JPS627692B2 - - Google Patents
Info
- Publication number
- JPS627692B2 JPS627692B2 JP57156254A JP15625482A JPS627692B2 JP S627692 B2 JPS627692 B2 JP S627692B2 JP 57156254 A JP57156254 A JP 57156254A JP 15625482 A JP15625482 A JP 15625482A JP S627692 B2 JPS627692 B2 JP S627692B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- mask
- monitor pattern
- alignment
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57156254A JPS5944827A (ja) | 1982-09-06 | 1982-09-06 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57156254A JPS5944827A (ja) | 1982-09-06 | 1982-09-06 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5944827A JPS5944827A (ja) | 1984-03-13 |
JPS627692B2 true JPS627692B2 (enrdf_load_html_response) | 1987-02-18 |
Family
ID=15623764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57156254A Granted JPS5944827A (ja) | 1982-09-06 | 1982-09-06 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5944827A (enrdf_load_html_response) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5976980A (en) * | 1994-11-23 | 1999-11-02 | Intel Corporation | Method and apparatus providing a mechanical probe structure in an integrated circuit die |
US6153891A (en) * | 1994-11-23 | 2000-11-28 | Intel Corporation | Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die |
US6020746A (en) * | 1994-11-23 | 2000-02-01 | Intel Corporation | Method and apparatus for probing an integrated circuit through the back side of an integrated circuit die |
US5952247A (en) * | 1994-11-23 | 1999-09-14 | Intel Corporation | Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate |
US5904486A (en) * | 1997-09-30 | 1999-05-18 | Intel Corporation | Method for performing a circuit edit through the back side of an integrated circuit die |
US6309897B1 (en) | 1997-09-30 | 2001-10-30 | Intel Corporation | Method and apparatus providing a circuit edit structure through the back side of an integrated circuit die |
US6159754A (en) * | 1998-05-07 | 2000-12-12 | Intel Corporation | Method of making a circuit edit interconnect structure through the backside of an integrated circuit die |
US6692995B2 (en) | 2002-04-05 | 2004-02-17 | Intel Corporation | Physically deposited layer to electrically connect circuit edit connection targets |
-
1982
- 1982-09-06 JP JP57156254A patent/JPS5944827A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5944827A (ja) | 1984-03-13 |
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