JPS625651U - - Google Patents
Info
- Publication number
- JPS625651U JPS625651U JP1985096145U JP9614585U JPS625651U JP S625651 U JPS625651 U JP S625651U JP 1985096145 U JP1985096145 U JP 1985096145U JP 9614585 U JP9614585 U JP 9614585U JP S625651 U JPS625651 U JP S625651U
- Authority
- JP
- Japan
- Prior art keywords
- package
- acting part
- encloses
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Description
図面は本考案の一実施例を示し、第１図は全体
の縦断正面図、第２図はフイン部分の斜視図であ
る。 図中、１はペレツト（電子素子）、３はパツケ
ージ、４は熱電変換器、５は熱電素子、６はベー
ス（熱作用部）、７は板材（熱作用部）である。
の縦断正面図、第２図はフイン部分の斜視図であ
る。 図中、１はペレツト（電子素子）、３はパツケ
ージ、４は熱電変換器、５は熱電素子、６はベー
ス（熱作用部）、７は板材（熱作用部）である。
Claims (1)
- 電子素子を内封するパツケージに熱電変換器の
冷却側もしくは放熱側のうちいずれか一方の熱作
用部を組込んで成ることを特徴とする電子デバイ
ス。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985096145U JPS625651U (ja) | 1985-06-25 | 1985-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985096145U JPS625651U (ja) | 1985-06-25 | 1985-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS625651U true JPS625651U (ja) | 1987-01-14 |
Family
ID=30961567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985096145U Pending JPS625651U (ja) | 1985-06-25 | 1985-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS625651U (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5370689A (en) * | 1976-12-06 | 1978-06-23 | Hitachi Ltd | Semiconductor laser device |
| JPS6084849A (ja) * | 1983-10-15 | 1985-05-14 | Mitsubishi Electric Corp | 半導体装置 |
-
1985
- 1985-06-25 JP JP1985096145U patent/JPS625651U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5370689A (en) * | 1976-12-06 | 1978-06-23 | Hitachi Ltd | Semiconductor laser device |
| JPS6084849A (ja) * | 1983-10-15 | 1985-05-14 | Mitsubishi Electric Corp | 半導体装置 |