JPS6277195A - Method and device for discriminating working state by energy beam - Google Patents

Method and device for discriminating working state by energy beam

Info

Publication number
JPS6277195A
JPS6277195A JP60215150A JP21515085A JPS6277195A JP S6277195 A JPS6277195 A JP S6277195A JP 60215150 A JP60215150 A JP 60215150A JP 21515085 A JP21515085 A JP 21515085A JP S6277195 A JPS6277195 A JP S6277195A
Authority
JP
Japan
Prior art keywords
energy beam
sensor
state
drilling
working state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60215150A
Other languages
Japanese (ja)
Inventor
Koichi Sakurai
桜井 光一
Yoshio Yamane
山根 義雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60215150A priority Critical patent/JPS6277195A/en
Publication of JPS6277195A publication Critical patent/JPS6277195A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To discriminate a working state easily, quickly and in a short time by detecting by a sensor an infrared ray, a thermion, etc. which are generated from a molten object in the periphery of a working hole, and discriminating a piercing working state, when irradiating a high energy beam. CONSTITUTION:Piercing working is executed to an object to be worked, by using a high energy beam 3 outputted from a high energy beam generating device 1, based on a command of an output control device 2. In this case, when executing the piercing working, an infrared ray and a thermion 6 which are generated from a molten object in the periphery of a working hole 5 are detected by a sensor 7. Subsequently, a working state discriminating device 8 discriminates a piercing working state based on a trigger signal 9 from the control device 2 and a detecting signal 13 from the sensor 7. In this way, the working state can be discriminated easily, quickly and also in a short time by a non-contact system.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、たとえばレーザビーム等の電子ビーム、ま
たはイオンビーム等の高エネルギビームによる穴あけ加
工状態を判別する判別方法と、その判別装置に関するも
のである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for determining the state of drilling by an electron beam such as a laser beam, or a high-energy beam such as an ion beam, and a device for determining the same. It is.

〔従来の技術〕[Conventional technology]

第4図(A) 、 (B) 、 (C)は従来の穴あけ
加工状態判別方法を説明するための工程図である。工程
(A)は、高エネルギビーム(3)によって板状の被加
工物(4)の所定位置に所定の内径の加工穴(5)を形
成している状態を示し、また工程(B)は、加工穴(5
)およびその周辺の加工状態を判別するために、この加
工穴(5)のほぼ中心を通る切断線に沿って被加工物(
4)を切断し、かつこの切断面を観察し易いように切断
研磨工具Ql)によって研磨している状態を示す。さら
に工程(C)は、被加工物(4)の加工穴(5)を含む
切断面の穴あけ加工状態たとえば加工穴(5)の周辺の
溶融物の付着状態等をたとえば顕微鏡などの光学器械(
6)等によって観察し、そして判別している状態を示し
ている。
FIGS. 4(A), 4(B), and 4(C) are process diagrams for explaining a conventional method for determining the drilling state. Step (A) shows a state in which a machined hole (5) with a predetermined inner diameter is formed at a predetermined position of a plate-shaped workpiece (4) using a high-energy beam (3), and step (B) , machined hole (5
) and its surroundings, cut the workpiece (
4) is cut and the cut surface is polished using a cutting and polishing tool Ql) to make it easier to observe. Further, in step (C), the drilling state of the cut surface including the machined hole (5) of the workpiece (4), for example, the adhesion state of melted material around the machined hole (5), etc., is measured using an optical instrument such as a microscope (
6), etc., and the state of discrimination is shown.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

以上述べた従来の穴あけ加工状態判別方法によれば、被
加工物(4)の加工穴(5)を含む切断面の穴あけ加工
状態を検査員の目視により判別するために、切断研磨工
具aやによって被加工物(4)の加工穴部分を切断しな
ければならないので、加工状態の判別作業に相当の時間
を必要とするばかりでなく、たとえば抜き取り式に加工
状態を判別するため切断した被加工物(4)は製品とし
て使用できないことはもちろん、加工状態の判別作業の
自動化が困難である等多くの問題があった。
According to the conventional drilling state determination method described above, in order to visually determine the drilling state of the cut surface of the workpiece (4) including the machined hole (5), the cutting and polishing tool a or Since the machined hole part of the workpiece (4) must be cut by cutting, it not only takes a considerable amount of time to determine the machining state, but also the cut workpiece (4) must be cut in order to determine the machining state by sampling. Product (4) not only cannot be used as a product, but also has many problems, such as the difficulty of automating the work of determining the processing state.

