JPS6279656A - Manufacture of substrate provided with double-sided through hole - Google Patents
Manufacture of substrate provided with double-sided through holeInfo
- Publication number
- JPS6279656A JPS6279656A JP60220553A JP22055385A JPS6279656A JP S6279656 A JPS6279656 A JP S6279656A JP 60220553 A JP60220553 A JP 60220553A JP 22055385 A JP22055385 A JP 22055385A JP S6279656 A JPS6279656 A JP S6279656A
- Authority
- JP
- Japan
- Prior art keywords
- film
- heat
- hole
- resistant
- conductive foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＩＣをギヤングポンディングでさるテープキ
ャリアタイプの両面スルーホール等板の製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a tape carrier-type double-sided through-hole plate in which ICs are bonded by gigantic bonding.
ＩＣをポンディングできる両面スルーホール基板の製造
方法において、片面に導［箔ｈ；ラミネートされ、かつ
、もう一方の面忙は接着剤が塗布されていて、その上に
保護フィルムｈ；ラミネートされている複合フィルムを
所望の巾にスリー、 トする第一の工程と、中央部と両
サイドにデバイス穴とパイロット穴をパンチングする第
二の工程と、第二の工程で得られ念テープの接着剤仰か
ら、保護フィルムをはがして、耐熱フィルムに接着剤を
用いないで、直接導電箔がラミネートされ次複合フィル
ムをフィルム側を内側にしてラミネートする第三の工程
とを含む両面スルーホール基板の製造方法。In a method for manufacturing a double-sided through-hole board that can be used to bond ICs, one side is laminated with conductive foil, the other side is coated with adhesive, and a protective film is laminated on top of that. The first step is to cut the composite film to the desired width, the second step is to punch device holes and pilot holes in the center and on both sides, and the second step is to attach the adhesive tape to the resulting composite film. manufacturing a double-sided through-hole board, which includes peeling off the protective film from above, directly laminating the conductive foil on the heat-resistant film without using an adhesive, and then laminating the composite film with the film side inside. Method.
従来１両面スルーホール端板の製造は１次の様な方法で
製造されていモ。先ず、両面に導電箔ｈ′−貼り合さっ
ているフィルムを所望の大きさに切断し、これにスルー
ホールを形成する穴と、パイロｙ）穴をパンチング又は
ドリルにて穴あけし、これを周知の方法ドおける銅スル
ーホールメツ千を施し１周知のドライフィルム法、工・
ｌチング法により両面スルーホール基板を得る。Conventionally, single-sided through-hole end plates have been manufactured using the following method. First, cut the film with conductive foil (h') on both sides to the desired size, punch or drill a hole for forming a through hole and a pyro hole (y), and make this known. The method of applying copper through-holes is the well-known dry film method,
A double-sided through-hole board is obtained by l-ching method.
〔発明が解決しようとする問題点及び目的〕しかし、従
来の方法での両面スルーホール基板では、工Ｃを実装す
る場合は、パッケージしｔものしか実装できず、又、歩
留りを犠牲にして、ワイヤボンドするしかなく、現在、
強く要求されている高密度実装、超薄型実装には充分に
答えられていないのが実状であ石。[Problems and Objectives to be Solved by the Invention] However, when mounting a double-sided through-hole board using the conventional method, only one package can be mounted, and at the expense of yield, I have no choice but to wire bond, and currently,
The reality is that the highly demanded high-density packaging and ultra-thin packaging have not been adequately met.
本発明は、上記しｔ癖を解決し、高密度実装。The present invention solves the above-mentioned problems and enables high-density packaging.
超薄型実装の可能な裸のＩＣを実装できる両面スルーホ
ール基板を提供するところにある、〔問題虜を解決する
次めの手段〕
本発明では、従来力問題点を解決する之め１片面に導電
箔がラミネートれ、かつもう一方の面に、け、接着剤が
塗布されていて、その上に保護フィルムｈ；ラミネート
されている複合フィルムを所望の巾にスリットする第一
の工専と、中央部と両サイドにデバイス穴とパイロット
穴をパンチングする第二の工程と、第二の工程で得られ
たテープの接着剤側から、保護フィルムをけがして、耐
熱フィルム接着剤を用いないで、Ｗ接導電箔がラミネー
トされた複合フィルムをフィルム側を内側にしてラミネ
ートする第三の工程とを含むことを特徴とする。The present invention aims to solve the conventional problems by providing a double-sided through-hole board on which bare ICs can be mounted that can be mounted in an ultra-thin manner. A conductive foil is laminated on one side, and an adhesive is applied on the other side, and a protective film h is placed on top of that. , the second step of punching device holes and pilot holes in the center and both sides, and from the adhesive side of the tape obtained in the second step, scratch the protective film and do not use heat-resistant film adhesive. , and a third step of laminating a composite film laminated with a W-conducting conductive foil with the film side facing inside.
本発明な実施例をもとに詳細に説明する。第１図の（α
）〜ｃ７）は１本発明の詳細な説明する要部の断面の略
図である。The present invention will be explained in detail based on embodiments. (α
) to c7) are schematic cross-sectional views of essential parts for detailed explanation of the present invention.
先ず、（α）に示すごとく、耐熱フィルム１０に耐熱接
着剤１１忙て導電箔（本発明では銅箔を用い友、又耐熱
フィルム１０にはポリイミドフィルムを用いた）１２を
貼り、反対側の面に耐熱接着剤１１′ヲロールコーテイ
ングし、熱風により乾燥し惺穫フィルム１３を貼り合せ
、所望の巾にスリ・Ｉトする。本発明うでかいては、一
般によ〈知られている３５ミリ巾にスリットした。First, as shown in (α), a heat-resistant adhesive 11 and a conductive foil (in the present invention, a copper foil was used for the heat-resistant film 10, and a polyimide film was used for the heat-resistant film 10) 12 were attached to the heat-resistant film 10. A heat-resistant adhesive 11' is roll-coated on the surface, dried with hot air, a printed film 13 is attached, and the film is slit to the desired width. The arm of the present invention was slit to a generally known width of 35 mm.
その後、パンチングプレス又は、ドリルにてデバイス穴
２１と、搬送に使用するパイ−ｗ）穴２０をｂＫ示すご
とくあける。Thereafter, a device hole 21 and a pie-w) hole 20 used for transportation are punched using a punching press or a drill as shown in bK.
保護フィルム１３を取り除き、複合フィルム３０を耐熱
接着剤１１′にて貼り合せる。このとき複合フィルム３
０け、耐熱フィルム３１と、導電箔３２より構成されて
おり、一般に知られているポリイミドフィルムに導体金
属を直接メ／−？等でけけ之ものか、又は導電箔に、？
ヤスティング等の方法虻て、ポリイミド樹＠をコーティ
ングしたものである。接着は、耐熱フィルム３１と、耐
熱接着剤１１′を接着する。The protective film 13 is removed, and the composite film 30 is bonded with a heat-resistant adhesive 11'. At this time, composite film 3
It is composed of a heat-resistant film 31 and a conductive foil 32, and a conductive metal is directly coated on a generally known polyimide film. Is it something like that or conductive foil?
According to the method of Yasting et al., polyimide wood is coated. The heat-resistant film 31 and the heat-resistant adhesive 11' are bonded together.
次に、パイロ−Ｉト穴２０を基準にして、スルーホール
穴４０をドリル、又はパンチングプレスにより形成し、
周知の銅スルーホールメグ子供によりスルーホール穴−
１Ｉ−ＩＦ−を行５゜そのメッキし友ものを周知の方法
であるドライフィルムレジスト法によりパターニングを
行う。ＨＬ１図Ｃ３）に、ドライフィルムレジスト５０
．５０’をラミネートし之様子を示−ｆ！Ｆ１面図を示
しである。本発明にむいては、商標リストンフィルムド
ライレジストを用い之。Next, a through-hole hole 40 is formed using a drill or a punching press based on the pilot hole 20,
Well-known copper through hole meg child through hole hole -
1I-IF- is then plated at 5° and patterned by a well-known dry film resist method. HL1 Figure C3), dry film resist 50
．． This shows how 50' is laminated -f! The F1 side view is shown. For the purposes of this invention, trademarked Riston film dry resist is used.
その後、周知の通り、露光、現像、エリチング剥離を行
い、（１）に示す両面スルーホール基板を得る。Thereafter, as is well known, exposure, development, etching and peeling are performed to obtain the double-sided through-hole substrate shown in (1).
ソノ後、必要に応じてソルダーレジストをスクリーン印
刷し、最後にＮｉ −ｋｕメｑｆを施こし。After soldering, a solder resist was screen printed if necessary, and finally Ni-ku metal qf was applied.
第２図に示すようにＸＣ７０をツール７１圧てギヤング
ボンディングできる両面基板を得る。As shown in FIG. 2, a double-sided substrate capable of gigantic bonding is obtained by pressing the XC70 with a tool 71.
