JPS6286802A - Leaded ceramic element - Google Patents

Leaded ceramic element

Info

Publication number
JPS6286802A
JPS6286802A JP60228243A JP22824385A JPS6286802A JP S6286802 A JPS6286802 A JP S6286802A JP 60228243 A JP60228243 A JP 60228243A JP 22824385 A JP22824385 A JP 22824385A JP S6286802 A JPS6286802 A JP S6286802A
Authority
JP
Japan
Prior art keywords
lead wire
ceramic body
conductive layer
conductive
wire connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60228243A
Other languages
Japanese (ja)
Inventor
孝夫 小島
青山 俊彦
小川 育男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP60228243A priority Critical patent/JPS6286802A/en
Publication of JPS6286802A publication Critical patent/JPS6286802A/en
Pending legal-status Critical Current

Links

Landscapes

  • Resistance Heating (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は表面に導電層を設けたセラミック体にリード線
を取り付けたリード線付セラミック体に関する。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a ceramic body with lead wires, in which lead wires are attached to a ceramic body provided with a conductive layer on its surface.

し従来の技術] アルミナなど電気絶縁性セラミック板状体の表面に白金
、タングステン、モリブデンなど耐熱金成製導電層を被
着した面状発熱体、ジルコニア、チタニアなど固体電解
質板状体の両面に白金など多孔性の触媒性金属層を被着
したイオン電池、センサまたはポンプ素子、板状圧電セ
ラミック板の両面に導電層を被着した圧電素子などのセ
ラミック体には通常導電層にリード線の端が固着される
[Prior art] A planar heating element in which a conductive layer made of heat-resistant metal such as platinum, tungsten, or molybdenum is coated on the surface of an electrically insulating ceramic plate such as alumina, or a solid electrolyte plate such as zirconia or titania coated with platinum on both sides. Ceramic bodies such as ion batteries, sensors or pump elements that have a porous catalytic metal layer deposited on them, piezoelectric elements that have conductive layers deposited on both sides of a plate-shaped piezoelectric ceramic plate, etc., usually have a conductive layer at the end of the lead wire. is fixed.

このリード線付セラミック体は、未焼結セラミック体で
あるセラミックグリーンシートを所定の形状に成型し、
その表面に印刷等の手法で金属ペーストからなる導電層
を被着し、該導電層の端に白金などの導線を積層圧着し
、これを焼結一体化することにより量産されている。
This ceramic body with lead wires is made by molding a ceramic green sheet, which is an unsintered ceramic body, into a predetermined shape.
It is mass-produced by applying a conductive layer made of metal paste to its surface by a method such as printing, laminating and crimping conductive wires such as platinum on the ends of the conductive layer, and sintering them into one piece.

[発明が解決しようとする問題点] この発明者はかかるリード線付セラミック体において、
第5図に示す如くリード線の積層圧着のとき前記セラミ
ックグリーンシート101がリード線102.103の
形に凹み、このとき前記被着層には該リード線102.
103を囲む形で亀裂104.105が生じ、伝導不良
品が生産される確立が高くなることを見出した。
[Problems to be Solved by the Invention] In this ceramic body with lead wires, the inventor has solved the following problems:
As shown in FIG. 5, when the lead wires are laminated and crimped, the ceramic green sheet 101 is recessed in the shape of the lead wires 102 and 103, and at this time, the adhered layer has the lead wires 102.
It has been found that cracks 104 and 105 are formed surrounding 103, increasing the probability that a conductive defective product will be produced.

本発明の目的は前記導電不良品の発生が確実に防止でき
企リード線付セラミック焼結体の提供にある。
An object of the present invention is to provide a ceramic sintered body with a lead wire that can reliably prevent the occurrence of conductive defects.

