JPS60184676A - Coated base material or manufacture of coated member - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION 7 Fields of Industrial Application The present invention provides for applying at least one coating, generally comprising a metal matrix, by cathodic sputtering onto a previously cleaned and roughened component base surface. The present invention relates to a method for producing coated substrates or coated parts by application using a cathodic sputtering nozzle containing components corresponding to the desired composition of the coating to be produced.

PRIOR ART Coated substrates with smooth or rough coatings applied by cathodic sputtering are known from DE 28 537' 24 and DE 2 914 618;
The method of manufacturing such coated substrates known from these documents includes the following steps: obtaining a high adhesion and bonding force between the surface of the base layer and the applied smooth or rough surface; It turned out that there was a big problem.

Problem to be Solved by the Invention Therefore, the problem to be solved by the invention is
53724 and 2914618.7-14 with the aim of reproducibly obtaining high bonding forces between the surface of the base layer and the surface layer applied by cathodic sputtering. It's about improving. For this purpose, bonding forces of at least the same magnitude must also be obtained reproducibly between layers subsequently applied by cathodic sputtering.

Means for Solving the Problem The solution to this problem is that the asymmetry of the bonding force between the surface of the base layer and the surface layer applied by yin sputtering is
On the one hand, the surface condition of the base layer present when applying the coating by cathode sputtering and, on the other hand, the target or targets used for cathode sputtering when starting cathode sputtering. It is based on the knowledge obtained through experiments that this can be attributed to the conditions governing the surface of the object.

According to the invention, therefore, in order to solve the above-mentioned problem, the following operating steps are carried out: In an exhaust bell containing a target or targets and a substrate base to be coated or a component base to be coated. After a certain vacuum has been created during cathodic sputtering, free sputtering is first carried out from the surface of the target or targets to be discharged, in which case the surface of the substrate base or component base to be coated is The target material is protected from adhesion, and the removal of the target or targets is carried out by cathodic sputtering in an Asahi corona discharge during etching of the surface to be coated on the component base. If the surface of the target or targets is protected from adhesion of component substances, and subsequent to etching, the coating of the surface of the substrate base or component base is carried out by cathodic sputtering from the free sputtered tarded surface. is proposed.

In the method according to the invention, both the cleaning of the surface of the target or targets to be discharged and the etching, i.e. cleaning and roughening, of the surface of the substrate base or component base to be coated are carried out immediately before coating. , which is also carried out in detail when a vacuum is created in the exhaust bell. In this case, the surfaces to be subjected to the cathodic sputtering step for the actual coating are in each case protected from adhesion of foreign substances during the pretreatment of the other surfaces. For the time being, it is generally possible to clean only the target or targets to be removed by free sputtering, and the surface of the substrate or component to be coated by continuous free sputtering. ASL, ETR at the same time seems to be enough?
N5AC: Tl0NS No. 12, pp. 36-46 (196
9), in particular from page 68, it is known to clean the surface of the base layer which should not be corrugated by cathodic sputtering by back sputtering. However, according to the invention, after the free sputtering of the surface of the target or targets to be cleaned, the etching of the surface to be coated is carried out in a corona discharge, thereby cleaning this surface. In addition, strong surface roughening is also carried out. Thereafter, after this etching, i.e., without any significant delay, the substrate base or component is etched. The coating of the surface of the base is carried out in a cathodic sputtering step from a free-sputtered tarded surface. Within the scope of the invention, all these operating steps are carried out under vacuum control;
That is, the coating of the surface of the substrate base or component base begins virtually immediately following the etching, even if it is carried out in a gas atmosphere maintained under a suitable vacuum to maintain the electrical discharge that causes cathodic sputtering. This turned out to be extremely important. According to the invention, between the free sputtering of the surface to be discharged of one or more tardeds and the start of the actual cathode sputtering for coating the surface of the substrate base or component base, a vacuum in the exhaust bell is provided. Time intervals can be tolerated as long as they are not released or significantly degraded.

According to the present invention, two
When one or more coatings are deposited by cathodic sputtering, all of the target nodes required to form the various coatings are placed in the same exhaust bell and all are placed on the substrate base or part. Free sputtering of the surface to be coated on the substrate before etching and the arrangement of the layered coating by cathodic sputtering from different targets in direct succession in time, i.e. free sputtering at an intermediate time and etching at an intermediate time. It is suggested that it be implemented without Therefore, each subsequent application of the coating takes place on a new surface of the previously applied coating.

