JPS626678B2 - - Google Patents
Info
- Publication number
- JPS626678B2 JPS626678B2 JP13369878A JP13369878A JPS626678B2 JP S626678 B2 JPS626678 B2 JP S626678B2 JP 13369878 A JP13369878 A JP 13369878A JP 13369878 A JP13369878 A JP 13369878A JP S626678 B2 JPS626678 B2 JP S626678B2
- Authority
- JP
- Japan
- Prior art keywords
- cleaning solution
- ion exchange
- exchange resin
- copper
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004140 cleaning Methods 0.000 claims description 45
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 claims description 22
- 239000003456 ion exchange resin Substances 0.000 claims description 22
- 229920003303 ion-exchange polymer Polymers 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- 239000013522 chelant Substances 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 14
- 150000001768 cations Chemical class 0.000 claims description 10
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 8
- 229910001431 copper ion Inorganic materials 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 238000005342 ion exchange Methods 0.000 claims description 4
- 239000002699 waste material Substances 0.000 claims description 4
- 230000001172 regenerating effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 229910001415 sodium ion Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 239000010949 copper Substances 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- 239000000835 fiber Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000003729 cation exchange resin Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000000909 electrodialysis Methods 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229920002821 Modacrylic Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000001630 malic acid Substances 0.000 description 2
- 235000011090 malic acid Nutrition 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- RHZUVFJBSILHOK-UHFFFAOYSA-N anthracen-1-ylmethanolate Chemical compound C1=CC=C2C=C3C(C[O-])=CC=CC3=CC2=C1 RHZUVFJBSILHOK-UHFFFAOYSA-N 0.000 description 1
- 239000003830 anthracite Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 229920001429 chelating resin Polymers 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000502 dialysis Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 239000003014 ion exchange membrane Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000012492 regenerant Substances 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
- C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
本発明はプリント回路基板表面洗浄液の再生方
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for recycling printed circuit board surface cleaning liquid.
プリント回路基板に製造において、エツチン
グ、ソルダーレジスト、防錆処理等が施される過
程では銅箔表面に対する接着性を良好にするた
め、前工程として銅箔表面の洗浄が行なわれる。
洗浄の都度、銅箔表面に付着した微少物質や銅イ
オンが洗浄液に混入するので、洗浄を繰返すこと
により混入量が増大し、ついには洗浄作用が行な
われなくなる。このため洗浄液から混入物質を除
去して洗浄液を再生する方法が種々知られてい
る。 During the manufacturing of printed circuit boards, the surface of the copper foil is cleaned as a pre-process in order to improve adhesion to the surface of the copper foil during the process of etching, solder resist, anti-rust treatment, etc.
Every time cleaning is performed, minute substances and copper ions adhering to the surface of the copper foil are mixed into the cleaning solution, so as the cleaning is repeated, the amount of the mixture increases until the cleaning action is no longer performed. For this reason, various methods are known for removing contaminants from the cleaning liquid and regenerating the cleaning liquid.
洗浄液から銅イオンを除く方法で代表的なもの
には(1)洗浄液を電気分解して銅を析出させる方
法。(2)洗浄液をイオン交換膜を用いて電気透析に
より銅イオンを分離させる方法(3)洗浄液中の銅イ
オンを選択的にキレート化するキレート剤を用い
てキレートを作り、更にこれを有機溶媒で抽出す
る方法などが知られている。 Typical methods for removing copper ions from cleaning solutions include (1) electrolyzing the cleaning solution to precipitate copper; (2) A method in which copper ions are separated by electrodialysis of the cleaning solution using an ion exchange membrane. (3) A chelate is created using a chelating agent that selectively chelates the copper ions in the cleaning solution, and then this is added to an organic solvent. There are known methods of extraction.
しかし上記(1)の電気分解による方法は銅の析出
効率が悪い、洗浄液中の陰イオンがガス化し液組
成が変化する可能性があるなどの欠点があつた。 However, the method (1) using electrolysis has drawbacks such as poor copper deposition efficiency and the possibility that anions in the cleaning solution may gasify and change the solution composition.
また、上記(2)の電気透析による方法は透析効率
が悪いなどの欠点があり、更に上記(3)の有機溶媒
抽出による方法は操作が複雑化し手間がかかる欠
点があつた。 Furthermore, the method (2) using electrodialysis has drawbacks such as poor dialysis efficiency, and the method (3) using organic solvent extraction has the drawback that the operation is complicated and time-consuming.
本発明の目的は以上述べたような欠点をすべて
解消した新規なプリント回路基板表面洗浄廃液の
再生方法を提供するにある。 An object of the present invention is to provide a novel method for recycling printed circuit board surface cleaning waste liquid that eliminates all of the above-mentioned drawbacks.
