JPS6274100A - Electrode for electroplating not damaging electrode supporting stand - Google Patents

Electrode for electroplating not damaging electrode supporting stand

Info

Publication number
JPS6274100A
JPS6274100A JP21280385A JP21280385A JPS6274100A JP S6274100 A JPS6274100 A JP S6274100A JP 21280385 A JP21280385 A JP 21280385A JP 21280385 A JP21280385 A JP 21280385A JP S6274100 A JPS6274100 A JP S6274100A
Authority
JP
Japan
Prior art keywords
electrode
electroplating
plates
metal
members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21280385A
Other languages
Japanese (ja)
Other versions
JPS648720B2 (en
Inventor
Chiaki Kato
千昭 加藤
Koji Yamato
康二 大和
Shigeki Taniguchi
茂樹 谷口
Kazuya Ono
一哉 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Steel Corp
Original Assignee
Kawasaki Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Steel Corp filed Critical Kawasaki Steel Corp
Priority to JP21280385A priority Critical patent/JPS6274100A/en
Publication of JPS6274100A publication Critical patent/JPS6274100A/en
Publication of JPS648720B2 publication Critical patent/JPS648720B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the breaking of electrode supporting stands by the generation of sparks during the supply of electric current by interposing layers of a low m.p. metal between an electrode for electroplating and the electrode supporting stands. CONSTITUTION:An electrode 1 for electroplating fitted with plates 2 of a low m.p. metal is placed on electrode supporting members 3 as shown by the figure. The electrode 1 is made of a high m.p. metal such as Fe or Ni. The low m.p. metal forming the plates 2 may be Zn, Sn or Pb and the thickness of the plates 2 is >=about 2mm. Positive current necessary for electroplating flows into the members 3 from the outside of a plating tank and reaches the surface of the electrode 1 through the plates 2. An electrochemical reaction is caused on the surface of the electrode 1 and plating is carried out. Even when sparks are generated, the plates 2 absorb the energy, melt readily and prevent the temp. of the members 3 from rising to a high value, so the breaking of the members 3 is prevented.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は電気めっき用電極で、その支持台との通電面が
低融点金属でできており、通電中のスパーク発生に際し
て電極支持台の破損を防止する機能を有する電気めっき
用電極に関する。
[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an electrode for electroplating, in which the current-carrying surface with the support base is made of a low-melting point metal, and the electrode support base is damaged when sparks are generated during energization. The present invention relates to an electroplating electrode that has the function of preventing.

〈従来技術とその問題点〉 一般に、連続電気めっきライン、特に水平型セルまたは
ラジアル型セルにおける電極はめつき液中で電極支持′
台りに静置し保持されるとともに、支持台を介し電極通
電面に通電される。したがって、電極通電面は通電性良
好なことが要求される。しかしながら、通電面がどんな
に研摩された金属面であっても、通電する電気量が振動
等により通電面で部分的に増減し、電極通電面一電極支
持部間でスパークが発生するという不都合が生じる。
<Prior art and its problems> In general, electrodes in continuous electroplating lines, especially horizontal cells or radial cells, are supported in the plating solution.
It is placed and held on a stand, and electricity is applied to the electrode current-carrying surface via the support stand. Therefore, the electrode current-carrying surface is required to have good current-carrying properties. However, no matter how polished the metal surface is, the amount of electricity flowing through the current-carrying surface increases or decreases locally due to vibrations, etc., resulting in the inconvenience that sparks occur between the electrode current-carrying surface and the electrode support. .

従来においては、Fe、Ni電極、バスケット型電極、
Ti、Nb等高融点電極材料がそのまま通電面に使用さ
れており、スパーク発生の際電極通電面が部分的に溶解
し、表面を荒くし、さらにスパーク発生しやすくするば
かりか、カーボン。
Conventionally, Fe, Ni electrodes, basket-type electrodes,
High melting point electrode materials such as Ti and Nb are used as they are on the current-carrying surface, and when a spark occurs, the current-carrying surface of the electrode partially melts, making the surface rough and even more likely to generate sparks, as well as carbon.

