JPS6265678U - - Google Patents
Info
- Publication number
- JPS6265678U JPS6265678U JP15748985U JP15748985U JPS6265678U JP S6265678 U JPS6265678 U JP S6265678U JP 15748985 U JP15748985 U JP 15748985U JP 15748985 U JP15748985 U JP 15748985U JP S6265678 U JPS6265678 U JP S6265678U
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- crystal display
- display board
- conductor
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004973 liquid crystal related substance Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Description
第１図ａは、本考案の平面を示す略図で、液晶
表示板を構成する上ガラス基板９、ＩＣを実装す
るガラス基板８から成り立つ。第１図ｂは、第１
図ａのＸ―Ｘ′の断面を示す略図である。第２図
は従来の構造を示す断面図である。
１……導電接着剤、２……金バンプ、２′……
銅バンプ、３……バンプマスクフイルム、４……
モールド剤、５……金バンプＩＣ、５′……ハン
ダバンプＩＣ、６……枠、７……リード電極、８
……ガラス基板、９……上ガラス基板、１０……
ハンダ。
FIG. 1a is a schematic plan view of the present invention, which comprises an upper glass substrate 9 constituting a liquid crystal display panel and a glass substrate 8 on which an IC is mounted. Figure 1b shows the first
FIG. 3 is a schematic diagram showing a cross section taken along line XX′ in FIG. FIG. 2 is a sectional view showing a conventional structure. 1... Conductive adhesive, 2... Gold bump, 2'...
Copper bump, 3... Bump mask film, 4...
Molding agent, 5... Gold bump IC, 5'... Solder bump IC, 6... Frame, 7... Lead electrode, 8
...Glass substrate, 9...Top glass substrate, 10...
Solder.
Claims (1)
下ＩＣと略す）を、フエースダウンで導電性や異
方性の接着剤、もしくはハンダを導電体とし導通
させるＩＣの実装構造において、液晶表示板のリ
ード電極部を、絶縁性の高分子材料を接着被覆し
、ＩＣの電極パツド部に対向するリード電極部を
開孔し、その開孔部に導電性の接着剤やハンダペ
ースト等の導電体を充填し、対向するＩＣの電極
パツドをフエースダウンで合せ、加熱や加圧を行
い導電体を硬化もしくはリフローさせ、液晶表示
板にＩＣを実装する事を特徴とする液晶表示板の
ＩＣ実装構造。 (2) 前記ＩＣの電極パツドに金等のバンプを設
置し、バンプの凸高さが、前記高分子材料の厚み
より低い事を特徴とした実用新案登録請求の範囲
の範囲第１項記載の液晶表示板のＩＣ実装構造。[Scope of Claim for Utility Model Registration] (1) An integrated circuit (hereinafter abbreviated as IC) is connected face-down to the lead electrode part of a liquid crystal display board using a conductive or anisotropic adhesive or solder as a conductor. In the IC mounting structure, the lead electrode portion of the liquid crystal display board is adhesively coated with an insulating polymer material, a hole is formed in the lead electrode portion facing the electrode pad portion of the IC, and a conductive material is injected into the hole. It is characterized by filling a conductor such as adhesive or solder paste, aligning the electrode pads of opposing ICs face-down, applying heat or pressure to harden or reflow the conductor, and mounting the IC on a liquid crystal display board. IC mounting structure of liquid crystal display board. (2) Bumps made of gold or the like are installed on the electrode pads of the IC, and the height of the protrusion of the bumps is lower than the thickness of the polymeric material. IC mounting structure of liquid crystal display board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15748985U JPH0410617Y2 (en) | 1985-10-15 | 1985-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15748985U JPH0410617Y2 (en) | 1985-10-15 | 1985-10-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6265678U true JPS6265678U (en) | 1987-04-23 |
| JPH0410617Y2 JPH0410617Y2 (en) | 1992-03-16 |
Family
ID=31080083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15748985U Expired JPH0410617Y2 (en) | 1985-10-15 | 1985-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0410617Y2 (en) |
-
1985
- 1985-10-15 JP JP15748985U patent/JPH0410617Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0410617Y2 (en) | 1992-03-16 |
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