本発明はプリント回路基板表面の洗浄液を過
してから、金属に対して選択性が良いキレート型
イオン交換樹脂を通して洗浄液中の銅を吸着除去
し、この際銅とイオン交換して液中に出てくるナ
トリウムイオンをカチオンイオン交換樹脂で吸着
除去して洗浄液中の浮遊物質および銅成分を過
および吸着除去することにより洗浄液を再利用す
ることにより達成される。すなわち、プリント回
路基板表面の洗浄液中の浮遊物質および銅の濃度
が高くなつた場合、これを廃素処分するのではな
く、洗浄液中の浮遊物質および銅成分を除くこと
で洗浄液として再利用できることに着目したのが
本発明の特徴である。 In the present invention, copper in the cleaning solution is passed through the cleaning solution on the surface of the printed circuit board, and then adsorbed and removed through a chelate-type ion exchange resin that has good selectivity toward metals. This is accomplished by reusing the cleaning solution by adsorbing and removing the sodium ions that come from the cleaning solution using a cation ion exchange resin, and removing suspended solids and copper components in the cleaning solution by filtration and adsorption. In other words, if the concentration of suspended solids and copper in the cleaning solution for the surface of a printed circuit board becomes high, instead of disposing of it as waste, it can be reused as a cleaning solution by removing the suspended solids and copper components from the cleaning solution. What we have focused on is the feature of the present invention.
次に本発明で使用する材料について説明する。
過材は、ポリアミド繊維、ポリエステル繊維、
アクリル繊維、モダアクリル繊維、ポリプロピレ
ン繊維、ポリビニリデンクロライド繊維、ポリビ
ニルクロライド繊維、四弗化エチレン繊維、無煙
炭、天然の砂利砂などである。 Next, materials used in the present invention will be explained.
Overmaterials include polyamide fibers, polyester fibers,
These include acrylic fibers, modacrylic fibers, polypropylene fibers, polyvinylidene chloride fibers, polyvinyl chloride fibers, tetrafluoroethylene fibers, anthracite coal, natural gravel and sand, etc.
イオン交換樹脂はキレート型イオン交換樹脂強
酸性カチオンイオン交換樹脂、弱酸性カチオンイ
オン交換樹脂などである。 Ion exchange resins include chelate type ion exchange resins, strongly acidic cation ion exchange resins, and weakly acidic cation ion exchange resins.
次に本発明の詳細を実施例で説明する。 Next, the details of the present invention will be explained using examples.
実施例 １
塩酸（Hcl）４ｇ／、リンゴ酸（C4H6O5）３
ｇ／、イソプロピルアルコール（C3H8O）１
ｇ／、ポリアクリルアミド
〔（CHCONH2CH2）ｎ〕１ｇ１の組成の洗浄液
中の銅濃度が1500mg／となつたので図の洗浄槽
１よりポンプP8を用い、SV2の速度で、ポリプロ
ピレン製の布を保有する過塔３、キレート型
イオン交換樹脂のダイヤイオンCR―10（商品
名）を保有するキレート型イオン交換塔５、強酸
性のカチオンイオン交換樹脂のダイヤイオンPK
―212（商品名）を保有するカチオンイオン交換
樹脂塔６の順に通し、処理したところ洗浄液中の
浮遊物質濃度は５mg／以下、銅濃度は３mg／
以下になつたので、洗浄液として再度使用した。
なお図中のP9〜P10はポンプ、V11〜V22はバル
ヴ、Ｗ２３は流量計、２，４は再生剤槽、７は廃
液処理槽である。またキレート型イオン交換樹脂
は塩酸で洗浄後苛性ソーダーで洗浄して再生を行
なつた。カチオンイオン交換樹脂は塩酸で洗浄し
て再生を行なつた。Example 1 Hydrochloric acid (Hcl) 4g/, malic acid (C 4 H 6 O 5 ) 3
g/, isopropyl alcohol (C 3 H 8 O) 1
Since the copper concentration in the cleaning solution with the composition of 1 g/g/g of polyacrylamide [(CHCONH 2 CH 2 ) n] was 1500 mg/1, the copper concentration in the cleaning solution was 1500 mg/1. A filter column 3 containing cloth, a chelate type ion exchange column 5 containing Diaion CR-10 (trade name), a chelate type ion exchange resin, and a Diaion PK, a strongly acidic cation exchange resin.