Ti等製の゛電極支持台を破損させる問題がある。There is a problem that the electrode support base made of Ti or the like may be damaged.

゛電極支持台の破損を防ぐ方法として、実公昭59−1
3252号が知られており、この方法では電極支持台北
に金属炭化物を形成させ、耐スパーク性を持たせている
。このように電極支持台]二に金属炭化物を形成させる
方法には、プラズマ、溶射等があるが、金属炭化物の密
着性不良などの問題がある。
゛As a method to prevent damage to the electrode support stand,
No. 3252 is known, and in this method a metal carbide is formed on the electrode support to provide spark resistance. Methods for forming metal carbide on the electrode support base include plasma, thermal spraying, etc., but these methods have problems such as poor adhesion of the metal carbide.

〈発明の目的〉 本発明の目的は、電極支持台と接触する電極の通電面に
低融点金属を介在させることにより、高融点金属電極使
用時のスパークによる電極支持台の破損を防IFするこ
とができる電極支持台を痛めない電気めっき用電極を提
供しようとするにある。
<Object of the Invention> The object of the present invention is to prevent damage to the electrode support base due to sparks when using a high melting point metal electrode by interposing a low melting point metal on the current-carrying surface of the electrode that contacts the electrode support base. The purpose of the present invention is to provide an electrode for electroplating that does not damage the electrode support base.

〈発明の構成〉 本発明は、電気めっき用電極と電極支持台との間に低融
点金属層を形成してなることを特徴とする電極支持台を
痛めないめっき用電極を提供するものである。
<Structure of the Invention> The present invention provides a plating electrode that does not damage the electrode support, which is characterized by forming a low melting point metal layer between the electroplating electrode and the electrode support. .

次に、本発明に係る電気めっき用電極について添付図面
に示す好適実施例により詳細に説明する。
Next, the electroplating electrode according to the present invention will be explained in detail with reference to preferred embodiments shown in the accompanying drawings.

添付図面は本発明に係る電気めっき用電極、電極支持部
材(台)の部分断面図である。第1図は水平型セル用の
、第2図はラジアル型セル用の電極である。
The accompanying drawing is a partial cross-sectional view of an electroplating electrode and an electrode support member (stand) according to the present invention. FIG. 1 shows an electrode for a horizontal cell, and FIG. 2 shows an electrode for a radial cell.

即ち、電極支持部材3上に、低融点金属板2を取り付け
た電気めっき用電極1が、静置保持される。′電気めっ
きに要する正電流は、めっき槽外より電極支持部材3に
流れ、低融点金属板2を経て電極1表面で′心気化学反
応を起こし、めっきに供される。
That is, the electroplating electrode 1 to which the low melting point metal plate 2 is attached is held stationary on the electrode support member 3. The positive current required for electroplating flows from outside the plating tank to the electrode support member 3, passes through the low melting point metal plate 2, causes a chemical reaction on the surface of the electrode 1, and is used for plating.

本発明に係る電気めっき用電極はFe 、 N iまた
は、バスケット型電極Ti、Nb等の高融点金属電極の
通電面に、低融点金属のZn、Sn。
The electroplating electrode according to the present invention includes a low melting point metal such as Zn or Sn on the current carrying surface of a high melting point metal electrode such as Fe, Ni or a basket type electrode such as Ti or Nb.

Pbまたはそれらの合金板をボルト、ネジ等で張り付け
る。これらの板厚は、2mm以上であれば所期の[1的
を構成できる。また板を張り付ける外にめっき、溶射等
により低融点金属を形成することもできる。
Attach Pb or its alloy plate with bolts, screws, etc. If the thickness of these plates is 2 mm or more, the desired [1 target] can be formed. Furthermore, a low melting point metal may be formed on the surface of the plate by plating, thermal spraying, etc.

