JPH01171042U - - Google Patents

Info

Publication number
JPH01171042U
JPH01171042U JP6787388U JP6787388U JPH01171042U JP H01171042 U JPH01171042 U JP H01171042U JP 6787388 U JP6787388 U JP 6787388U JP 6787388 U JP6787388 U JP 6787388U JP H01171042 U JPH01171042 U JP H01171042U
Authority
JP
Japan
Prior art keywords
electrode terminal
external electrode
connecting wire
glass insulator
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6787388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6787388U priority Critical patent/JPH01171042U/ja
Publication of JPH01171042U publication Critical patent/JPH01171042U/ja
Pending legal-status Critical Current

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  • Thyristors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の一部破断正面図、
第2図は本考案の他の実施例の一部破断正面図、
第3図は従来の半導体装置の一部破断正面図を示
す。 1……金属支持体、2……ネジ部、3……半導
体素子、4,5……連結線、6……金属フランジ
、7……ガラス絶縁体、8……外部電極端子、9
……ゲート端子、10……カシメ部、11……丸
形突起、12……スパイラル突起。
FIG. 1 is a partially cutaway front view of an embodiment of the present invention.
FIG. 2 is a partially cutaway front view of another embodiment of the present invention;
FIG. 3 shows a partially cutaway front view of a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1...Metal support body, 2...Screw part, 3...Semiconductor element, 4, 5...Connection line, 6...Metal flange, 7...Glass insulator, 8...External electrode terminal, 9
... Gate terminal, 10 ... Caulking part, 11 ... Round projection, 12 ... Spiral projection.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 容器内に固着した半導体素子に接続された連結
線を、容器のガラス絶縁体を貫通する筒状の外部
電極端子内に挿入させ、かつその一部においてカ
シメ加工して連結線を該外部電極端子に機械的に
接続した半導体装置において、前記外部電極端子
のガラス絶縁体との接触部の外面に複数個の丸形
突起を形成したことを特徴とする半導体装置。
A connecting wire connected to the semiconductor element fixed in the container is inserted into a cylindrical external electrode terminal that penetrates the glass insulator of the container, and a part of the connecting wire is caulked to connect the connecting wire to the external electrode terminal. 1. A semiconductor device mechanically connected to a glass insulator, wherein a plurality of round protrusions are formed on the outer surface of a contact portion of the external electrode terminal with a glass insulator.
JP6787388U 1988-05-23 1988-05-23 Pending JPH01171042U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6787388U JPH01171042U (en) 1988-05-23 1988-05-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6787388U JPH01171042U (en) 1988-05-23 1988-05-23

Publications (1)

Publication Number Publication Date
JPH01171042U true JPH01171042U (en) 1989-12-04

Family

ID=31293216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6787388U Pending JPH01171042U (en) 1988-05-23 1988-05-23

Country Status (1)

Country Link
JP (1) JPH01171042U (en)

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