JPS6292652U - - Google Patents
Info
- Publication number
- JPS6292652U JPS6292652U JP1985185837U JP18583785U JPS6292652U JP S6292652 U JPS6292652 U JP S6292652U JP 1985185837 U JP1985185837 U JP 1985185837U JP 18583785 U JP18583785 U JP 18583785U JP S6292652 U JPS6292652 U JP S6292652U
- Authority
- JP
- Japan
- Prior art keywords
- package
- heat
- conductor
- conductive sheet
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000498 cooling water Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 239000002470 thermal conductor Substances 0.000 claims 2
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の実施例の縦断面図、第２図は
従来の冷却装置の縦断面図である。 １……多層配線基板、２……ＩＣパツケージ、
３……放熱シリンダ、４，６……熱伝導体、５…
…支持ばね、７……冷却水、８……冷却水流路、
９……熱伝導性シート。
従来の冷却装置の縦断面図である。 １……多層配線基板、２……ＩＣパツケージ、
３……放熱シリンダ、４，６……熱伝導体、５…
…支持ばね、７……冷却水、８……冷却水流路、
９……熱伝導性シート。
Claims (1)
- 内部に冷却水の流路を有する熱伝導体と、前記
熱伝導体とＩＣパツケージの間に介在された熱伝
導性シートとを有し、前記熱伝導性シートは、Ｉ
Ｃパツケージの熱を前記熱伝導体へ逃がしかつ該
ＩＣパツケージと該熱伝導体間のギヤツプを吸収
することを特徴とするＩＣパツケージ冷却装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985185837U JPS6292652U (ja) | 1985-12-02 | 1985-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985185837U JPS6292652U (ja) | 1985-12-02 | 1985-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6292652U true JPS6292652U (ja) | 1987-06-13 |
Family
ID=31134838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985185837U Pending JPS6292652U (ja) | 1985-12-02 | 1985-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6292652U (ja) |
-
1985
- 1985-12-02 JP JP1985185837U patent/JPS6292652U/ja active Pending