JPS6267899A - Part for electromagnetic wave shield - Google Patents
Part for electromagnetic wave shieldInfo
- Publication number
- JPS6267899A JPS6267899A JP60208359A JP20835985A JPS6267899A JP S6267899 A JPS6267899 A JP S6267899A JP 60208359 A JP60208359 A JP 60208359A JP 20835985 A JP20835985 A JP 20835985A JP S6267899 A JPS6267899 A JP S6267899A
- Authority
- JP
- Japan
- Prior art keywords
- component
- conductive paint
- resin film
- electromagnetic shielding
- thermoplastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003973 paint Substances 0.000 claims description 15
- 229920005992 thermoplastic resin Polymers 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 13
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 238000007666 vacuum forming Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子部品を覆い、電磁波をシールドする部品
に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a component that covers an electronic component and shields it from electromagnetic waves.
電子機器から発生する電磁波が他の電子機器の回路に悪
影響を及ぼすことを防止するため、および外部からの電
磁波が機器内の電子部品に悪影響を及ぼすことを防止す
るため、電子機器を電磁波シールド材で覆う必要がある
。多くの場合は機器の筐体の内側に金属シートなどが貼
合わせられたり、導電性塗料が塗られたりしており、シ
ールド材の役割りをしている。ところが電磁波の発生は
電子機器内の電子部品単位で起こり、シールドもＩＣな
どの部品単位でする必要がある。そのため電磁波シール
ド材を容器形状に成形したシールド用部品で、各電子部
品を覆っている。In order to prevent the electromagnetic waves generated by electronic devices from having a negative effect on the circuits of other electronic devices, and to prevent the electromagnetic waves from the outside from having a negative effect on the electronic components inside the device, electronic devices are covered with electromagnetic shielding materials. It needs to be covered with. In many cases, the inside of the device's case is pasted with a metal sheet or coated with conductive paint, which acts as a shielding material. However, electromagnetic waves are generated at each electronic component within an electronic device, and shielding must also be done at each component such as an IC. Therefore, each electronic component is covered with a shielding component made of electromagnetic shielding material molded into a container shape.
電子機器内の電子部品単位でシールドする部品を造るた
めの材料は、次のような条件が備わっていることが好ま
しい、■導電性が充分にあり均一である。■成形性が良
く成形後も部分的な導電不良を起こさない、■適度な剛
性があり成形品（シールド用部品）に自立性がある。■
軽量である。その他一般的なこと＼して安価であること
が好ましい。It is preferable that the material used to make components for shielding each electronic component in an electronic device has the following conditions: (1) It has sufficient and uniform electrical conductivity. ■It has good moldability and does not cause local conductivity defects even after molding.■It has appropriate rigidity and the molded product (shielding parts) can stand on its own. ■
It is lightweight. In general, it is preferable that it is inexpensive.
従来のシールド用部品は金属板を折曲げて容器形状に、
造られたものが多かった。しかし金属板は重量があり、
機器を小型軽量にするのに障害となる。すなわち上記■
に反し好ましくない、金属板の板厚を薄くしてゆくと軽
量化は出来るが、成形品の自立性が損なわれてしまう、
また従来から電磁波シールド材として使用されていた、
樹脂フィルムに金属箔を貼り合わせた材料を、電子部品
のシールド用部品に成形すると、角部で金属箔に亀裂が
生じ、導電不良を生じてしまう。Conventional shield parts are made by bending a metal plate into the shape of a container.
Many things were built. However, metal plates are heavy,
This is an obstacle to making equipment smaller and lighter. In other words, the above ■
On the contrary, it is undesirable to reduce the thickness of the metal plate, which can reduce the weight, but the independence of the molded product is lost.
It has also traditionally been used as an electromagnetic shielding material.
When a material made by bonding metal foil to a resin film is molded into a shielding part for an electronic component, cracks occur in the metal foil at the corners, resulting in poor conductivity.
上記のようにシールド用部品は、数々の問題点があり、
未だ充分な性能のものは得られていない。本発明はこれ
らの問題点を解消し、上記■〜■の性能が備わった電磁
波シールド用部品を安価に提供しようとするものである
。As mentioned above, shield parts have a number of problems.
A product with sufficient performance has not yet been obtained. The present invention aims to solve these problems and provide an electromagnetic shielding component having the above-mentioned performances (1) to (4) at a low cost.
上記の問題点を解決するための、本発明の構成は以下の
通りである。第１図に示すように、本発明を適用した電
磁波シールド用部品１は、導電性塗料２を表面に塗布し
た熱可塑性樹脂フィルム３を加熱して容器形状に成形し
たものである。The configuration of the present invention for solving the above problems is as follows. As shown in FIG. 1, an electromagnetic shielding component 1 to which the present invention is applied is formed by heating a thermoplastic resin film 3 coated with a conductive paint 2 into a container shape.
