JPS6267170A - Sputtering apparatus - Google Patents

Abstract

PURPOSE:To eliminate defects in a thin film formed on a body on which sputtered particles are deposited due to foreign matter by covering a target with a jig for conveying the body, connecting plural such jigs and moving the jigs over the target so as to prevent the deposition of sputtered particles on the inner wall of a sputtering chamber. CONSTITUTION:A projected target 1 is completely covered with a jig 2 for conveying a body 5 on which sputtered particles are deposited, e,g., a glass substrate so that the target 1 is isolated from the inner wall 3 of a sputtering chamber, and the body 5 is fitted to the jig 2 so that it confronts the surface 4 of the target 1. Plural such jig 2 so that it confronts the surface 4 of the target 1. Plural such jigs 2 are connected and moved continuously with movable parts 6 for conveyance, and particles 3 sputtered from the surface 4 of the target 1 are deposited on the jigs 2 without causing deposition on the inner wall 3. By this structure, the yield of thin films free from defects is enhanced. The thin films are required to produce an electronic device or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) Invention 9: This invention relates to a S.P. stumbling device used in various fields of electronic devices using thin film technology.

(Prior art) In conventional sputtering equipment, the film adheres to the inner wall of the sputtering chamber due to the sputtering process, and a part of the deposited film peels off and re-adheres to the object to which it is adhered, resulting in large defects. Making often occurs. To prevent this phenomenon,
Depending on the material to be sputtered, the sputtering chamber wall on the target surface is covered with a material that has a strong adhesion to the sputtering ivy film. However, with this method, if dirt accumulates, it may peel between the films, and it is necessary to periodically clean the space and ivy room where the ivy is to be removed.
This was a fatal flaw in continuous equipment.

(Problems to be Solved by the Invention) In the S.P. ivy device having the above configuration, the S.P. ivy particles spread over a wide area, and the vacuum chamber in which S.P. ivy is performed is contaminated due to peeling of the S.P. ivy film. cannot be prevented. For this reason, it has become essential to periodically clean the star-two-stuttering device.

The purpose of the present invention is to eliminate the conventional drawbacks, and to prevent the spatter particles from protruding from the targut during sputtering.
To provide a S/P ivy ringing device that does not cause ivy to adhere to an indoor wall.

(Means for Solving the Problems) In the scattering device of the present invention, a plurality of the adherend conveyance jigs are moved in succession on a target surface.

(Function) With the above configuration, Snow? The dust and ivy particles that fly out from the target surface during ivy do not adhere to the sputtering chamber wall at all, and all the dust and ivy particles adhere to the continuously moving object conveying jig, and are finally sputtered.・It is sent out as a deposited film outside the vine chamber. Therefore, the film adhering to the dust chamber is peeled off from the substrate, eliminating the problem of adhesion. Therefore, once the adherend conveyance jig passes through the spatter chamber, it must be cleaned before use.

(Example) An embodiment of the present invention will be described based on the drawings.

The figure is a sectional view of the basic configuration of the sputtering apparatus of the present invention. In the figure, a protruding target 1 is completely covered by an adherend conveyance jig 2 and isolated from a sputtering chamber wall 3. Here, the adherend 5 is installed on the target surface 4 of the adherend conveyance jig 2, and all the particles of dust and ivy that fly out from the target surface 4 do not adhere to the adherend conveyance jig 2. , the adherend conveyance jig 2 is conveyed by the movable conveyance section 6. The inside of the adherend conveyance jig 2 is subjected to Sun P blasting to strengthen the adhesion of the film. With this method, the number of foreign particles of 3 μm or more attached to the substrate is reduced to 10-3 or less per 11, compared to the conventional number.
The rank was lower than that of the person in charge. The RF magnetron method was used, the target was a 5rTj03 seven-laminar sock connector, and the adherend was a mirror-polished glass substrate or St wafer. The substrate temperature was 450° C., and a mixed gas of argon and oxygen at 10 m Torr was used as the suction gas.

Furthermore, similar results were obtained with 9 glass targets with a metal target surface, and the number of foreign particles attached was reduced to less than 1 piece compared to the conventional method.

(Effects of the Invention) According to the present invention, it is possible to prevent the peeling of the film deposits attached to the inner wall of the mother ivy, and to eliminate defects caused by foreign substances in the thin film formed on the adherend, so that there is no defect. When manufacturing electronic devices such as solid surface elements, semiconductor devices, and various sensors that require thin films, yields can be dramatically improved, and the practical effect is great.

[Brief explanation of drawings]

The figure is a sectional view of the basic configuration of a suction ring device according to an embodiment of the present invention. 1...Target, 2...Adhesive object conveyance jig, 3.
...Sputter indoor wall, 4...Target surface, 5...
Object to be adhered, 6... Movable part for conveyance. 1 Tarp 1 4 ゛ Target (sha) 5... ¥141 pigeon pay 6 Flying carrier

Claims (1)

[Claims] 1. A sputtering apparatus characterized in that an adherend conveyance jig is provided to cover and wrap a target surface, and a plurality of said adherend conveyance jigs are connected and moved at least on the target surface.