451A (en) * 1979-10-05 1981-05-11 Toshiba Corp Interruption display system
JPS5665656U (en) * 1979-10-23 1981-06-01
JPS56144561A (en) * 1980-04-11 1981-11-10 Hitachi Ltd Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641145U (en) * 1992-10-28 1994-05-31 株式会社巴川製紙所 Lid for sealing electronic components
JP2017045842A (en) * 2015-08-26 2017-03-02 京セラ株式会社 Package for housing semiconductor element and semiconductor device

Also Published As

Publication number Publication date
JPH066511Y2 (en) 1994-02-16

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