JPS6155054B2 - - Google Patents
Info
- Publication number
- JPS6155054B2 JPS6155054B2 JP9689484A JP9689484A JPS6155054B2 JP S6155054 B2 JPS6155054 B2 JP S6155054B2 JP 9689484 A JP9689484 A JP 9689484A JP 9689484 A JP9689484 A JP 9689484A JP S6155054 B2 JPS6155054 B2 JP S6155054B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film thermistor
- ceramic
- temperature sensor
- thermistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 12
- 239000010409 thin film Substances 0.000 claims description 11
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 230000004043 responsiveness Effects 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/223—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor characterised by the shape of the resistive element
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Thermistors And Varistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Description
【発明の詳細な説明】
本発明は高応答性で取扱いが容易な温度センサ
に係り、安価なものを提供しようとするものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a temperature sensor that is highly responsive and easy to handle, and is intended to provide an inexpensive temperature sensor.
従来における温度センサとしては、第１図に示
すように、チツプサーミスタ１の両電極２に半田
３によりリード線４を接続したものに外装樹脂５
をデイツプ方式により施し、これを埋込用樹脂６
とともに金属ケース７に収納して構成されてい
た。 As shown in FIG. 1, a conventional temperature sensor has a chip thermistor 1 with lead wires 4 connected to both electrodes 2 with solder 3, and an exterior resin 5.
is applied using the dip method, and this is applied to the mounting resin 6.
It was constructed by being housed in a metal case 7.
この構成によるものは、応答性が悪く、バラツ
キも大きく、生産時の作業性も悪いといつた欠点
があつた。 This configuration had drawbacks such as poor responsiveness, large variations, and poor workability during production.
本発明は以上のような従来の欠点を除去するも
のである。 The present invention eliminates the drawbacks of the prior art as described above.
以下、本発明の実施例を図面第２図〜第４図に
より説明する。 Embodiments of the present invention will be described below with reference to FIGS. 2 to 4 of the drawings.
８，８′は一方に開口を有する円筒体を２分割
して構成されたアルミナなどの熱伝導性に優れた
セラミツクケースで、この一方のセラミツクケー
ス８の内面にはサーミスタ特性をもつ材料を蒸着
または印刷により形成し、薄膜サーミスタ９が設
けられ、この薄膜サーミスタ９の両端には電極１
０，１１が形成され、この電極１０，１１にはリ
ード線１２が半田１３により接続され、セラミツ
クケース８の開口から外部に引出されている。 8 and 8' are ceramic cases with excellent thermal conductivity such as alumina, which are constructed by dividing a cylindrical body with an opening on one side into two, and a material having thermistor properties is deposited on the inner surface of one of the ceramic cases 8. Alternatively, a thin film thermistor 9 is formed by printing, and electrodes 1 are provided at both ends of the thin film thermistor 9.
Lead wires 12 are connected to these electrodes 10 and 11 by solder 13, and are drawn out from the opening of the ceramic case 8.
上記セラミツクケース８，８′は接着剤によつ
て貼合せられ、このセラミツクケース８，８′の
内部には絶縁物１４などが充填されて薄膜サーミ
スタ９部を密閉している。 The ceramic cases 8, 8' are bonded together with an adhesive, and the interior of the ceramic cases 8, 8' is filled with an insulator 14 to seal the thin film thermistor 9.
このような構成とすることによつて、セラミツ
クケース８，８′は熱伝導性に優れているため、
応答性に優れたものとなり、薄膜サーミスタ９も
蒸着や印刷で形成できるため、生産性の向上が計
れることになる。 With this configuration, the ceramic cases 8, 8' have excellent thermal conductivity, so
It has excellent responsiveness, and the thin film thermistor 9 can also be formed by vapor deposition or printing, so productivity can be improved.
また、第３図，第４図に示すものは、リード線
１２の引出側に長い絶縁筒１５を引出してリード
線１２の絶縁性の向上を計つたもので測定部への
間に長い距離があつても絶縁性の点で安全なもの
としたものである。 Furthermore, in the case shown in FIGS. 3 and 4, a long insulating tube 15 is drawn out on the drawing side of the lead wire 12 to improve the insulation properties of the lead wire 12, and a long distance between the lead wire 12 and the measuring section is used. It is made to be safe from the point of view of insulation.