この発明は、かかる点に着目してなされたもので、上述
した従来のもののように被加工物を切断することなく、
加工状態の判別を簡単、迅速かつ短時間に行なうことが
できる加工状態判別方法および判別装置を提供しようと
するものである。
This invention was made with attention to this point, and unlike the above-mentioned conventional method, the workpiece is not cut.
It is an object of the present invention to provide a machining state determination method and a determination device that can easily, quickly, and quickly determine the machining state.

〔問題点を解決するための手段〕[Means for solving problems]

この発明にかかるエネルギビームによる加工状態判別方
法および判別装置は、高エネルギビームによる穴あけ加
工時に、加工穴周辺の゛@融物から発生する赤外線およ
び熱電子々どをセンサによって検出し、その強度および
時間的変化などから穴あけ加工状態を判別するようにし
たものである。
The method and device for determining the machining state using an energy beam according to the present invention uses a sensor to detect infrared rays and thermionic electrons generated from the molten material around the drilled hole during drilling using a high-energy beam, and detects the intensity and The drilling process status is determined based on changes over time.

〔作 用〕[For production]

この発明においては、被加工物の加工穴周辺の溶融物か
ら発生する赤外線および熱電子などをセンサにより検出
して穴あけ加工状態の判別を行なうようにしたもので、
従来のように被加工物を切断する必要がなく、加工状態
の判別を非接触方式で簡単、迅速かつ短時間に行ない得
るようにしたものである。
In this invention, the drilling state is determined by detecting infrared rays and thermoelectrons generated from the molten material around the hole in the workpiece using a sensor.
Unlike the conventional method, there is no need to cut the workpiece, and the processing state can be determined simply, quickly, and in a short time using a non-contact method.

〔発明の実施例〕[Embodiments of the invention]

第1図〜第6図は何れもこの発明の一実施例を示すもの
で、第1図は高エネルギビームによる加工状態判別装置
を示すブロック図、第2図はこの発明の加工状態判別方
法の動作を説明するための波形図、第6図はこの発明の
加工判別方法による判別動作を説明するための被加工物
の断面図である。
1 to 6 each show an embodiment of the present invention. FIG. 1 is a block diagram showing a machining state discrimination device using a high-energy beam, and FIG. 2 is a block diagram showing a machining state discrimination method of the present invention. FIG. 6 is a waveform diagram for explaining the operation, and a sectional view of the workpiece for explaining the discrimination operation by the processing discrimination method of the present invention.

まず、第1図のブロック図において、(1)は高エネル
ギビーム発生装置、(2)はこの高エネルギビーム発生
装置(1)の制御とビーム出力を瞬間的に減少させたと
きにトリガ信号(9)を出力する出力制御装置、(3)
は高エネルギビーム発生装置(1)から出力され、被加
工物(4)に加工穴(5)を形成するために照射てれる
高エネルギビーム、(6)は加工穴(5)の周辺の溶融
物から発生する赤外線および熱電子、(7)は加工穴(
5)の近傍に配設され、赤外線および熱電子の強度、お
よび時間的変化を検出するセンサ、(8)は出力制御装
置(2)からのトリ力信号(9)と、センサ(7)から
の検出信号α]とによって穴あけ加工状態を判別する加
工状態判別装置である。
First, in the block diagram of Fig. 1, (1) is a high-energy beam generator, and (2) is a trigger signal ( (9) an output control device that outputs (3)
is a high-energy beam output from a high-energy beam generator (1) and irradiated to form a machined hole (5) in a workpiece (4), and (6) is a high-energy beam that is used to melt the area around the machined hole (5). Infrared rays and thermoelectrons generated from objects, (7) are machined holes (
5) is a sensor that detects the intensity and temporal changes of infrared rays and thermoelectrons, and (8) receives a tri-force signal (9) from the output controller (2) and a sensor (7). This is a machining state discriminating device that determines the drilling machining state based on the detection signal α].

この発明のエネルギビームによる加工状態判別装置は上
記のように構成されており、この発明の加工状態判別装
置について、第2因の波形図、および第6図の被加工物
断面によって説明する。
The machining state discriminating device using an energy beam according to the present invention is constructed as described above, and the machining state discriminating device according to the present invention will be explained with reference to the waveform diagram of the second factor and the cross section of the workpiece shown in FIG.

