JPS6277819U - - Google Patents
Info
- Publication number
- JPS6277819U JPS6277819U JP17074085U JP17074085U JPS6277819U JP S6277819 U JPS6277819 U JP S6277819U JP 17074085 U JP17074085 U JP 17074085U JP 17074085 U JP17074085 U JP 17074085U JP S6277819 U JPS6277819 U JP S6277819U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- boards
- stage
- spacer
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 5
Description
第１図は上部回路基板にスペーサーを取り付け
た状態の底面図、第２図は本考案の多段実装式回
路基板の断面図、第３図、第５図、第７図は他の
実施例のスペーサーを設けた状態の上部回路基板
の底面図、第４図、第６図、第８図は他の実施例
のスペーサーを設けた多段実装式回路基板の断面
図、第９図は従来例を示す一部省路断面図である
。
尚図中、Ａ…多段実装式回路基板本体、１…上
部回路基板、２…下部回路基板、３…スペーサー
を夫々示す。
Fig. 1 is a bottom view of the spacer attached to the upper circuit board, Fig. 2 is a sectional view of the multi-stage mounting type circuit board of the present invention, and Figs. 3, 5, and 7 are of other embodiments. A bottom view of the upper circuit board with spacers provided, FIGS. 4, 6, and 8 are cross-sectional views of multi-stage circuit boards with spacers provided in other embodiments, and FIG. 9 is a conventional example. FIG. In the figure, A shows a multistage circuit board body, 1 shows an upper circuit board, 2 shows a lower circuit board, and 3 shows a spacer.
Claims (1)
式回路基板本体において、前記回路基板の間に、
何れか一方の基板に接着せるスペーサーを介在さ
せて形成したことを特徴とする多段実装式回路基
板。 In a multi-stage circuit board body in which circuit boards are formed in correspondence with each other, between the circuit boards,
A multi-stage mounting type circuit board characterized in that it is formed by interposing a spacer to be adhered to one of the boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17074085U JPS6277819U (en) | 1985-11-05 | 1985-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17074085U JPS6277819U (en) | 1985-11-05 | 1985-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6277819U true JPS6277819U (en) | 1987-05-19 |
Family
ID=31105736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17074085U Pending JPS6277819U (en) | 1985-11-05 | 1985-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6277819U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007093415A (en) * | 2005-09-29 | 2007-04-12 | Yokogawa Electric Corp | Semiconductor tester device |
-
1985
- 1985-11-05 JP JP17074085U patent/JPS6277819U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007093415A (en) * | 2005-09-29 | 2007-04-12 | Yokogawa Electric Corp | Semiconductor tester device |
| JP4577653B2 (en) * | 2005-09-29 | 2010-11-10 | 横河電機株式会社 | Semiconductor tester equipment |
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