熱可塑性樹脂フィルム１は成形性が良く、また塗布され
ている導電性塗料２は加熱成形時に適度な伸びがある。The thermoplastic resin film 1 has good moldability, and the conductive paint 2 applied thereto has appropriate elongation during hot molding.
したがって導電性塗料の塗装層が切れることがなく、導
電性が損なわれない、熱可塑性樹脂フィルム３と導電性
塗料２とが一体的になって構造体として作用し適度な剛
性があり、また軽量である。Therefore, the coating layer of the conductive paint does not break and the conductivity is not impaired.The thermoplastic resin film 3 and the conductive paint 2 act as a structure as a single body, and have appropriate rigidity, and are lightweight. It is.
以下１本発明を適用する電磁波シールド用部品の実施例
を詳細に説明する。Hereinafter, an embodiment of an electromagnetic shielding component to which the present invention is applied will be described in detail.
熱コ塑性樹脂フィルム３としては、例えば塩化ビニルフ
ィルムで厚さが５０〜３００ ｇ ｍ程度のものを用い
る。先ず、塩化ビニルフィルムの片面に、スプレィ法に
より導電性塗料２を塗布して材料シートにする。導電性
塗料２としては１例えばウレタン樹脂（バインダ成分）
を酢酸エチル溶液に溶解し、さらに銅粉末（導電性成分
）を分散させであるものが使用される。導電性塗料の塗
装厚さく乾燥時）は５０〜７０ｇｍ程度が好ましい。As the thermocoplastic resin film 3, for example, a vinyl chloride film having a thickness of about 50 to 300 gm is used. First, conductive paint 2 is applied to one side of a vinyl chloride film by a spray method to form a material sheet. As the conductive paint 2, 1, for example, urethane resin (binder component)
is dissolved in an ethyl acetate solution and further dispersed with copper powder (conductive component). The coating thickness of the conductive paint (when dry) is preferably about 50 to 70 gm.
第２図に示すように、上記により得られた材料シート１
１を真空成形の金型７に取付ける。そしてヒータ８で加
熱しなから矢示ＶａＣ方向に排気をする。すると材料シ
ー）１＋ は軟化しながら吸引されて金型７の中子１０
ａ・１０ｂに沿って貼付く、これを冷却して取り出せば
第３図に示すような成形品１２が得られる。成形品１２
の切断溝１ａに沿って切落すと、目的物である電磁−シ
ールド用部品１（第１図参照）が完成する。As shown in FIG. 2, the material sheet 1 obtained above
1 is attached to the mold 7 for vacuum forming. Then, it is heated by the heater 8 and then exhausted in the direction of the arrow VaC. Then, the material C) 1+ is softened and sucked into the core 10 of the mold 7.
The molded product 12 shown in FIG. 3 is obtained by cooling and removing the molded product that is stuck along the lines a and 10b. Molded product 12
When it is cut along the cutting groove 1a, the target electromagnetic shielding part 1 (see FIG. 1) is completed.
この電磁波シールド用部品ｌは、導電性の欠損部分がな
く、適度な剛性があって自立しているから空間５に配置
される電子部品（不図示）を損傷することがなく、また
軽量である。さらに、この例の電磁波シールド用部品１
は外側面にだけ導電性塗料２が塗装されており、空間５
に面した内側は絶縁体（熱可塑性樹脂フィルム）である
から、配置された電子部品に誤って接触しても電気的な
悪影響を及ぼすことがないという利点もある。This electromagnetic shielding component 1 has no conductive defects, has appropriate rigidity, and is self-supporting, so it does not damage electronic components (not shown) placed in the space 5, and is lightweight. . Furthermore, in this example, electromagnetic shielding component 1
is coated with conductive paint 2 only on the outer surface, and the space 5
Since the inner side facing the inside is an insulator (thermoplastic resin film), there is also the advantage that there will be no adverse electrical effects even if it accidentally comes into contact with placed electronic components.
上記実施例においては、熱可塑性樹脂フィルムとして塩
化ビニルフィルムを用いたが、これ以外・に１例えばポ
リエチレ・ンフィルム、ポリプロピレンフィルム、ポリ
エチレンテレフタレートフィルムを使用できる。また導
電性塗料として、前記のウレタン樹脂バインダー銅粉末
のもの以外に、バインダ成分として例えばアクリル樹脂
など、導電性成分として銀粉末、ニッケル粉末、カーボ
ン粉末などを適宜組合せたものが使用できる。In the above embodiments, a vinyl chloride film was used as the thermoplastic resin film, but other materials such as polyethylene film, polypropylene film, and polyethylene terephthalate film can also be used. In addition to the above-mentioned urethane resin binder copper powder, the conductive paint may be a suitable combination of, for example, acrylic resin as the binder component and silver powder, nickel powder, carbon powder, etc. as the conductive component.