まず、上述した第1図の高エネルギビーム発生装k(1
)に対し、出力制御装置(2)から所定の指令が出力さ
れ、第2図(A)に示すようなビーム強度の波形を有す
る高エネルギビーム(3)が第6図(A)に示すように
被加工物(4)に照射されると、この被加工物(4)の
所定位置に所定寸法の加工穴(5)が形成されるわけで
ちるが、加工穴の形成完了とともに、出力制御装置 (
2)は高エネルギビーム(3)の照射を終了すると同時
に、第2図(BJに示すようなトリ力信号(9)を出力
する。一方、加工穴(5)の近傍に配設されたセンサ(
7)は、第6図(B)および(C)に示すように、加工
穴(5)の周辺の溶融物αQから発生する赤外線および
熱電子(6ンを検出し、この赤外線およびrA電子(6
)の強度、および時間的変化の検出信号部を加工状態判
別装& (8)に出力する。
First, the high-energy beam generator k (1
), a predetermined command is output from the output control device (2), and a high-energy beam (3) having a beam intensity waveform as shown in FIG. 2(A) is generated as shown in FIG. 6(A). When the workpiece (4) is irradiated with radiation, a machined hole (5) of a predetermined size is formed at a predetermined position on the workpiece (4).As soon as the formation of the machined hole is completed, the output is controlled. Device (
2) outputs a tri-force signal (9) as shown in Fig. 2 (BJ) at the same time as the irradiation of the high-energy beam (3) ends. (
7), as shown in FIGS. 6(B) and (C), detects infrared rays and thermionic electrons (6) generated from the melt αQ around the machined hole (5), and converts the infrared rays and rA electrons ( 6
) and the detection signal portion of the temporal change are output to the machining state discriminator & (8).

なお、上述した加工穴(5)の周辺の溶融物(ICIの
1二が少なくて加工状態が良好な場合を第ろ図(B)に
示し、また溶融物α1の量が多くて加工状態が不良な場
合を第6図(C)に示しているが、上記溶融物(10か
ら発生する赤外線および熱を子(6)の強度お・よび時
間的変化は、溶融物01の量および温度によって相違す
るため、センサ(力と加工状態判別装置(8)とにより
これを検出することによって穴あけ加工状態を判別する
ことができろう また、第2図(C)および■)は、上述したセンサ(7
)の検出信号Qlの波形の一例を示すもので、第2図(
C)は、;窮3図(B)に示すような穴あけ加工状態が
良好な場合の波形を示し、また第2図の)は、第6図(
C)に示すような穴あけ加工状態が不良の場合の波形を
示しており、溶融物α1の素の少ない穴あけ加工状態の
良好な波形〔第2図(C)〕は、溶融物Cl0O量の多
い穴あけ加工状態が不良な波形〔第2図[有])〕と比
較してトリガ信号後のセンサ出力が小さく急激に出力が
小さくなるのに対し、溶融物00の量の多い波形〔第2
図(D)〕は緩やかな出力の減少を示す。この出力減少
の状態の相違について一例を挙げると、トリガ信号から
センサ出力が「0」になるまでの時間Tc第2図(C)
、■)〕を加工状態判別装置(8)によって計算し、こ
の時間での値によって穴あけ加工状態の良否を判別しよ
うとするものである。
Figure (B) shows a case where the molten material (ICI 12) around the machined hole (5) is small and the machining condition is good, and a case where the machining condition is good because the amount of the molten material α1 is large is shown in Figure (B). A defective case is shown in FIG. 6(C), and the intensity and temporal change of the infrared rays and heat generated from the melt 01 (6) depend on the amount and temperature of the melt 01. Since the sensor (force and machining state discriminator (8)) are different, it is possible to determine the drilling state by detecting this using the sensor (force and machining state discriminator (8)). 7
) shows an example of the waveform of the detection signal Ql in Figure 2 (
C) shows the waveform when the drilling condition is good as shown in Figure 3 (B), and the waveform in Figure 2) shows the waveform in Figure 6 (
The waveform shown in C) shows a waveform when the drilling state is poor, and the waveform when the drilling state is good with a small amount of melt α1 (Fig. 2(C)) is the waveform when the drilling state is poor, as shown in Fig. 2(C). The sensor output after the trigger signal is small and the output decreases rapidly compared to the waveform with a poor drilling state [Figure 2 [present]], whereas the waveform with a large amount of melt 00 [2nd
Figure (D) shows a gradual decrease in output. To give an example of the difference in the state of output reduction, the time Tc from the trigger signal until the sensor output becomes "0" is shown in Fig. 2 (C).
.