-212 (trade name) was passed through the cation exchange resin tower 6 and treated, the suspended solids concentration in the cleaning solution was less than 5mg/, and the copper concentration was 3mg/
Since the concentration was below, I used it again as a cleaning solution.
In the figure, P9 to P10 are pumps, V11 to V22 are valves, W23 is a flow meter, 2 and 4 are regenerant tanks, and 7 is a waste liquid treatment tank. The chelate type ion exchange resin was washed with hydrochloric acid and then washed with caustic soda for regeneration. The cation exchange resin was regenerated by washing with hydrochloric acid.
実施例 ２
塩酸14ｇ／、酒石酸（C4H6O6）３ｇ／、
エチルアルコール（C2H6O）１ｇ／の組成の洗
浄液中の銅濃度が1200mg／となつたので実施例
１と同様の工程で洗浄液をSV6の速度でポリプロ
ピレン製の布、キレート型イオン交換樹脂のユ
ニチカキレート樹脂（商品名）、強酸性カチオン
イオン交換樹脂のアンバーライトIR―120B（商
品名）の順に通し、処理したところ洗浄液中の浮
遊物質濃度は５mg／以下、銅濃度は３mg／以
下になつたので、洗浄液として再度使用した。な
おキレートイオン交換樹脂、カチオンイオン交換
樹脂の再生は実施例１と同様に行なつた。Example 2 Hydrochloric acid 14g/, tartaric acid (C 4 H 6 O 6 ) 3g/,
Since the copper concentration in the cleaning solution with the composition of 1g/ethyl alcohol (C 2 H 6 O) was 1200mg/, the cleaning solution was washed in the same process as in Example 1 at a speed of SV6 using polypropylene cloth and chelate type ion exchange resin. Unitika chelate resin (trade name) and strongly acidic cation ion exchange resin Amberlite IR-120B (trade name) were passed through in that order, and the suspended solids concentration in the cleaning solution was less than 5mg/, and the copper concentration was less than 3mg/. It got old, so I used it again as a cleaning solution. The chelate ion exchange resin and cation ion exchange resin were regenerated in the same manner as in Example 1.
実施例 ３
硫酸（H2SO4）６ｇ／、リンゴ酸
（C4H6O5）２ｇ／、イソプロピルアルコール
（C3H8O）１ｇ／の組成の洗浄液中の銅濃度が
1100mg／となつたので、実施例１と同様の工程
で、洗浄液をSV4の速度でポリプロピレン製の
布、キレート型イオン交換樹脂のダイヤイオン
CR―10（商品名）、強酸性カチオンイオン交換樹
脂のダイヤイオンRMK―120の順に通し、処理し
たところ洗浄液中の浮遊物質濃度は５mg／以下
銅濃度は３mg／以下になつたので、洗浄液とし
て再度使用した。なおキレート型イオン交換樹
脂、カチオンイオン交換樹脂の再生は実施例１と
同様に行なつた。Example 3 The copper concentration in a cleaning solution with a composition of 6 g/of sulfuric acid (H 2 SO 4 ), 2 g/of malic acid (C 4 H 6 O 5 ), and 1 g/of isopropyl alcohol (C 3 H 8 O) was
The amount was 1100mg/, so in the same process as in Example 1, the cleaning solution was washed with polypropylene cloth and chelate type ion exchange resin Diamond Ion at a speed of SV4.
CR-10 (product name) and the strongly acidic cation ion exchange resin Diamond RMK-120 were passed through and treated, and the suspended solids concentration in the cleaning solution was 5mg/or less.The copper concentration was 3mg/or less, so it can be used as a cleaning solution. Used again. Note that the chelate type ion exchange resin and the cation ion exchange resin were regenerated in the same manner as in Example 1.
実施例 ４
アンモニア（NH4OH）２ｇ／過硫酸アンモ
ニウム〔（（NH4）2S2O8）〕１ｇ／、イソプロピ
ルアルコール（C3H8O）１ｇ／トリエタノール
アミン〔（HOCH2CH2）3N〕１ｇ／の組成の洗
浄液中の銅濃度が1500mg／となつたので、実施
例１と同様の工程で、洗浄液をSV2の速度で、モ
ダアクリル酸の布キレート型イオン交換樹脂の
ユニチカキレート樹脂（商品名）弱酸性カチオン
イオン交換樹脂のダイヤイオンKV―10（商品
名）の順に通し処理したところ洗浄液中の浮遊物
質濃度は５mg／以下、銅濃度は３mg／以下に
なつたので、洗浄液として再度使用した。Example 4 Ammonia (NH 4 OH) 2 g/ammonium persulfate [((NH 4 ) 2 S 2 O 8 )] 1 g/, isopropyl alcohol (C 3 H 8 O) 1 g/triethanolamine [(HOCH 2 CH 2 )] Since the copper concentration in the cleaning solution with a composition of 1g/ 3N was 1500mg/, the cleaning solution was mixed with Unitika chelate resin, a cloth chelate type ion exchange resin of modacrylic acid, at a speed of SV2 in the same process as in Example 1. (Product name) When the cleaning solution was passed through the slightly acidic cation exchange resin Diaion KV-10 (Product name), the suspended solids concentration in the cleaning solution was less than 5mg/, and the copper concentration was less than 3mg/, so it could be used as a cleaning solution. Used again.
なお、キレート型イオン交換樹脂、カチオンイ
オン交換樹脂の再生は実施例１と同様に行なつ
た。 Note that the chelate type ion exchange resin and the cation ion exchange resin were regenerated in the same manner as in Example 1.
以上述べたように本発明はプリント回路基板表
面の洗浄液をイオン交換樹脂法により処理し、処
理液は同工程の洗浄液として使用できる。 As described above, in the present invention, a cleaning liquid for the surface of a printed circuit board is treated by an ion exchange resin method, and the treatment liquid can be used as a cleaning liquid in the same process.
本発明によれば液中に含まれる銅イオンを電気
透折法溶媒抽出法などの複雑な工程を経て、洗浄
液として再生する方法に比較し容易に再生できる
ため省資源省エネルギーに役立つことができる。 According to the present invention, the copper ions contained in the liquid can be easily regenerated as compared to a method in which the copper ions contained in the liquid are regenerated as a cleaning liquid through a complicated process such as an electrodialysis method and a solvent extraction method, thereby contributing to resource and energy conservation.
図は本発明に用いるプリント回路基板表面洗浄
液の再生装置のブロツク図である。
１……洗浄液槽、３……過槽、５……キレー
ト型イオン交換塔、６……カチオンイオン交換
塔。
The figure is a block diagram of an apparatus for regenerating printed circuit board surface cleaning liquid used in the present invention. 1... Washing liquid tank, 3... Filter tank, 5... Chelate type ion exchange tower, 6... Cation ion exchange tower.
Claims (1)
板表面を洗浄して使用できなくなつた洗浄廃液中
の浮遊物質を過して次にキレート型イオン交換
樹脂で銅イオンをイオン交換し、同樹脂でイオン
交換されてでてくるナトリウムイオンをカチオン
イオン交換樹脂でイオン交換処理した液を再度洗
浄液として利用することを特徴とするプリント回
路基板表面洗浄液の再生方法。1. In the printed circuit board manufacturing process, the surface of the printed circuit board is cleaned, and the suspended solids in the cleaning waste liquid that is no longer usable are filtered out. Next, the copper ions are ion-exchanged with a chelate type ion exchange resin, and then the copper ions are ion-exchanged with the same resin. 1. A method for regenerating a printed circuit board surface cleaning solution, which comprises ion-exchanging the resulting sodium ions with a cation ion exchange resin and using the solution again as a cleaning solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13369878A JPS5562794A (en) | 1978-11-01 | 1978-11-01 | Method of regnerating printed circuit board surface cleanser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13369878A JPS5562794A (en) | 1978-11-01 | 1978-11-01 | Method of regnerating printed circuit board surface cleanser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5562794A JPS5562794A (en) | 1980-05-12 |
| JPS626678B2 true JPS626678B2 (en) | 1987-02-12 |
Family
ID=15110785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13369878A Granted JPS5562794A (en) | 1978-11-01 | 1978-11-01 | Method of regnerating printed circuit board surface cleanser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5562794A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1283031C (en) * | 1986-07-01 | 1991-04-16 | Digital Equipment Corporation | On-line filtration of potassium permanganate solutions |
| US6346195B1 (en) | 1998-07-10 | 2002-02-12 | U.S. Filter Corporation | Ion exchange removal of metal ions from wastewater |
| US6140130A (en) * | 1998-07-13 | 2000-10-31 | Nalco Chemical Company | Detection and removal of copper from wastewater streams from semiconductor and printed circuit board processing |
| US6398964B1 (en) * | 1999-08-19 | 2002-06-04 | Koch Microelectronic Service Company, Inc. | Process for treating aqueous waste containing copper and copper CMP particles |
| US7488423B2 (en) | 2005-08-02 | 2009-02-10 | Siemens Water Technologies Holding Corp. | System and method of slurry treatment |
-
1978
- 1978-11-01 JP JP13369878A patent/JPS5562794A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5562794A (en) | 1980-05-12 |
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