[問題点を解決するための手段] かかる目的達成のため本発明のリード線付セラミック体
は、未焼結セラミック体の表面に導電層およびリード線
接続層を被着するとともに、該未焼結セラミック体に設
けた貫通穴に導電材を充填して前記導電層とリード線接
続層とを接続し、前記貫通穴を含むリード線接続層にリ
ード線を圧着し、しかる後に焼結一体化する構成を採用
した。
[Means for Solving the Problems] In order to achieve the above object, the ceramic body with lead wires of the present invention has a conductive layer and a lead wire connection layer applied to the surface of the unsintered ceramic body, and A through hole provided in the ceramic body is filled with a conductive material to connect the conductive layer and a lead wire connection layer, a lead wire is crimped to the lead wire connection layer including the through hole, and then sintered and integrated. The configuration was adopted.

[作用] 本発明のリード線付セラミック体は、リード線圧着時に
導電層に亀裂が生じても貫通穴内に充填された導電体を
介して導電層の電気的接続が確保されるため、断線が確
実に防止される。
[Function] In the ceramic body with a lead wire of the present invention, even if a crack occurs in the conductive layer when the lead wire is crimped, the electrical connection of the conductive layer is ensured through the conductor filled in the through hole, so there is no disconnection. Definitely prevented.

[実施例] 第1図は本発明のリード線付セラミック体の一実施例で
ある面状発熱体を示す。面状発熱体1は、アルミナを主
体とする電気絶縁性セラミック板2、その表面21に所
定のパターンでスクリーン印刷された白金を主体とする
導電層3、前記セラミック板2の裏面22に前記導電層
3の両端31.32に対応してスクリーン印刷により形
成された白金を主体とする一対のリード線接続層41.
42、前記導電層3の両端31および32とリード線接
続層41および42とを連絡するよう前記セラミック体
2に形成された貫通穴23および24、該貫通穴23.
24に充填された導電材25.26、それぞれ前記貫通
穴23および24を含むリード線接続層41および42
に圧着されると共に焼成一体化された白金製リード線5
および6からなる。
[Example] FIG. 1 shows a planar heating element which is an example of the ceramic body with lead wires of the present invention. The planar heating element 1 includes an electrically insulating ceramic plate 2 mainly made of alumina, a conductive layer 3 mainly made of platinum screen-printed in a predetermined pattern on the front surface 21, and a conductive layer 3 mainly made of platinum on the back surface 22 of the ceramic plate 2. A pair of lead wire connection layers 41. which are mainly made of platinum are formed by screen printing corresponding to both ends 31.32 of layer 3.
42, through holes 23 and 24 formed in the ceramic body 2 to connect both ends 31 and 32 of the conductive layer 3 and the lead wire connection layers 41 and 42;
24 filled with conductive material 25, 26, lead wire connection layers 41 and 42 including the through holes 23 and 24, respectively.
The platinum lead wire 5 is crimped and baked into a single piece.
and 6.

つぎにこのリード線付セラミック体の製造方法を第2図
に示す一実施例に基づき説明する。
Next, a method of manufacturing this ceramic body with lead wires will be explained based on an embodiment shown in FIG.

(イ)Al2O2(90%以上)を主成分とし、M(1
03%、5iCh2%、CaO1%等を添加した調合物
に、BMS、DBP等の有機バインダーとMEK、 ト
ルエン等の溶剤とを加えペースト化してペースト■を製
造する。
(a) Main component is Al2O2 (90% or more), M(1
Paste (2) is produced by adding an organic binder such as BMS or DBP and a solvent such as MEK or toluene to a formulation to which 03%, 5iCh2%, CaO1%, etc. are added to form a paste.

(ロ)該ペースト■をドクターブレード法にて第2図A
に示す矩形のセラミックグリーンシート10を作成する
。(寸法1135mm、長さ4h+mのセラミック単片
が通常8(個)できる広さで、厚さ0.8mm)(ハ)
前記工程(イ)、(ロ)で得たセラミックグリーンシー
ト内の各セラミック単片となる部分の端部に第2図Bに
示す如く直径0.7n+mの貫通穴10^、10Bを打
法ぎまたはドリルにて2つ設ける。
(b) Apply the paste ■ using the doctor blade method as shown in Figure 2A.
A rectangular ceramic green sheet 10 shown in FIG. (Dimensions: 1135mm, length of 4h+m, usually 8 (pieces) of single ceramic pieces, thickness: 0.8mm) (c)
As shown in FIG. 2B, through-holes 10^ and 10B with a diameter of 0.7n+m are made at the end of each ceramic single piece in the ceramic green sheet obtained in steps (a) and (b) above. Or install two with a drill.

