JPS6282749U - - Google Patents

Info

Publication number
JPS6282749U
JPS6282749U JP17546985U JP17546985U JPS6282749U JP S6282749 U JPS6282749 U JP S6282749U JP 17546985 U JP17546985 U JP 17546985U JP 17546985 U JP17546985 U JP 17546985U JP S6282749 U JPS6282749 U JP S6282749U
Authority
JP
Japan
Prior art keywords
logic circuit
array
input
semiconductor integrated
master slice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17546985U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17546985U priority Critical patent/JPS6282749U/ja
Publication of JPS6282749U publication Critical patent/JPS6282749U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP17546985U 1985-11-13 1985-11-13 Pending JPS6282749U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17546985U JPS6282749U (cs) 1985-11-13 1985-11-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17546985U JPS6282749U (cs) 1985-11-13 1985-11-13

Publications (1)

Publication Number Publication Date
JPS6282749U true JPS6282749U (cs) 1987-05-27

Family

ID=31114819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17546985U Pending JPS6282749U (cs) 1985-11-13 1985-11-13

Country Status (1)

Country Link
JP (1) JPS6282749U (cs)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5992538A (ja) * 1982-11-19 1984-05-28 Hitachi Ltd デイジタル半導体集積回路装置
JPS61194864A (ja) * 1985-02-25 1986-08-29 Toshiba Corp 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5992538A (ja) * 1982-11-19 1984-05-28 Hitachi Ltd デイジタル半導体集積回路装置
JPS61194864A (ja) * 1985-02-25 1986-08-29 Toshiba Corp 半導体装置

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