JPS6291446U - - Google Patents
Info
- Publication number
- JPS6291446U JPS6291446U JP18277785U JP18277785U JPS6291446U JP S6291446 U JPS6291446 U JP S6291446U JP 18277785 U JP18277785 U JP 18277785U JP 18277785 U JP18277785 U JP 18277785U JP S6291446 U JPS6291446 U JP S6291446U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- lead leg
- ground pattern
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ないし第３図は本考案の実施例を示し、
第１図はこの実施例の斜視図、第２図は第１図に
おける切断線―に沿う断面図、第３図はヒー
トシンクの正面図である。第４図は従来例の斜視
図である。
２……半導体素子、３……ヒートシンク、４…
…回路基板、８……アースパターン、９……アー
ス板、１０……リード脚、１４……ビス、１６…
…貫通孔。
1 to 3 show embodiments of the present invention,
FIG. 1 is a perspective view of this embodiment, FIG. 2 is a sectional view taken along the cutting line - in FIG. 1, and FIG. 3 is a front view of the heat sink. FIG. 4 is a perspective view of a conventional example. 2...Semiconductor element, 3...Heat sink, 4...
...Circuit board, 8...Earth pattern, 9...Earth plate, 10...Lead leg, 14...Screw, 16...
...Through hole.
Claims (1)
路基板の表面上に立ち姿勢で固定支持すると共に
、この回路基板の裏面に形成されたアースパター
ンと前記ヒートシンクとを電気的に接続する構造
であつて、 前記ヒートシンクと前記半導体素子との間に、
リード脚を有するアース板を、ビスによつて挾持
固定し、 この固定状態において、前記回路基板に形成さ
れた貫通孔に、前記リード脚を挿通すると共に、 そのリード脚の先端部を前記アースパターンに
半田付けしてなるヒートシンクのアースパターン
への接続構造。[Claims for Utility Model Registration] A heat sink on which a semiconductor element is attached is fixedly supported in a standing position on the surface of a circuit board, and the earth pattern formed on the back surface of this circuit board and the heat sink are electrically connected. a structure for connecting between the heat sink and the semiconductor element,
A ground plate having a lead leg is clamped and fixed with screws, and in this fixed state, the lead leg is inserted into a through hole formed in the circuit board, and the tip of the lead leg is attached to the ground pattern. A connection structure for connecting the heat sink to the ground pattern by soldering it to the ground pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18277785U JPS6291446U (en) | 1985-11-27 | 1985-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18277785U JPS6291446U (en) | 1985-11-27 | 1985-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6291446U true JPS6291446U (en) | 1987-06-11 |
Family
ID=31128893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18277785U Pending JPS6291446U (en) | 1985-11-27 | 1985-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6291446U (en) |
-
1985
- 1985-11-27 JP JP18277785U patent/JPS6291446U/ja active Pending