本発明の電極においては、に述したように、電極材及び
電極支持部材よりも低融点を持つ金属層を画材間の電極
通電面に形成させ、この金属層を介して電極支持台より
陰極に面した電極表面へ通電させる。低融点金属が電極
支持台と接している場合には、スパークが発生しても、
この低融点金属の溶解が容易に起こり、そのエネルギー
吸収のため、電極支持台の高温化をさまたげ、破損を防
止する。
In the electrode of the present invention, as described above, a metal layer having a lower melting point than the electrode material and the electrode support member is formed on the electrode current-carrying surface between the art materials, and the electrode is connected to the cathode from the electrode support through this metal layer. Electrify the facing electrode surface. If a low melting point metal is in contact with the electrode support, even if a spark occurs,
This low melting point metal easily melts and absorbs its energy, thereby preventing the electrode support from becoming too hot and being damaged.

〈実施例〉 このような構成を有する本発明に係る電気メツキ用電極
の実施態様を比較例と比較して説明する。その結果を次
表に示す、これから明らかなように、電極とその支持台
との間の通電面に低融点金属を介在せしめれば、支持台
に損傷は生じないことがわかる。
<Example> An embodiment of the electroplating electrode according to the present invention having such a configuration will be described in comparison with a comparative example. The results are shown in the following table, and as is clear from the table, it can be seen that if a low melting point metal is interposed on the current-carrying surface between the electrode and its support, no damage will occur to the support.

〈発明の効果〉 実施例からも明らかなように、本発明に係る電極は、ス
パークを発生した際支持台を破損することがないので、
支持台の修理または、交換回数を大幅に減少させること
ができ原単位の向上かはか06・          
        2
<Effects of the Invention> As is clear from the examples, the electrode according to the present invention does not damage the support base when sparks are generated.
Is it possible to significantly reduce the number of repairs or replacements of the support base and improve the basic unit?06.
2

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2図は本発明の電極の構成例を示す側面
図である。 符合の説明 1・・・・電極、2・・・・低融点金属板3・・・・電
極支持部 FIG、1
FIG. 1 and FIG. 2 are side views showing an example of the structure of the electrode of the present invention. Explanation of symbols 1... Electrode, 2... Low melting point metal plate 3... Electrode support part FIG, 1

Claims (1)

【特許請求の範囲】[Claims] (1)電気めっき用電極と電極支持台との間に低融点金
属層を形成してなることを特徴とする電極支持台を痛め
ないめっき用電極。
(1) A plating electrode that does not damage the electrode support, characterized by forming a low melting point metal layer between the electroplating electrode and the electrode support.
JP21280385A 1985-09-26 1985-09-26 Electrode for electroplating not damaging electrode supporting stand Granted JPS6274100A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21280385A JPS6274100A (en) 1985-09-26 1985-09-26 Electrode for electroplating not damaging electrode supporting stand

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21280385A JPS6274100A (en) 1985-09-26 1985-09-26 Electrode for electroplating not damaging electrode supporting stand

Publications (2)

Publication Number Publication Date
JPS6274100A true JPS6274100A (en) 1987-04-04
JPS648720B2 JPS648720B2 (en) 1989-02-15

Family

ID=16628631

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21280385A Granted JPS6274100A (en) 1985-09-26 1985-09-26 Electrode for electroplating not damaging electrode supporting stand

Country Status (1)

Country Link
JP (1) JPS6274100A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62294199A (en) * 1986-06-12 1987-12-21 Kobe Steel Ltd Anode for electroplating

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4916343U (en) * 1972-05-15 1974-02-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4916343U (en) * 1972-05-15 1974-02-12

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62294199A (en) * 1986-06-12 1987-12-21 Kobe Steel Ltd Anode for electroplating

Also Published As

Publication number Publication date
JPS648720B2 (en) 1989-02-15

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