JPS6263631A - 半導体装置用Ｃｕ合金リ−ド素材 - Google Patents

半導体装置用Ｃｕ合金リ−ド素材

Info

Publication number
JPS6263631A
JPS6263631A JP20311785A JP20311785A JPS6263631A JP S6263631 A JPS6263631 A JP S6263631A JP 20311785 A JP20311785 A JP 20311785A JP 20311785 A JP20311785 A JP 20311785A JP S6263631 A JPS6263631 A JP S6263631A
Authority
JP
Japan
Prior art keywords
alloy lead
alloy
semiconductor devices
elongation
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20311785A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6311415B2 (enrdf_load_stackoverflow
Inventor
Hidetoshi Akutsu
阿久津　英俊
Takuro Iwamura
岩村　卓郎
Masao Kobayashi
正男 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP20311785A priority Critical patent/JPS6263631A/ja
Priority to US06/903,514 priority patent/US4749548A/en
Priority to GB8621958A priority patent/GB2181742B/en
Priority to DE19863631119 priority patent/DE3631119A1/de
Publication of JPS6263631A publication Critical patent/JPS6263631A/ja
Priority to US07/166,217 priority patent/US4872048A/en
Publication of JPS6311415B2 publication Critical patent/JPS6311415B2/ja
Priority to GB8907058A priority patent/GB2219473B/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP20311785A 1985-09-13 1985-09-13 半導体装置用Ｃｕ合金リ−ド素材 Granted JPS6263631A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP20311785A JPS6263631A (ja) 1985-09-13 1985-09-13 半導体装置用Ｃｕ合金リ−ド素材
US06/903,514 US4749548A (en) 1985-09-13 1986-09-03 Copper alloy lead material for use in semiconductor device
GB8621958A GB2181742B (en) 1985-09-13 1986-09-11 Copper alloy lead material for use in semiconductor device
DE19863631119 DE3631119A1 (de) 1985-09-13 1986-09-12 Leitermaterial auf basis von kupferlegierungen zur anwendung fuer halbleitervorrichtungen
US07/166,217 US4872048A (en) 1985-09-13 1988-03-10 Semiconductor device having copper alloy leads
GB8907058A GB2219473B (en) 1985-09-13 1989-03-29 Copper alloy lead material for use in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20311785A JPS6263631A (ja) 1985-09-13 1985-09-13 半導体装置用Ｃｕ合金リ−ド素材

Publications (2)

Publication Number Publication Date
JPS6263631A true JPS6263631A (ja) 1987-03-20
JPS6311415B2 JPS6311415B2 (enrdf_load_stackoverflow) 1988-03-14

Family

ID=16468680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20311785A Granted JPS6263631A (ja) 1985-09-13 1985-09-13 半導体装置用Ｃｕ合金リ−ド素材

Country Status (1)

Country Link
JP (1) JPS6263631A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104878243A (zh) * 2015-06-25 2015-09-02 潘应生 一种铜铝合金及其制备方法
CN104878242A (zh) * 2015-06-25 2015-09-02 潘应生 一种铜铝合金及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104878243A (zh) * 2015-06-25 2015-09-02 潘应生 一种铜铝合金及其制备方法
CN104878242A (zh) * 2015-06-25 2015-09-02 潘应生 一种铜铝合金及其制备方法

Also Published As

Publication number Publication date
JPS6311415B2 (enrdf_load_stackoverflow) 1988-03-14

Similar Documents

Publication Publication Date Title
US4749548A (en) Copper alloy lead material for use in semiconductor device
JP4441467B2 (ja) 曲げ加工性及び耐応力緩和特性を備えた銅合金
JPS5853057B2 (ja) 高導電性銅基合金
JP3797882B2 (ja) 曲げ加工性が優れた銅合金板
JPS5974251A (ja) 電気，電子部品用銅合金の製造方法
CN105525135B (zh) 一种高强低各向异性指数的Cu‑Ni‑Si系合金及其制备工艺
JP2008127605A (ja) 曲げ加工性に優れた高強度銅合金板
JP3511648B2 (ja) 高強度Ｃｕ合金薄板条の製造方法
JPS6270540A (ja) 半導体装置用Ｃｕ合金リ−ド素材
JPH01272733A (ja) 半導体装置用Ｃｕ合金製リードフレーム材
JPS6160846A (ja) 半導体装置用銅合金リ−ド材
JPS61257443A (ja) 半導体装置用Ｃｕ合金リ−ド素材
JPS6263631A (ja) 半導体装置用Ｃｕ合金リ−ド素材
JPS6296638A (ja) リ−ドフレ−ム用アルミニウム合金
JPS6338413B2 (enrdf_load_stackoverflow)
JPS6142772B2 (enrdf_load_stackoverflow)
US20030029532A1 (en) Nickel containing high copper alloy
JPS6270542A (ja) 半導体装置用Ｃｕ合金リ−ド素材
JPS63293147A (ja) 高強度リ−ドフレ−ム用鉄銅クロム合金薄帯の製造方法
JPS6311418B2 (enrdf_load_stackoverflow)
JPS6311416B2 (enrdf_load_stackoverflow)
JP3407527B2 (ja) 電子機器用銅合金材
JPS64449B2 (enrdf_load_stackoverflow)
JPH01180930A (ja) 電子電気機器のＣｕ合金製コネクタ材
JPS6245298B2 (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees