JPS6282792U - - Google Patents
Info
- Publication number
- JPS6282792U JPS6282792U JP17339785U JP17339785U JPS6282792U JP S6282792 U JPS6282792 U JP S6282792U JP 17339785 U JP17339785 U JP 17339785U JP 17339785 U JP17339785 U JP 17339785U JP S6282792 U JPS6282792 U JP S6282792U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- conductive plate
- electrically conductive
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 3
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図及び第２図はそれぞれこの考案のプリン
ト配線板の一例を示す斜視図、第３図はこの考案
の他の例の側面部を拡大した斜視図、第４図はこ
の考案のプリント配線板を通信装置へ実装した適
用例を示す斜視図、第５図は従来のプリント配線
板を示す斜視図である。
１０：熱放散パス、１１：絶縁基板、１２：配
線、１３：ＬＳＩ等の搭載部品、１４：導電性板
、１５：スルーホール、１６：アース配線、１７
：薄板、１８：スルーホールにおけるアース配線
と導電性板との接続点、２０：この考案のプリン
ト配線板、２１：ユニツト枠、２２：ガイドレー
ル、２３：通信装置。
Figures 1 and 2 are perspective views showing an example of the printed wiring board of this invention, Figure 3 is an enlarged perspective view of a side part of another example of this invention, and Figure 4 is a printed wiring board of this invention. A perspective view showing an example of application in which the board is mounted on a communication device, and FIG. 5 is a perspective view showing a conventional printed wiring board. 10: Heat dissipation path, 11: Insulating board, 12: Wiring, 13: Mounted components such as LSI, 14: Conductive plate, 15: Through hole, 16: Earth wiring, 17
: Thin plate, 18: Connection point between ground wiring and conductive plate in through hole, 20: Printed wiring board of this invention, 21: Unit frame, 22: Guide rail, 23: Communication device.
Claims (1)
面に導電性板が形成されたプリント配線板におい
て、 上記絶縁基板に形成され、上記配線中のアース
配線と上記導電性板とを電気的に接続する複数の
スルーホールと、 上記絶縁基板の厚み方向の面に、上記導電性板
と接して形成され、電気的及び熱的伝導性の薄板
とを具備することを特徴とするプリント配線板。[Scope of Claim for Utility Model Registration] In a printed wiring board in which wiring is provided on one side of an insulating substrate and a conductive plate is formed on almost the entire surface of the other side, a ground wiring formed on the insulating substrate and in the wiring and a plurality of through holes for electrically connecting the electrically conductive plate and the electrically conductive thin plate formed on the surface in the thickness direction of the insulating substrate in contact with the electrically conductive plate. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17339785U JPS6282792U (en) | 1985-11-11 | 1985-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17339785U JPS6282792U (en) | 1985-11-11 | 1985-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6282792U true JPS6282792U (en) | 1987-05-27 |
Family
ID=31110821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17339785U Pending JPS6282792U (en) | 1985-11-11 | 1985-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6282792U (en) |
-
1985
- 1985-11-11 JP JP17339785U patent/JPS6282792U/ja active Pending
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