JPH0175838U - - Google Patents
Info
- Publication number
- JPH0175838U JPH0175838U JP1987172174U JP17217487U JPH0175838U JP H0175838 U JPH0175838 U JP H0175838U JP 1987172174 U JP1987172174 U JP 1987172174U JP 17217487 U JP17217487 U JP 17217487U JP H0175838 U JPH0175838 U JP H0175838U
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- metal tube
- temperature sensor
- hole
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
第１図はこの考案の実施例である温度センサの
構造を表す断面図、第２図Ａ，Ｂおよび第３図は
同温度センサの組立手順を表す斜視図である。第
４図は従来例と比較した上記実施例の温度センサ
の特性を表す図である。第５図は従来の温度セン
サの構造を表す断面図である。
１……サーミスタ（ガラス封入型）、２ａ，２
ｂ……リード端子、３，３１，３２……絶縁被覆
リード線、４……金属管、５……充填樹脂、Ｈ…
…貫通孔。
FIG. 1 is a sectional view showing the structure of a temperature sensor according to an embodiment of this invention, and FIGS. 2A, B, and 3 are perspective views showing the assembly procedure of the temperature sensor. FIG. 4 is a diagram showing the characteristics of the temperature sensor of the above embodiment in comparison with the conventional example. FIG. 5 is a sectional view showing the structure of a conventional temperature sensor. 1...Thermistor (glass sealed type), 2a, 2
b... Lead terminal, 3, 31, 32... Insulated lead wire, 4... Metal tube, 5... Filled resin, H...
...Through hole.
Claims (1)
され、そのサーミスタのリード端子に絶縁被覆リ
ード線が接続され、前記金属管内に樹脂が充填さ
れた温度センサにおいて、 金属管の底部に貫通孔を形成し、サーミスタの
一方のリード端子を前記貫通孔の周囲に電気的に
接続するとともに、一方の絶縁被覆リード線を前
記金属管に接続したことを特徴とする温度センサ
。[Scope of Claim for Utility Model Registration] A temperature sensor in which a glass-sealed thermistor is housed in a bottomed metal tube, an insulated lead wire is connected to the lead terminal of the thermistor, and the metal tube is filled with resin, comprising: A temperature sensor characterized in that a through hole is formed in the bottom of the thermistor, one lead terminal of the thermistor is electrically connected around the through hole, and one insulated lead wire is connected to the metal tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987172174U JPH0175838U (en) | 1987-11-11 | 1987-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987172174U JPH0175838U (en) | 1987-11-11 | 1987-11-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0175838U true JPH0175838U (en) | 1989-05-23 |
Family
ID=31464155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987172174U Pending JPH0175838U (en) | 1987-11-11 | 1987-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0175838U (en) |
-
1987
- 1987-11-11 JP JP1987172174U patent/JPH0175838U/ja active Pending