この絶縁筒１５は合成樹脂あるいはセラミツク
材によつて構成することができる。 This insulating cylinder 15 can be made of synthetic resin or ceramic material.
また、上記実施例においては、セラミツクケー
ス８の内面のみに薄膜サーミスタ９を形成するも
のについて述べたが、セラミツクケース８′の内
面にも同様に薄膜サーミスタ９、電極１０，１１
を形成し、これを貼合せ時に導通状態に組合せる
構成とし応答性のより確実なものとすることもで
きる。 In the above embodiment, the thin film thermistor 9 is formed only on the inner surface of the ceramic case 8, but the thin film thermistor 9 and the electrodes 10, 11 are also formed on the inner surface of the ceramic case 8'.
It is also possible to form a structure and combine these into a conductive state at the time of bonding, thereby making the responsiveness more reliable.
以上のように本発明の温度センサは、熱伝導性
に優れたセラミツクケースの内面に薄膜サーミス
タ、電極を形成する構成としたため、応答性の優
れたものとなり、しかも薄膜サーミスタの形成も
蒸着や印刷によつて簡単となり、きわめて生産性
に富み、高品質で安価なものとすることができ、
内部に絶縁物を充填して密閉構造としても応答性
が劣化することもなく、きわめて優れたものとな
り実用的価値の大なるものである。 As described above, the temperature sensor of the present invention has a structure in which a thin film thermistor and electrodes are formed on the inner surface of a ceramic case with excellent thermal conductivity, so it has excellent responsiveness, and the thin film thermistor can be formed by vapor deposition or printing. It is simple, extremely productive, high quality, and inexpensive.
Even if the structure is sealed by filling the inside with an insulating material, the responsiveness does not deteriorate, and the result is extremely excellent and has great practical value.
第１図は従来の温度センサの断面図、第２図は
本発明の温度センサの一実施例を示す一部切欠分
解斜視図、第３図は同温度センサの応用例の組立
途上の一部切欠斜視図、第４図は同完成した状態
の斜視図である。
８，８′……セラミツクケース、９……薄膜サ
ーミスタ、１０，１１……電極、１２……リード
線、１３……半田、１４……絶縁物、１５……絶
縁筒。
Fig. 1 is a sectional view of a conventional temperature sensor, Fig. 2 is a partially cutaway exploded perspective view showing an embodiment of the temperature sensor of the present invention, and Fig. 3 is a part of an application example of the temperature sensor in the process of being assembled. FIG. 4 is a perspective view of the completed state. 8, 8'... Ceramic case, 9... Thin film thermistor, 10, 11... Electrode, 12... Lead wire, 13... Solder, 14... Insulator, 15... Insulating tube.
Claims (1)
ースの少なくとも一方の内面にサーミスタ特性を
有する材料を蒸着または印刷により薄膜サーミス
タを設け、この薄膜サーミスタの両端の電極にリ
ード線を接続し、２分割されたセラミツクケース
を貼合せて円筒状としたことを特徴とする温度セ
ンサ。1 A thin film thermistor is provided on the inner surface of at least one of the two halves of the ceramic case with excellent thermal conductivity by vapor deposition or printing of a material having thermistor characteristics, and lead wires are connected to the electrodes at both ends of this thin film thermistor, and the two halves are divided. A temperature sensor characterized by having a cylindrical shape made by laminating ceramic cases.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9689484A JPS59218928A (en) | 1984-05-15 | 1984-05-15 | Temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9689484A JPS59218928A (en) | 1984-05-15 | 1984-05-15 | Temperature sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59218928A JPS59218928A (en) | 1984-12-10 |
| JPS6155054B2 true JPS6155054B2 (en) | 1986-11-26 |
Family
ID=14177081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9689484A Granted JPS59218928A (en) | 1984-05-15 | 1984-05-15 | Temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59218928A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0648219B2 (en) * | 1986-03-12 | 1994-06-22 | 日本特殊陶業株式会社 | Temperature sensor |
| JPH01278001A (en) * | 1988-04-28 | 1989-11-08 | Tokin Corp | Thermistor temperature transducer structure |
| US8118486B2 (en) * | 2008-09-04 | 2012-02-21 | AGlobal Tech, LLC | Very high speed temperature probe |
-
1984
- 1984-05-15 JP JP9689484A patent/JPS59218928A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59218928A (en) | 1984-12-10 |
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