JPS61163271A - Jig for sputtering apparatus - Google Patents
Jig for sputtering apparatusInfo
- Publication number
- JPS61163271A JPS61163271A JP244185A JP244185A JPS61163271A JP S61163271 A JPS61163271 A JP S61163271A JP 244185 A JP244185 A JP 244185A JP 244185 A JP244185 A JP 244185A JP S61163271 A JPS61163271 A JP S61163271A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- jigs
- jig
- sputtering
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はスパッタ装置内に設置する治具に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a jig installed in a sputtering apparatus.
従来、この種の治具には図面に示すものがあった。図に
おいて(1)はマスク、(2)はターゲット、(3)は
シールド板、(4)はシャッター、(5)は基材である
。Conventionally, this type of jig has been shown in the drawings. In the figure, (1) is a mask, (2) is a target, (3) is a shield plate, (4) is a shutter, and (5) is a base material.
治具であるマスク(1)、シールド板(3)及ヒシャッ
ター(41には、スパッタリングによってターゲット(
2)から飛び出した原子が付着する。ターゲット(2)
が金属材料、例えばFe 、 A7の場合でも基材(5
)の交換の際に酸化し付着物はもろくなり付着力も低下
する。また、ターゲット(2)が酸化物、例えばFeO
,A40 か窒化物、例えば513N4か炭化物、例
えばTiCの場合及びターゲット(2)が金属材料でも
反応スパッタを行なう場合にも同様に付着物はもろく付
着力は低い。付着される物質にもよるが一般的に付着物
の膜厚が厚くなると膜中の内部応力は大きくなりはがれ
易くなる。A mask (1), a shield plate (3), and a shutter (41), which are jigs, are coated with a target (
2) Atoms ejected from the atom attach. Target (2)
is a metal material, for example Fe, A7, the base material (5
) is oxidized during replacement, the deposits become brittle and the adhesion strength decreases. Moreover, the target (2) is an oxide, for example, FeO
, A40, a nitride such as 513N4, a carbide such as TiC, and when reactive sputtering is performed even when the target (2) is a metal material, the deposits are similarly brittle and have low adhesion. Although it depends on the substance being deposited, in general, as the thickness of the deposit increases, the internal stress within the film increases, making it easier to peel off.
ところで従来のマスク(1)の材料は安定で腐食されに
くく、酸化されにくく機械的強度が大きいステンレスが
一般的に使用されていた。従って酸化物とのなじみが悪
く(付着力が低く)付着物の内部応力は緩動されないた
め、付着物が割れてはがれ易くなるという問題があった
。By the way, as the material for the conventional mask (1), stainless steel, which is stable, resistant to corrosion, resistant to oxidation, and has high mechanical strength, has generally been used. Therefore, it has poor compatibility with oxides (low adhesion), and the internal stress of the deposits is not relaxed, so there is a problem that the deposits tend to crack and peel off.
付着物がはがれてくると、ゴミとなって基材(5)上の
薄膜中の欠陥の原因となったりターゲット(2)とシー
ルド板(3)を短絡して放電を停止したりするという問
題点があった。When the deposits come off, they become dust and cause defects in the thin film on the base material (5), or short-circuit the target (2) and the shield plate (3), stopping the discharge. There was a point.
この発明は上記のような問題点を解消するためになされ
たもので、付着物が堆積しても剥離しない治具を得るこ
とを目的とする。This invention was made to solve the above-mentioned problems, and aims to provide a jig that does not peel off even when deposits are deposited.
この発明のスパッタ装置用治具は、スパッタ装置内でス
パッタ被覆される治具の材料として酸化皮膜に覆われた
アルミニウム板及びアルミニウム合金板のうちの一つを
使用したものである。The jig for a sputtering apparatus of the present invention uses one of an aluminum plate and an aluminum alloy plate covered with an oxide film as the material of the jig to be sputter-coated in the sputtering apparatus.
この発明におけるスパッタ装置用治具は酸化皮膜に覆わ
れたアルミニウム板あるいはアルミニウム合金板を使用
することにより、何着物の伺着力が増大し、しかも応力
が緩和されはがれにくくなる。By using an aluminum plate or an aluminum alloy plate covered with an oxide film in the jig for a sputtering apparatus according to the present invention, the adhesion strength of various kimonos is increased, and stress is relaxed and it becomes difficult to peel off.
次に酸化皮膜形成の実施例を示す。 Next, an example of oxide film formation will be shown.
実施例1゜
アルミニウム板及びアルミニウム合金板、例えばアルミ
ニウムに4wt%Mgを入れたもの又はアルミニウムに
3 wt%Mnを入れたもの、のうちの一つ(この−場
合アルミニウム板)ヲマスク(I)、シールド板(31
及びシャッター(4)の形に加工した陵、加工した際に
付着した様々な汚れ(不均一な酸化皮膜、ダスト、油脂
等)を除去するため酸あるいはアルカリ溶液中に浸した
後、有機溶剤中に浸す。Example 1 One of the aluminum plates and aluminum alloy plates, such as aluminum with 4 wt% Mg or aluminum with 3 wt% Mn (in this case aluminum plate), mask (I), Shield plate (31
The ribs processed into the shape of the shutter (4) are immersed in an acid or alkaline solution to remove various stains (uneven oxide film, dust, oil, etc.) that adhered during processing, and then soaked in an organic solvent. Soak in.
