JPH01171042U - - Google Patents
Info
- Publication number
- JPH01171042U JPH01171042U JP6787388U JP6787388U JPH01171042U JP H01171042 U JPH01171042 U JP H01171042U JP 6787388 U JP6787388 U JP 6787388U JP 6787388 U JP6787388 U JP 6787388U JP H01171042 U JPH01171042 U JP H01171042U
- Authority
- JP
- Japan
- Prior art keywords
- electrode terminal
- external electrode
- connecting wire
- glass insulator
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Thyristors (AREA)
Description
第１図は本考案の一実施例の一部破断正面図、
第２図は本考案の他の実施例の一部破断正面図、
第３図は従来の半導体装置の一部破断正面図を示
す。
１……金属支持体、２……ネジ部、３……半導
体素子、４，５……連結線、６……金属フランジ
、７……ガラス絶縁体、８……外部電極端子、９
……ゲート端子、１０……カシメ部、１１……丸
形突起、１２……スパイラル突起。
FIG. 1 is a partially cutaway front view of an embodiment of the present invention.
FIG. 2 is a partially cutaway front view of another embodiment of the present invention;
FIG. 3 shows a partially cutaway front view of a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1...Metal support body, 2...Screw part, 3...Semiconductor element, 4, 5...Connection line, 6...Metal flange, 7...Glass insulator, 8...External electrode terminal, 9
... Gate terminal, 10 ... Caulking part, 11 ... Round projection, 12 ... Spiral projection.
Claims (1)
線を、容器のガラス絶縁体を貫通する筒状の外部
電極端子内に挿入させ、かつその一部においてカ
シメ加工して連結線を該外部電極端子に機械的に
接続した半導体装置において、前記外部電極端子
のガラス絶縁体との接触部の外面に複数個の丸形
突起を形成したことを特徴とする半導体装置。 A connecting wire connected to the semiconductor element fixed in the container is inserted into a cylindrical external electrode terminal that penetrates the glass insulator of the container, and a part of the connecting wire is caulked to connect the connecting wire to the external electrode terminal. 1. A semiconductor device mechanically connected to a glass insulator, wherein a plurality of round protrusions are formed on the outer surface of a contact portion of the external electrode terminal with a glass insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6787388U JPH01171042U (en) | 1988-05-23 | 1988-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6787388U JPH01171042U (en) | 1988-05-23 | 1988-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171042U true JPH01171042U (en) | 1989-12-04 |
Family
ID=31293216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6787388U Pending JPH01171042U (en) | 1988-05-23 | 1988-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171042U (en) |
-
1988
- 1988-05-23 JP JP6787388U patent/JPH01171042U/ja active Pending