Therefore, optimum surface bonding force can be obtained even between layers applied in a laminated manner. During free sputtering and thus before etching the surface to be coated, according to the invention this pretreatment is carried out on all targets to be used, so that intermediate free sputtering is not necessary. Therefore, in a development of the invention, when using a large number of targets, in particular targets of unique composition, it is possible to perform free sputtering of each target successively in time and, at least, to It is proposed to protect sputtered bits from adhesion of foreign substances during free sputtering of other targets. Within the scope of the invention, in order to obtain adequate protection against the adhesion of foreign substances to the target surface and to the surface to be coated, the target is provided with a shield for free sputtering and for free sputtering. It is recommended that most of the sputtering be directed toward this shield. In a corresponding manner, a shield is arranged opposite the substrate base or the component base during etching, and the etching is carried out primarily as cathode sputtering from the surface of the substrate base or component base to be coated. can be done.

In a further development of the invention, for the continuous production of coated substrates or coated parts, the substrate base or part base is placed in two or more stations in an exhaust bell maintained under vacuum. and etching and coating are carried out continuously in these stations, with free sputtering of tarded or several tarts being carried out only once after the exhaust bell has been closed and a vacuum has been created. At the same time, as the case may be, the p-substrate base or member base may be introduced into the exhaust bell via a vacuum gate, and the coated base material or coated member may be sucked out from the exhaust bell via a vacuum gate. is recommended.

example of failure Below, the drawing implementation and sequence will be explained in detail in 4-Invention.

In the following examples, the present invention is applied to the base layer, N15n2
A thin cutting and bonding layer consisting of 0 and At5n20
The production of a coated member having a smooth layer r of different types will be described in detail.

During the evacuation MmlU, there are three stations for processing the component 11 to be etched: station A1 for etching the component surface to be coated; station A1 for applying a first layer to the etched component surface; Steenyo 7B1
and a station C for applying a second layer to surfaces A51 and A51 of the part unf is omitted.

In Fig. 1, a turntable 12 is provided inside the exhaust bell 10, and this turntable device has six member stands 13 corresponding to stations A, B, and C. and these parts are moved in stages according to arrow 14 to six stations A, B and c t
It will be moved after that. These material receptacles 13 are energized in accordance with the processing steps to be carried out, using known circuit arrangements and known electrical components (not shown for the sake of simplicity). Similarly, the devices provided for exhausting the exhaust pipe 10 and for moving the turntable device 12 are not shown for the sake of simplicity.

During the evacuation &#10, the etching shield 15 is pivoted in several cases in order to be pivoted in the working position onto the workpiece table which has entered station A in each case. In this pivoted position, the etching shield 15 is or can be connected to a positive potential. However, this etching shield 15 could also be fixed to station A and optionally connectable to a positive potential.

At station A, the material table 13 is connected to a negative potential. Furthermore, two target shields 16 and 18 were arranged inside the exhaust bell, which entered there in correspondence with arrows 11 and 19 within the range of stations B and C, and more specifically at station B. The opposite part of the workpiece platform 13 is movable in front of the target 20 to be entered and the target 21 to be entered in a corresponding manner into the station C. One VA'1r with shield Is, 16 and 18 movement, glue and adjustment buttons
it, is not shown for simplicity.

In order to carry out the method according to the present invention 1 using the above-mentioned apparatus, the operation is as follows: Difference: The member 11 to be coated is placed on the turntable apparatus f1.
20 is placed in the member housing section 13. To station B, #
1lfT = and a given material for the bonding layer, e.g. N15n
A target 2o made of 20 or a non-ferrous magnetic chromium-nickel alloy is placed. At station C, a target 8 is placed which corresponds to the desired composition of the smoothing layer, for example A7Sn20. In this case cleaning may be carried out using the desired gas or gas mixture for cathodic sputtering. In addition to this exhaust, the pressure required to ignite and maintain the gas discharge causing cathode sputtering is maintained within the exhaust bell 10 at node A. As soon as this pressure adjustment is achieved, shields 16 and 18 are moved in front of targets 20 and 21, if this movement has not already taken place before. Thereafter, a stop potential is applied to the tarded shield 16 and to the negative potential gate 20, with the voltage prevailing between these two members being set at node A such that the discharge is ignited and maintained. do. After that, a cathode sputtering process is performed.
At that time, if no other anode is provided, shield 1
6 is operated as an anode. In any case, the material carried out from the surface of the target 20 during this cathode sputtering process is captured by the tarded shield 16. By this first shadow 4i sputtering, the target 20
The surface to be discharged is free sputtered, so that a highly active sputter with the desired material composition from the target 20 is ejected immediately upon further ignition of the discharge.