熱可塑性樹脂フィルムに導電性塗料を塗付するには、前
記のスプレィによる以外に１例えばリバースロールコー
ト、刷毛塗り、ドクターブレードによる掻き落しなどに
より均一に塗布することができる。またシート材料を容
器形状に成形するには、前記の真空成形に限らず、例え
ばプレス成形など他の方法を採るこも可能である。In order to apply the conductive paint to the thermoplastic resin film, in addition to the above-mentioned spraying method, it can be applied uniformly by, for example, reverse roll coating, brushing, scraping with a doctor blade, etc. Further, in order to form the sheet material into a container shape, it is not limited to the above-mentioned vacuum forming, but other methods such as press forming can also be used.
以上説明したように本発明の電磁波シールド用部品は、
成形時に導電性部分が欠損してしまうことがないので良
好な導電性を保つことができる。As explained above, the electromagnetic shielding component of the present invention is
Good conductivity can be maintained since the conductive portion is not damaged during molding.
適度な剛性があり、自立性があるので実装時の作業がや
りやすい。また材料が熱可塑性樹脂フィルム“と導電性
塗料であるから、成形がやりやすく軽量である。同時に
安価にできるものである。It has appropriate rigidity and is self-supporting, making it easy to work on mounting. Furthermore, since the material is a thermoplastic resin film and conductive paint, it is easy to mold and lightweight.At the same time, it can be made at low cost.
第１図は本発明を適用した電磁波シールド用部品の断面
図、第２図は電磁波シールド用部品の製造を説明する図
、第３図は電磁波シールド用部品の成形品である。
１９１．電磁波シールド用部品
２１１．導電性塗料
３ 熱可塑性樹脂フィルム
１１・ ・材料シート １２・・・・成形品第１図FIG. 1 is a sectional view of an electromagnetic shielding component to which the present invention is applied, FIG. 2 is a diagram illustrating the manufacture of the electromagnetic shielding component, and FIG. 3 is a molded product of the electromagnetic shielding component. 191. Electromagnetic shielding parts 211. Conductive paint 3 Thermoplastic resin film 11 Material sheet 12 Molded product Figure 1
Claims (1)
を加熱して、容器形状に成形したことを特徴とする電磁
波シールド用部品。 ２、前記導電性塗料を一方の面にのみ塗布した熱可塑性
樹脂フィルムの、該一方の面を前記容器形状の外側面と
したことを特徴とする特許請求の範囲第１項記載の電磁
波シールド用部品。[Scope of Claims] 1. An electromagnetic shielding component, characterized in that it is formed into the shape of a container by heating a thermoplastic resin film whose surface is coated with conductive paint. 2. The electromagnetic wave shielding device according to claim 1, characterized in that the conductive paint is applied to only one surface of a thermoplastic resin film, and the one surface is the outer surface of the container shape. parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60208359A JPS6267899A (en) | 1985-09-20 | 1985-09-20 | Part for electromagnetic wave shield |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60208359A JPS6267899A (en) | 1985-09-20 | 1985-09-20 | Part for electromagnetic wave shield |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6267899A true JPS6267899A (en) | 1987-03-27 |
Family
ID=16554983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60208359A Pending JPS6267899A (en) | 1985-09-20 | 1985-09-20 | Part for electromagnetic wave shield |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6267899A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010036654A (en) * | 2008-08-01 | 2010-02-18 | Honda Motor Co Ltd | Slide door device of aircraft |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856497B2 (en) * | 1981-08-21 | 1983-12-15 | 東守 又吉 | perforation cutter |
| JPS6096000A (en) * | 1983-10-31 | 1985-05-29 | 凸版印刷株式会社 | Electromagnetic shielding housing |
-
1985
- 1985-09-20 JP JP60208359A patent/JPS6267899A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5856497B2 (en) * | 1981-08-21 | 1983-12-15 | 東守 又吉 | perforation cutter |
| JPS6096000A (en) * | 1983-10-31 | 1985-05-29 | 凸版印刷株式会社 | Electromagnetic shielding housing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010036654A (en) * | 2008-08-01 | 2010-02-18 | Honda Motor Co Ltd | Slide door device of aircraft |
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