JPS6289149U - - Google Patents
Info
- Publication number
- JPS6289149U JPS6289149U JP1985181754U JP18175485U JPS6289149U JP S6289149 U JPS6289149 U JP S6289149U JP 1985181754 U JP1985181754 U JP 1985181754U JP 18175485 U JP18175485 U JP 18175485U JP S6289149 U JPS6289149 U JP S6289149U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation member
- peltier element
- model registration
- cooling function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の冷却機能付きのＩＣの一実
施例を示す概略断面図、第２図は各部の温度状態
を示す図、第３図は従来例を示す概略断面図、第
４図は従来例における各部の温度状態を示す図。 １……パツケージモールド、２……ＩＣチツプ
、３……放熱板、５……ペルチエ素子、５ａ……
冷却面、５ｂ……放熱面、６……伝熱部材。
施例を示す概略断面図、第２図は各部の温度状態
を示す図、第３図は従来例を示す概略断面図、第
４図は従来例における各部の温度状態を示す図。 １……パツケージモールド、２……ＩＣチツプ
、３……放熱板、５……ペルチエ素子、５ａ……
冷却面、５ｂ……放熱面、６……伝熱部材。
Claims (1)
- 【実用新案登録請求の範囲】 １ 所定部に放熱部材を取付けたパツケージモー
ルド内に、放熱面が放熱部材側に位置し、冷却面
がＩＣチツプ側に位置するペルチエ素子を設けた
ことを特徴とする冷却機能付きのＩＣ。 ２ 放熱部材とペルチエ素子との間に、熱伝導率
の高い伝熱部材を埋設している上記実用新案登録
請求の範囲第１項記載の冷却機能付きのＩＣ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985181754U JPS6289149U (ja) | 1985-11-25 | 1985-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985181754U JPS6289149U (ja) | 1985-11-25 | 1985-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289149U true JPS6289149U (ja) | 1987-06-08 |
Family
ID=31126917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985181754U Pending JPS6289149U (ja) | 1985-11-25 | 1985-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289149U (ja) |
-
1985
- 1985-11-25 JP JP1985181754U patent/JPS6289149U/ja active Pending