その後、空気中に取り田し、N2ガス等を吹きつけて乾
燥し、さらに空気中に一週間程度放置する。Thereafter, it is placed in the air, dried by blowing N2 gas, etc., and then left in the air for about a week.
このようにすると自然に表面に酸化皮膜が形成される。In this way, an oxide film is naturally formed on the surface.
実施例2
実施例1と同様に有機溶剤中に浸した後、陽極酸化によ
り板の表面に酸化皮膜を数μm、例えば2μm形成する
。その後空気中に取り出しN2ガスを吹きつけて乾燥す
る。Example 2 After immersing the plate in an organic solvent in the same manner as in Example 1, an oxide film of several μm, for example 2 μm, is formed on the surface of the board by anodic oxidation. After that, it is taken out into the air and dried by blowing N2 gas.
以上のような実施例により得られた治具とステンレス製
及び酸化皮膜に罹われていないアルミニウム製の治具と
の比較を表1に示す。表1において剥離する膜厚が治具
の寿命を表わしている。なお、これはターゲットが鉄の
場合の値を示している。Table 1 shows a comparison between the jigs obtained in the above examples and jigs made of stainless steel and aluminum that are not covered with an oxide film. In Table 1, the thickness of the peeled film represents the life of the jig. Note that this value shows the value when the target is iron.
表 1
上記実施例においては、酸化皮膜に覆われたアルミニウ
ム板を用いた場合を示したが、酸化皮膜に覆われたアル
ミニウム合金板を用いた場合も同様の効果が得られる。Table 1 In the above example, the case was shown in which an aluminum plate covered with an oxide film was used, but the same effect can be obtained when an aluminum alloy plate covered with an oxide film is used.
以上のように、この発明によればスパッタ装置内でスパ
ッタ被覆される治具の材料どして、酸化皮膜に覆われた
アルミニウム板及びアルミニウム合金板のうちの一つを
使用したので、付着物の剥離が減少し、スパッタ装置の
事故及び基材上の薄膜の欠陥が減少し、さらにアルミニ
ウム板及びアルミニウム合金板はステンレスより安価で
加工も簡単なスパッタ装置用治具が得られる効果がある
。As described above, according to the present invention, one of an aluminum plate and an aluminum alloy plate covered with an oxide film is used as the material of the jig to be sputter coated in the sputtering apparatus, so that deposits can be removed. This reduces peeling of sputtering equipment, reduces accidents in sputtering equipment, and reduces defects in thin films on substrates, and furthermore, aluminum plates and aluminum alloy plates are cheaper than stainless steel, and have the effect of providing jigs for sputtering equipment that are easier to process.
図面は、一般的なスパッタ装置の主要断面図である。 The drawing is a main sectional view of a general sputtering apparatus.
Claims (1)
て、酸化皮膜に覆われたアルミニウム板及びアルミニウ
ム合金板のうちの一つを使用したことを特徴とするスパ
ッタ装置用治具。A jig for a sputtering device, characterized in that one of an aluminum plate and an aluminum alloy plate covered with an oxide film is used as the material of the jig to be sputter coated in the sputtering device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP244185A JPS61163271A (en) | 1985-01-10 | 1985-01-10 | Jig for sputtering apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP244185A JPS61163271A (en) | 1985-01-10 | 1985-01-10 | Jig for sputtering apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61163271A true JPS61163271A (en) | 1986-07-23 |
Family
ID=11529357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP244185A Pending JPS61163271A (en) | 1985-01-10 | 1985-01-10 | Jig for sputtering apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61163271A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0413868A (en) * | 1990-05-02 | 1992-01-17 | Anelva Corp | Spattering apparatus |
EP1593751A1 (en) * | 2003-01-14 | 2005-11-09 | Tokyo Electron Limited | Member of apparatus for plasma treatment, member of treating apparatus, apparatus for plasma treatment, treating apparatus and method of plasma treatment |
-
1985
- 1985-01-10 JP JP244185A patent/JPS61163271A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0413868A (en) * | 1990-05-02 | 1992-01-17 | Anelva Corp | Spattering apparatus |
EP1593751A1 (en) * | 2003-01-14 | 2005-11-09 | Tokyo Electron Limited | Member of apparatus for plasma treatment, member of treating apparatus, apparatus for plasma treatment, treating apparatus and method of plasma treatment |
EP1593751A4 (en) * | 2003-01-14 | 2008-08-06 | Tokyo Electron Ltd | Member of apparatus for plasma treatment, member of treating apparatus, apparatus for plasma treatment, treating apparatus and method of plasma treatment |
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