In a corresponding manner, free sputtering of the surface of the target 20 to be removed is carried out using the tarded shield 18, which is to be sputtered 111ii of the tarded 21. Fig. 2 shows a stage in which free sputtering has been carried out on the surface of the target 21 to be ejected, and free sputtering has already been carried out on the surface of the meta-gut 20 to be carried out in Figs. .

After free sputtering on the surfaces of the substrates 20 and 21 to be transported, the etching process is carried out at station A.
, but if the etching shield 15 has not already been swiveled to the station A or is not fixed to the station A, then the part receptacle of this etching shield 15 in this case 13 and the member 11 arranged thereon. Thereafter, a positive potential is applied to the etching shield 15 and a negative potential is applied to the component receiving portion 13 and thus to the component 11. The voltage prevailing between member 11 and etching shield 15 is adjusted such that a corona discharge is ignited and maintained. In this corona discharge, the member 11 serves as a target whose surface material is removed by cathodic sputtering and captured by the etching shield 15. This reverse cathode sputtering is carried out until the surface of the component 11 to be coated is not only cleaned but also noticeably roughened. FIG. 6 shows the member 11 being subjected to reverse cathode sputtering, placed on the member accommodating portion 13 at station A in a position facing the etching shield 15. As soon as the surface of the part to be coated has been sufficiently roughened, the reverse cathode sputtering is stopped and the part 11 is sent directly to station A (-, station B) by the rotation of the turn chisel device 12. The travel time between station A and stay 7373 is so slight that no significant contamination can occur on the freshly etched surface of the component 11. Immediately after entering station B, the starter 70 is placed at a negative potential, the member receiving portion 13 supporting the member 11 is placed at a positive potential, and the targate shield 16 is placed at a negative potential before its removal. If not, remove it. Immediately begin active cathode sputtering from the target nodule 20 onto the surface of the freshly etched member 11. This cathode sputtering is applied to the surface of the freshly etched member done, N]-8n
20 or chromium-nickel alloy
- and continue until the desired thickness of the tie layer is achieved. Blocking 1
(After the fr- and bonding layers have been formed, the member 11 is passed from the subsequent rotating station 7 B of the turntable device 12 directly to station C. At that location, the tar'f' cut 21 is By placing the material stand 13 and therefore the member 11 at a positive potential or at ground, the smooth layer is coated by cathode sputtering.

The targat shield 18 is removed if it has not already been removed. At station C, cathode sputtering is continued until the smooth layer has the desired thickness.

When all the component storage sections 13 are loaded with components in preparation for a work process, the same component storage section 13 is always exposed to all six work steps sequentially together with the components 11 placed therein. Just operate it. In this case, once the component 11 arranged in this one component receptacle 13 has been processed, the other component receptacle 13 with the components arranged therein is subjected to six directly successive working steps. be able to. This is then continued until all parts have been processed.

However, six stations A, E (and C
If the processing times can be synchronized or sufficiently synchronized, six component receptacles 13, with components 11 placed thereon simultaneously, one at station A, one at station B and one at station C
It is also possible to consider processing with In this case, however, it must be ensured that the parts are transferred from one processing step to another within the shortest possible time.

It is also evident that other embodiments of the processing apparatus can be used in the implementation of the method. For example, six stations A, B and C are arranged in series, in which case a component or web-like substrate is introduced into the interior of the exhaust bell via a vacuum cage and forced to pass through these stays/fans; In addition, the coated member or coated web-like substrate after treatment can be provided with a vacuum cage so that the vacuum can also be removed.

