JPS6265276U - - Google Patents

Info

Publication number
JPS6265276U
JPS6265276U JP15806485U JP15806485U JPS6265276U JP S6265276 U JPS6265276 U JP S6265276U JP 15806485 U JP15806485 U JP 15806485U JP 15806485 U JP15806485 U JP 15806485U JP S6265276 U JPS6265276 U JP S6265276U
Authority
JP
Japan
Prior art keywords
board
chip
mold frame
card module
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15806485U
Other languages
English (en)
Other versions
JPH0450145Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985158064U priority Critical patent/JPH0450145Y2/ja
Publication of JPS6265276U publication Critical patent/JPS6265276U/ja
Application granted granted Critical
Publication of JPH0450145Y2 publication Critical patent/JPH0450145Y2/ja
Expired legal-status Critical Current

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Description

【図面の簡単な説明】
第１図は本考案の一実施例の側断面図。番２図
は従来の基板の側断面図。 １，５……第１の基板、２，６……第２の基板
、３，７……モールド枠、４……接着剤、９……
ダイパツド部、１０……ＩＣチツプ。

Claims (1)

  1. 【実用新案登録請求の範囲】 多層基板とモールド枠とが一体となつている、
    ＩＣカードモジユール基板において、 (a) 片面に入出力用端子、もう一方の面に、ダ
    イパツトパターンを有する第１の基板と、 (b) ボンデイングパツドを有し、基板の両面に
    配線の為のパターンが形成されており、ＩＣチツ
    プが納まる抜き穴が設けてある黒色の第２の基板
    と、 (c) ダイパツド部と、ボンデイングパツドを逃
    げて抜き穴が形成されているモールド枠 とから成る事を特徴とするＩＣカードモジユール
    基板。
JP1985158064U 1985-10-16 1985-10-16 Expired JPH0450145Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985158064U JPH0450145Y2 (ja) 1985-10-16 1985-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985158064U JPH0450145Y2 (ja) 1985-10-16 1985-10-16

Publications (2)

Publication Number Publication Date
JPS6265276U true JPS6265276U (ja) 1987-04-23
JPH0450145Y2 JPH0450145Y2 (ja) 1992-11-26

Family

ID=31081197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985158064U Expired JPH0450145Y2 (ja) 1985-10-16 1985-10-16

Country Status (1)

Country Link
JP (1) JPH0450145Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158443U (ja) * 1982-04-14 1983-10-22 ニチコン株式会社 混成集積回路基板
JPS58218164A (ja) * 1982-05-31 1983-12-19 Nec Home Electronics Ltd 厚膜印刷基板
JPS59193596A (ja) * 1983-04-18 1984-11-02 Kyodo Printing Co Ltd Ｉｃカ−ド用ｉｃモジユ−ル

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158443U (ja) * 1982-04-14 1983-10-22 ニチコン株式会社 混成集積回路基板
JPS58218164A (ja) * 1982-05-31 1983-12-19 Nec Home Electronics Ltd 厚膜印刷基板
JPS59193596A (ja) * 1983-04-18 1984-11-02 Kyodo Printing Co Ltd Ｉｃカ−ド用ｉｃモジユ−ル

Also Published As

Publication number Publication date
JPH0450145Y2 (ja) 1992-11-26

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