なお、上述した一実施例においては、第1図に示すよう
にセンサ(7)を被加工物(4)の高エネルギビーム(
3)の照射面側に配設した場合について述べたが、反照
射面側に配設しても同様の効果が得られる。また、上述
した一実施例においてはセンサ(7)によって赤外線お
よび熱電子を検出する場合について述べたが、これに限
定されるものでなく、可視光線などの強度および時間的
変化を検出するようにしても同様の効果が得られる。さ
らに、穴あけ加工状態の良否判定のパラメータの一例と
してセンサ出力の減衰時間Tについて述べたが、これ、
  についてもセンサ出力の絶対値などのような他のパ
ラメータでも同様の効果を奏することはいうまでもない
。さらにまた、上述した一実施例においては、加工穴(
5)の良否判別のみを行なう場合について述べたが、た
とえば加工状態判別装置(8)からの情報を出力制御装
置(2)にフィードバックして穴あけ加工状態の安定化
を計ることも可能である。
In the above-mentioned embodiment, the sensor (7) is connected to the high-energy beam (4) of the workpiece (4) as shown in FIG.
Although the case of 3) where it is disposed on the irradiated surface side has been described, the same effect can be obtained even if it is disposed on the opposite side of the irradiated surface. Furthermore, in the above-mentioned embodiment, a case was described in which the sensor (7) detects infrared rays and thermoelectrons, but the invention is not limited to this. The same effect can be obtained. Furthermore, we have described the decay time T of the sensor output as an example of a parameter for determining the quality of the drilling process, but this
It goes without saying that similar effects can be achieved with other parameters such as the absolute value of the sensor output. Furthermore, in the above-described embodiment, the machined hole (
Although the case in which only the quality determination in 5) is performed has been described, it is also possible, for example, to feed back information from the machining state determination device (8) to the output control device (2) to stabilize the drilling machining state.

〔発明の効果〕〔Effect of the invention〕

以上述べたように、この発明によれば高エネルギビーム
による穴あけ加工時に、加工穴周辺の溶融物から発生す
る赤外線および熱電子などをセンサによって検出し、そ
の強度および時間的変化などから加工状態判別装置によ
り穴あけ加工状態を判別するようにしたので、従来のよ
うに穴あけ加工状態を判別するために被加工物を切断す
る必要がなく、非接触方式で簡単、迅速かつ短時間に穴
あけ加工状態の判別を行なうことができるばかりでなく
、加工状態の判別作業の自動化が可能になる優れた効果
を有するものである。
As described above, according to the present invention, when drilling with a high-energy beam, a sensor detects infrared rays and thermoelectrons generated from the molten material around the drilled hole, and the processing state can be determined from the intensity and temporal changes. Since the device determines the drilling status, there is no need to cut the workpiece to determine the drilling status as in the past, and it is possible to easily, quickly and quickly determine the drilling status using a non-contact method. This method not only enables discrimination, but also has the excellent effect of automating the work of discriminating processing conditions.

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第6図は何れもこの発明の一実施例を示すもの
で、第1図は高エネルギビームによる加工状態判別装置
を示すブロック図、第2図(4)〜(D)はこの発明の
加工判別方法の動作を説明するための波形図、第6図囚
〜(C1はこの発明の加工判別方法による判別動作を説
明するための被加工物の断面図である。第4図(A)〜
(C)は従来の穴あけ加工状態判別方法を説明するため
の工程図である。 図において、(1)は高エネルギビーム発生装置、(2
)は出力制御装置、(3) #′i高エネルギビーム、
(4)は被加工物、(5)は加工穴、(6)は赤外線お
よび熱電子、(7)はセンサ、(8)は加工状態判別装
置、(9)はトリガ信号、(2)はセンサ検出信号であ
る。なお、図中同一符号は同一または相当部分を示す。
Figures 1 to 6 all show one embodiment of the present invention. Figure 1 is a block diagram showing a machining state discrimination device using a high-energy beam, and Figures 2 (4) to (D) are block diagrams of this device. Waveform diagrams for explaining the operation of the machining discrimination method of the invention, FIGS. A)~
(C) is a process diagram for explaining a conventional method for determining the drilling state. In the figure, (1) is a high-energy beam generator, (2
) is the output control device, (3) #'i high energy beam,
(4) is the workpiece, (5) is the machined hole, (6) is infrared rays and thermoelectrons, (7) is the sensor, (8) is the processing state discriminator, (9) is the trigger signal, (2) is This is a sensor detection signal. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (2)