(ニ)白金粉を、ptブラック(白金黒)2:Ptスポ
ンジ1となるように配合し、これをブチルカルピトール 造する。
(d) Platinum powder is blended in a ratio of 2 parts pt black (platinum black) to 1 part platinum sponge, and this is used to produce butyl carpitol.

(ボ)第2図Cに示す如く前記ペースト■のスクリーン
印刷により前記セラミックグリーンシートの表面に、前
記貫通穴を両端とする所定のパターンで導電層30を被
着形成する。
(B) As shown in FIG. 2C, a conductive layer 30 is formed on the surface of the ceramic green sheet in a predetermined pattern with the through holes at both ends by screen printing the paste (2).

セラミックグリーンシート裏面に前記貫通穴10A・1
0Bを含むリード線接続層品、3Bの印刷を行う。
The through hole 10A/1 is formed on the back side of the ceramic green sheet.
Print lead wire connection layer products including 0B and 3B.

(へ)第2図りに示す如く、前記貫通穴にペースト■を
充填する。この充填は図示の如くペーストHの一端から
の圧入、または一端に滴下しておき他端から吸引する方
法が単産性に優れる。
(f) As shown in the second diagram, fill the through hole with paste (3). This filling can be accomplished by press-fitting the paste H from one end as shown in the figure, or by dropping it onto one end and suctioning it from the other end, which is excellent in productivity.

(ト)第2図Eに示す如く貫通穴上に白金製リード線5
.6を乗せ圧着する。
(G) Platinum lead wire 5 is placed over the through hole as shown in Figure 2E.
.. Place 6 and crimp.

(ヂ)第2図Fに示す如く、この圧着体をセラミック単
片の大ぎさに切断した後焼成一体化する。
(d) As shown in FIG. 2F, this crimped body is cut into pieces of the same size as ceramic single pieces, and then fired and integrated.

第3図は本発明の第2実施例を示す。FIG. 3 shows a second embodiment of the invention.

本実施例では前記リード線接続層41.42を導電層3
と同じセラミックグリーンシートの表面に設けると共に
セラミックグリーンシートの裏面に第2の導電層33.
34を形成し、前記導電層端31.32と内部に導電材
が充填された貫通穴35.36を介して連結させ、前記
リード線接続層41.42と前記第2導電層33.34
とをそれぞれ接続させている。
In this embodiment, the lead wire connection layers 41 and 42 are replaced by the conductive layer 3.
A second conductive layer 33. is provided on the surface of the same ceramic green sheet, and a second conductive layer 33 is provided on the back surface of the ceramic green sheet.
34 and are connected to the conductive layer end 31.32 through a through hole 35.36 filled with a conductive material, and the lead wire connection layer 41.42 and the second conductive layer 33.34
are connected to each other.

この実施例においてはリード線5.6の接続を前記導電
層と同一面とすることができ、リード線の配線に制約が
ある場合に利用できる。
In this embodiment, the lead wires 5, 6 can be connected on the same surface as the conductive layer, and can be used when there are restrictions on the wiring of the lead wires.

第4図は第3実施例を示す。FIG. 4 shows a third embodiment.