未発明の方法によれば、ＩＣを基板に直接ポンディング
できるので、高密度でしかも、薄型実装／ｌ’−可能と
なり、現在、市場での要求が高いＩＣカードや、多機能
電卓、翻訳機に応用できる。According to the yet-to-be-invented method, ICs can be directly bonded to the substrate, making it possible to achieve high-density and thin mounting. It can be applied to
さらに、デバイス穴２１と、フィンガー６１を一つの基
板の中に複数個作成することにより、又パターン６０の
表面に、ＳＭＴ （表面実装技術）によりチップ素子等
もつけることｂ’−できるので、実密度実装、薄型実装
の効果は、はかり知ｔないものｈ；ちる。Furthermore, by creating a plurality of device holes 21 and fingers 61 in one substrate, it is also possible to attach chip elements etc. to the surface of the pattern 60 by SMT (surface mount technology). The effects of dense packaging and thin packaging are immeasurable.
第１図（ロ））〜（ハは１本発明の工程を示す要部の断
面図である。
７２図は、ＩＯのポンディングの状態を示す要部の断面
略図である、
１０・・・・・・耐熱フィルム
１１．１１’・・・・・・耐熱接着剤
１２・・・・・・導′亀箔
１３・・…・梶護フィルム
２０・・・・・・ハイローノド穴
２１・・・・・・デバイス穴
す……複合フィルム
３１・・・・・・耐熱フィルム
３２・・・・・・導電箔
４０・・・・・・スルーホール穴
５０．５１・・・・・・ドライフィルムレジスト６０・
・・・・・パターン
６１・・・・・・フィンガー
７０・・・・・・ＩＣ
７１・・・・・・ツール
以 上Figures 1(B) to (C) are sectional views of essential parts showing steps of the present invention. Figure 72 is a schematic sectional view of essential parts showing the state of IO bonding. 10... ...Heat-resistant film 11.11'...Heat-resistant adhesive 12...Conductor turtle foil 13...Kaji protection film 20...High-low gutter hole 21... ...Device hole...Composite film 31...Heat-resistant film 32...Conductive foil 40...Through hole hole 50.51...Dry film resist 60・
...Pattern 61...Finger 70...IC 71...Tool or more
Claims (2)
の製造方法において、片面に導電箔がラミネートされ、
かつもう一方の面には、接着剤が塗布されていて、その
上に保護フィルムがラミネートされている複合フィルム
を所望の巾にスリットする第一の工程と、中央部と両サ
イドにデバイス穴とパイロット穴をパンチングする第二
の工程と第二の工程で得られたテープの接着剤側から、
保護フィルムをはがして、耐熱フィルムに接着剤を用い
ないで直接導電箔ｂがラミネートされた複合フィルム側
を内側にしてラミネートする第三の工程とを含むことを
特徴とする両面スルーホール基板の製造方法。(1) In a method for manufacturing a double-sided through-hole board that can be polypolized with an IC, a conductive foil is laminated on one side,
On the other side, adhesive is applied and a protective film is laminated on top of the composite film.The first step is to slit the composite film to the desired width, and device holes are formed in the center and both sides. From the adhesive side of the tape obtained in the second step and the second step of punching pilot holes,
Manufacturing a double-sided through-hole board characterized by including a third step of peeling off the protective film and laminating the heat-resistant film directly with the composite film side laminated with the conductive foil b on the inside without using an adhesive. Method.
ドフィルムであることを特徴とする第１項記載の両面ス
ルーホール基板の製造方法。(2) The method for producing a double-sided through-hole substrate according to item 1, wherein the third step is a composite film or a polyimide film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60220553A JPS6279656A (en) | 1985-10-03 | 1985-10-03 | Manufacture of substrate provided with double-sided through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60220553A JPS6279656A (en) | 1985-10-03 | 1985-10-03 | Manufacture of substrate provided with double-sided through hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6279656A true JPS6279656A (en) | 1987-04-13 |
Family
ID=16752794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60220553A Pending JPS6279656A (en) | 1985-10-03 | 1985-10-03 | Manufacture of substrate provided with double-sided through hole |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6279656A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100257926B1 (en) * | 1996-01-19 | 2000-06-01 | 모기 쥰이찌 | Multi-layer film for circuit board and multi-layer circuit board using the same and pakage for semiconductor device |
-
1985
- 1985-10-03 JP JP60220553A patent/JPS6279656A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100257926B1 (en) * | 1996-01-19 | 2000-06-01 | 모기 쥰이찌 | Multi-layer film for circuit board and multi-layer circuit board using the same and pakage for semiconductor device |
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