JPS6270451U - - Google Patents
Info
- Publication number
- JPS6270451U JPS6270451U JP16219085U JP16219085U JPS6270451U JP S6270451 U JPS6270451 U JP S6270451U JP 16219085 U JP16219085 U JP 16219085U JP 16219085 U JP16219085 U JP 16219085U JP S6270451 U JPS6270451 U JP S6270451U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- shaped
- terminal
- semiconductor device
- caulked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来のスタツド型ダイオードの断面図である。
１……金属支持体、２……半導体素子、３……
内部リード、４……ガラス絶縁体、５……外部端
子導体、６……金属フランジ、７……カシメ部、
９……絞り部、１０，１１……軟ろう。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional stud-type diode. 1... Metal support, 2... Semiconductor element, 3...
Internal lead, 4... Glass insulator, 5... External terminal conductor, 6... Metal flange, 7... Caulking part,
9... Drawing part, 10, 11... Soft solder.
Claims (1)
縁体の中心部を貫通した管状の外部端子導体内に
、金属支持体上に固着された半導体素子に接続さ
れた線状の内部端子導体を通し、前記外部端子導
体をカシメて前記内外の端子導体を接続した端子
構造をもつ半導体装置において、前記外部端子導
体には、そのカシメ部とガラス絶縁体との間に絞
り部が設けられていることを特徴とする半導体装
置。 A wire-shaped inner terminal connected to a semiconductor element fixed on a metal support within a tubular outer terminal conductor passing through the center of a plate-shaped glass insulator forming a part of the cap-shaped envelope. In a semiconductor device having a terminal structure in which the external terminal conductor is caulked through a conductor to connect the inner and outer terminal conductors, the external terminal conductor is provided with a constricted portion between the caulked portion and the glass insulator. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16219085U JPS6270451U (en) | 1985-10-22 | 1985-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16219085U JPS6270451U (en) | 1985-10-22 | 1985-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6270451U true JPS6270451U (en) | 1987-05-02 |
Family
ID=31089217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16219085U Pending JPS6270451U (en) | 1985-10-22 | 1985-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6270451U (en) |
-
1985
- 1985-10-22 JP JP16219085U patent/JPS6270451U/ja active Pending
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