9は平板状の酸素濃淡電池を示し、酸素イオン伝導性固
体電解質焼結体11の両面に多孔性白金電極層12.1
3を設けると共に対応する反対面にリード線接続層14
.15を形成し、前記電極層12の端とリード線接続層
14とを導電材が充填された2つの貫通穴1G、17で
接続し、前記電極層13とリード線接続層14とを導′
ifi材が充填された1つの貫通穴16で接続し、前記
導電層12の端とリード線接続層15とに白金製リード
線5.6を圧着して接続し、しかる後焼成一体化してい
る。
Reference numeral 9 indicates a flat oxygen concentration battery, in which porous platinum electrode layers 12.1 are provided on both sides of an oxygen ion conductive solid electrolyte sintered body 11.
3 and a lead wire connection layer 14 on the corresponding opposite surface.
.. 15 is formed, and the ends of the electrode layer 12 and the lead wire connection layer 14 are connected through two through holes 1G and 17 filled with a conductive material, and the electrode layer 13 and the lead wire connection layer 14 are
Connection is made through one through hole 16 filled with ifi material, and a platinum lead wire 5.6 is crimped and connected to the end of the conductive layer 12 and the lead wire connection layer 15, and then baked and integrated. .

なお、複数の貫通穴がリード線に接続するようにしても
良く、この場合はリード線と導電層との接続をより確実
にする。
Note that a plurality of through holes may be connected to the lead wire, and in this case, the connection between the lead wire and the conductive layer is made more reliable.

この酸素濃淡電池9はジルコニウム(Zr02>にイツ
トリウム(Y203 )を61nO1%添加し、仮焼1
300℃を行った後に粉砕しBMS、DBPXMEK、
トルエンにてドクターブレード法にてセラミックグリー
ンシートを作成し、貫通穴を設け、前記ペースト■にて
シート上にスクリーン印刷を行っている。
This oxygen concentration battery 9 is made by adding 61nO1% of yttrium (Y203) to zirconium (Zr02) and performing calcination 1.
After heating at 300°C, it is crushed to produce BMS, DBPXMEK,
A ceramic green sheet was created using a doctor blade method using toluene, through holes were provided, and screen printing was performed on the sheet using the paste (2).

[発明の効果] このようにリード線が導電材が充填されている貫通穴上
に乗っているため、圧着時にリード線がセラミックグリ
ーンシートに食い込んでも貫通穴に埋まっている導電材
上に乗るためリード線と導電層との電気的接続は確実と
なる。かつリード線によりリード線接続層のリード線接
続部の周囲が亀裂により切断されたとしてもリード線か
ら導電層への接触には何ら影響はない。
[Effect of the invention] Since the lead wire rests on the through hole filled with conductive material in this way, even if the lead wire bites into the ceramic green sheet during crimping, it will rest on the conductive material filled in the through hole. Electrical connection between the lead wire and the conductive layer is ensured. Moreover, even if the periphery of the lead wire connection portion of the lead wire connection layer is cut by a crack due to the lead wire, the contact from the lead wire to the conductive layer is not affected at all.

以上導電層に白金を用いた場合について述べたが、白金
の代りにタングステン、モリブデンの如き耐熱金属また
は炭化珪素の如き導電性セラミックが利用でき、またセ
ラミック体としてはピエゾ素子の如き圧電体を用いても
よい。
The case where platinum is used for the conductive layer has been described above, but instead of platinum, heat-resistant metals such as tungsten and molybdenum or conductive ceramics such as silicon carbide can be used, and piezoelectric bodies such as piezo elements can be used as the ceramic body. It's okay.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明のリード線心1+:!ラミック体の1実
施例を示す面状発熱体の斜視図、第2図はその製造工程
図、第3図は本発明のリード線(=Jセラミック体の第
2実施例を示す面状発熱体の斜視図、第4図は本発明の
リード線付セラミック体の第3実施例を示す酸素lll
主電池斜視図、第5図は従来のリード線付セラミック体
の斜視図である。
FIG. 1 shows lead wire core 1+:! of the present invention. A perspective view of a planar heating element showing one embodiment of the lamic body, FIG. 2 is a manufacturing process diagram, and FIG. FIG. 4 is a perspective view of the third embodiment of the ceramic body with lead wires of the present invention.
Main battery perspective view, FIG. 5 is a perspective view of a conventional ceramic body with lead wires.

