JPS6294650U - - Google Patents
Info
- Publication number
- JPS6294650U JPS6294650U JP1985186602U JP18660285U JPS6294650U JP S6294650 U JPS6294650 U JP S6294650U JP 1985186602 U JP1985186602 U JP 1985186602U JP 18660285 U JP18660285 U JP 18660285U JP S6294650 U JPS6294650 U JP S6294650U
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- resin
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 239000005394 sealing glass Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Description
第1図及び第2図は本考案固体撮像装置の第1
の実施例を示すもので、第1図は分解斜視図、第
2図は断面図、第3図は本考案固体撮像装置の第
2の実施例を示す断面図、第4図は本考案固体撮
像装置の第3の実施例を示す断面図、第5図は本
考案固体撮像装置の第4の実施例を示す断面図、
第6図は本考案固体撮像装置の第5の実施例を示
す断面図、第7図は本考案固体撮像装置の第6の
実施例を示す断面図、第8図は従来例を示す分解
斜視図である。
符号の説明、1,1a,1b,17……基板、
2,18……固体撮像装素子収納凹部、4,19
……固体撮像素子、9,9a,9b,9c,24
……シールガラス、10,25……樹脂、11〜
13,15,23……樹脂溜り。
Figures 1 and 2 show the first diagram of the solid-state imaging device of the present invention.
Fig. 1 is an exploded perspective view, Fig. 2 is a sectional view, Fig. 3 is a sectional view showing a second embodiment of the solid-state imaging device of the present invention, and Fig. 4 is an exploded perspective view of the solid-state imaging device of the present invention. A sectional view showing a third embodiment of the imaging device; FIG. 5 is a sectional view showing a fourth embodiment of the solid-state imaging device of the present invention;
FIG. 6 is a cross-sectional view showing a fifth embodiment of the solid-state imaging device of the present invention, FIG. 7 is a cross-sectional view of the sixth embodiment of the solid-state imaging device of the present invention, and FIG. 8 is an exploded perspective view showing a conventional example. It is a diagram. Explanation of symbols, 1, 1a, 1b, 17...Substrate,
2, 18... Solid-state imaging device storage recess, 4, 19
...solid-state image sensor, 9, 9a, 9b, 9c, 24
...Seal glass, 10,25...Resin, 11~
13, 15, 23...Resin pool.
Claims (1)
撮像素子が収納された基板に上記固体撮像素子収
納凹部を閉塞するシールガラスを樹脂を介して固
着した固体撮像装置において、 上記基板表面とシールガラスとの間に上記樹脂
で満たされた樹脂溜りを設けた ことを特徴とする固体撮像装置。[Claims for Utility Model Registration] A solid-state imaging device in which a sealing glass for closing the solid-state imaging device storage recess is fixed to a substrate on which the solid-state imaging device is stored in a solid-state imaging device storage recess formed on the surface via a resin. , A solid-state imaging device characterized in that a resin reservoir filled with the resin is provided between the surface of the substrate and the seal glass.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985186602U JPH066511Y2 (en) | 1985-12-03 | 1985-12-03 | Solid-state imaging device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985186602U JPH066511Y2 (en) | 1985-12-03 | 1985-12-03 | Solid-state imaging device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6294650U true JPS6294650U (en) | 1987-06-17 |
JPH066511Y2 JPH066511Y2 (en) | 1994-02-16 |
Family
ID=31136308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985186602U Expired - Lifetime JPH066511Y2 (en) | 1985-12-03 | 1985-12-03 | Solid-state imaging device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH066511Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0641145U (en) * | 1992-10-28 | 1994-05-31 | 株式会社巴川製紙所 | Lid for sealing electronic components |
JP2017045842A (en) * | 2015-08-26 | 2017-03-02 | 京セラ株式会社 | Package for housing semiconductor element and semiconductor device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5652451A (en) * | 1979-10-05 | 1981-05-11 | Toshiba Corp | Interruption display system |
JPS5665656U (en) * | 1979-10-23 | 1981-06-01 | ||
JPS56144561A (en) * | 1980-04-11 | 1981-11-10 | Hitachi Ltd | Semiconductor device |
-
1985
- 1985-12-03 JP JP1985186602U patent/JPH066511Y2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5652451A (en) * | 1979-10-05 | 1981-05-11 | Toshiba Corp | Interruption display system |
JPS5665656U (en) * | 1979-10-23 | 1981-06-01 | ||
JPS56144561A (en) * | 1980-04-11 | 1981-11-10 | Hitachi Ltd | Semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0641145U (en) * | 1992-10-28 | 1994-05-31 | 株式会社巴川製紙所 | Lid for sealing electronic components |
JP2017045842A (en) * | 2015-08-26 | 2017-03-02 | 京セラ株式会社 | Package for housing semiconductor element and semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPH066511Y2 (en) | 1994-02-16 |
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