【特許請求の範囲】[Claims] (1)高エネルギビームによる穴あけ加工時に、加工穴
周辺の溶融物から発生する赤外線、熱電子および可視光
線などをセンサによつて検出し、その強度および時間的
変化などから穴あけ加工状態を判別するようにしたこと
を特徴とするエネルギビームによる加工状態判別方法。
(1) During drilling using a high-energy beam, a sensor detects infrared rays, thermoelectrons, visible light, etc. generated from the molten material around the drilled hole, and the drilling status is determined from the intensity and temporal changes. A method for determining machining status using an energy beam, characterized in that:
(2)被加工物に高エネルギビームを照射する高エネル
ギビーム発生装置と、上記高エネルギビームによつて形
成された加工穴周辺の溶融物から発生する赤外線、熱電
子および可視光線などを検出するセンサと、上記高エネ
ルギビーム出力を制御するとともに、このエネルギビー
ム出力を瞬間的に減少させたときにトリガ信号を発生す
る出力制御装置と、上記センサの検出信号とトリガ信号
とによつて穴あけ加工状態を判別する加工状態判別装置
とによつて構成されていることを特徴とするエネルギビ
ームによる加工状態判別装置。
(2) A high-energy beam generator that irradiates the workpiece with a high-energy beam, and detects infrared rays, thermoelectrons, visible light, etc. generated from the molten material around the machined hole formed by the high-energy beam. A sensor, an output control device that controls the high-energy beam output and generates a trigger signal when the energy beam output is instantaneously reduced, and a hole-drilling process using the detection signal of the sensor and the trigger signal. 1. A machining state discriminating device using an energy beam, comprising: a machining state discriminating device for discriminating a state.
JP60215150A 1985-09-30 1985-09-30 Method and device for discriminating working state by energy beam Pending JPS6277195A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60215150A JPS6277195A (en) 1985-09-30 1985-09-30 Method and device for discriminating working state by energy beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60215150A JPS6277195A (en) 1985-09-30 1985-09-30 Method and device for discriminating working state by energy beam

Publications (1)

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JPS6277195A true JPS6277195A (en) 1987-04-09

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Family Applications (1)

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JP60215150A Pending JPS6277195A (en) 1985-09-30 1985-09-30 Method and device for discriminating working state by energy beam

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448687A (en) * 1987-08-17 1989-02-23 Mitsubishi Electric Corp Laser beam machine
US5006694A (en) * 1988-03-08 1991-04-09 Messerschmitt-Boelkow-Blohm Gmbh Robot type apparatus for performing a plurality of operations on a work piece
US7126124B2 (en) 2003-05-19 2006-10-24 Fuji Photo Film Co., Ltd. Marking determining method and marking determining apparatus
JP2011527637A (en) * 2008-07-09 2011-11-04 エフ・イ−・アイ・カンパニー Method and apparatus for laser machining

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6448687A (en) * 1987-08-17 1989-02-23 Mitsubishi Electric Corp Laser beam machine
US5006694A (en) * 1988-03-08 1991-04-09 Messerschmitt-Boelkow-Blohm Gmbh Robot type apparatus for performing a plurality of operations on a work piece
US7126124B2 (en) 2003-05-19 2006-10-24 Fuji Photo Film Co., Ltd. Marking determining method and marking determining apparatus
JP2011527637A (en) * 2008-07-09 2011-11-04 エフ・イ−・アイ・カンパニー Method and apparatus for laser machining
US8853592B2 (en) 2008-07-09 2014-10-07 Fei Company Method for laser machining a sample having a crystalline structure
US10493559B2 (en) 2008-07-09 2019-12-03 Fei Company Method and apparatus for laser machining

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