Claims (1)

【特許請求の範囲】 1)未焼結セラミック体の表面に導電層およびリード線
接続層を被着するとともに、該未焼結セラミック体に設
けた貫通穴に導電材を充填して前記導電層とリード線接
続層とを接続し、前記貫通穴を含むリード線接続層にリ
ード線を圧着し、しかる後に焼結一体化してなるリード
線材セラミック体。 2)前記未焼結セラミック体は、セラミック原料粉末ペ
ーストを成形した板状を呈し、前記導電層およびリード
線接続層はそれぞれその表面および裏面に被着された導
電金属ペースト層であり、前記貫通穴には導電金属ペー
ストが充填されたことを特徴とする特許請求の範囲第1
項記載のリード線付セラミック体。 3)前記未焼結セラミック体は、セラミック原料粉末ペ
ーストを成形した板状を呈し、前記導電層は前記未焼結
セラミック体の表面および裏面に形成されると共に前記
未焼結セラミックに設けた貫通穴に充填された導電材を
介して接続され、前記リード線接続層は前記未焼結セラ
ミック体の表面に設けられると共に前記未焼結セラミッ
ク体の裏面に設けられた導電層に接続されていることを
特徴とする特許請求の範囲第1項記載のリード線付セラ
ミック体。
[Claims] 1) A conductive layer and a lead wire connection layer are deposited on the surface of an unsintered ceramic body, and a conductive material is filled into a through hole provided in the unsintered ceramic body to form the conductive layer. and a lead wire connection layer, the lead wire is crimped to the lead wire connection layer including the through hole, and then sintered and integrated. 2) The unsintered ceramic body has a plate shape formed from a ceramic raw material powder paste, and the conductive layer and the lead wire connection layer are conductive metal paste layers deposited on the front and back surfaces, respectively, and the through-hole Claim 1, characterized in that the hole is filled with conductive metal paste.
Ceramic body with lead wire as described in section. 3) The unsintered ceramic body has a plate shape formed by molding ceramic raw material powder paste, and the conductive layer is formed on the front and back surfaces of the unsintered ceramic body, and the conductive layer is formed on the through hole provided in the unsintered ceramic. The lead wire connection layer is connected via a conductive material filled in the hole, and the lead wire connection layer is provided on the surface of the green ceramic body and is connected to a conductive layer provided on the back surface of the green ceramic body. A ceramic body with a lead wire according to claim 1, wherein the ceramic body has a lead wire.
JP60228243A 1985-10-14 1985-10-14 Leaded ceramic element Pending JPS6286802A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60228243A JPS6286802A (en) 1985-10-14 1985-10-14 Leaded ceramic element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60228243A JPS6286802A (en) 1985-10-14 1985-10-14 Leaded ceramic element

Publications (1)

Publication Number Publication Date
JPS6286802A true JPS6286802A (en) 1987-04-21

Family

ID=16873401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60228243A Pending JPS6286802A (en) 1985-10-14 1985-10-14 Leaded ceramic element

Country Status (1)

Country Link
JP (1) JPS6286802A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311135A (en) * 2006-05-17 2007-11-29 Harison Toshiba Lighting Corp Heater, heating unit, and image forming device
JP2019161032A (en) * 2018-03-14 2019-09-19 日本特殊陶業株式会社 Retainer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4935950A (en) * 1972-08-09 1974-04-03
JPS6022561U (en) * 1983-07-18 1985-02-16 セイレイ工業株式会社 Swivel frame protection plate arrangement structure of backhoe with earth removal device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4935950A (en) * 1972-08-09 1974-04-03
JPS6022561U (en) * 1983-07-18 1985-02-16 セイレイ工業株式会社 Swivel frame protection plate arrangement structure of backhoe with earth removal device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311135A (en) * 2006-05-17 2007-11-29 Harison Toshiba Lighting Corp Heater, heating unit, and image forming device
JP2019161032A (en) * 2018-03-14 2019-09-19 日本特殊陶業株式会社 Retainer

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