Also, if more than one layer is to be applied to the substrate or component base, a larger number of processing stations can be provided instead of the six processing stations A, B and C described in the previous embodiment. be able to. On the other hand,
If only one layer is to be applied, it is possible to have only two processing stations. However, in each case, before the etching of the surface to be coated takes place, the free snow ξ ivy of one or more targets is removed after the vacuum has been formed after the closing of the exhaust bell, or possibly at an intermediate time. It should be ensured that this is carried out after a significant pressure increase and further vacuum has been created. Furthermore, in each case between etching and first coating or between successive coatings, the shortest possible time intervals are used in order to avoid significant contamination of freshly etched or freshly formed coating surfaces. It must be ensured that it is maintained.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view schematically showing an embodiment of an apparatus for carrying out the method according to the invention, and FIGS.
FIG. 2 is a vertical cross-sectional view taken along line nn and line III-III in the figure. 10... Exhaust bell, 11... Member to be covered, 12.
・・Turn chisol device, 13・・・Component housing sound β, 1
5...Etching shield, 16.18°゛°Target shield, 20.21...Target continued from page 10 Inventor: Erich Hoedes [Phase] Inventor: Michael Szczy Rosbach 3 Fono der Hohe Rugebornstrasse 52, Federal Republic of Germany

Claims (1)

[Claims] 1. At least one coating having a substantially metallic matrix is applied to the surface of the component base (11), which has been previously cleaned and roughened, by cathodic sputtering of the coating to be applied. In the production of nail-coated substrates or demolished coverings without the use of at least one cathodic sputtering tube (20, 21) containing substances corresponding to the desired composition, the following steps are taken: In the operating process knee cathode sputtering, a predetermined vacuum is applied to the targat surface or multiple targat surfaces 20,21) and the base material to be coated (11) or the base material to be coated (11,)-i. After being formed in the exhaust gas 4 (10), a targate or a plurality of tarbits (
20, 21) on the surface to be exposed is carried out, in which case the base material base (11) or the component base (1
1) Surface to be covered. After free sputtering of the surface of the substrate base (11) or of the component base (11) to be coated, the surface of the substrate base (11) or component base (11) is etched. is carried out by cathode sputtering in a corona discharge, in which case a target or a plurality of targets (20, 21
) is protected from adhesion of component substances, and subsequent to the etching, coating of the surface of the substrate base (11) or component base (11) is carried out by cathodic sputtering from the free sputtered target surface. 1. A method for producing a coated base material or a coated member, characterized in that: 2. A plurality of turbits (20.21) necessary for forming the various layers in order to produce coated substrates or coated parts having two or more coatings laminated by cathodic sputtering. are all placed in the same exhaust bell (10) and are all free-sputtered before etching the surface to be coated of the base material base (11) or of the part paste (11), and the laminated coatings are (20, 21), i.e. without intermediate free sputtering and without intermediate etching. A method for producing a coated base material or a coated member as described in 2. 3. When using a large number of targets (20, 21), especially targets of different compositions, the free sputtering of each target (20, '21) is carried out successively in time, and Any of claims 1 or 2, characterized in that at least one already free sputtered target (20) is protected from adhesion of foreign substances during the free sputtering of other targets (21). A method for producing a coated base material or a coated member according to claim 1. 4. A claim characterized in that a shield (16, 18) is arranged opposite to the tarded (20, 21) to be free sputtered, and the free sputtering is mostly performed with respect to this shield (16, 18). A method for producing a coated base material or a coated member according to any one of Items 1 to 6. 5. A shield (15) is arranged opposite to the base material paste (11) or the member paste (11) during etching,
and that the etching is carried out as cathode sputtering from the surface of the substrate paste (11) or component paste (11) to be coated essentially towards this shield (15). Substrate base (11
) or part pace (11) is guided through two or more stations (A,, B, C) inside an exhaust bell (10) maintained under vacuum, and these stations (A, B,' Etching and coating are carried out continuously in C'), the free sputtering of the target or targets (20, 21) being applied to the exhaust bell (1).
0) and the formation of a vacuum, and optionally the base material paste (11) or component paste (11) is introduced into the exhaust bell through the vacuum gate and the coated base material is introduced into the exhaust bell. The coated base material or the coated member according to any one of claims 1 to 5, characterized in that the material or the coated member is discharged from an exhaust bell through a vacuum date. Manufacturing method.