JPS6262488U

JPS6262488U -

Info

Publication number: JPS6262488U
Application number: JP15328685U
Authority: JP
Priority date: 1985-10-07
Filing date: 1985-10-07
Publication date: 1987-04-17

Description

[Brief explanation of the drawing]

第１図はこの考案の一実施例を示すもので電子
装置全体の斜視図、第２図は第１図のＡ部詳細図
、第３図は第１図のＢ―Ｂ線断面図である。第４
図および第６図はそれぞれ第１図のＡ部と同じ位
置を示した従来技術による詳細図、第５図および
第７図はそれぞれ第１図のＢ―Ｂ線断面と同方向
から見た従来の技術による電子装置の断面図であ
る。図において、１は電子装置、２は回路モジユー
ル、３はプリント配線板、４は放熱板、５は回路
部品、６は箱体、７は切り込み、８はこの考案に
よる板ばね、９は冷媒、１０は熱の流れ、１１，
１２は従来技術による板ばねである。なお図中同
一符号は同一または相当部分を示す。 Fig. 1 shows an embodiment of this invention, and is a perspective view of the entire electronic device, Fig. 2 is a detailed view of section A in Fig. 1, and Fig. 3 is a cross-sectional view taken along the line BB in Fig. 1. . Fourth
Figures 5 and 6 are detailed views of the prior art showing the same position as section A in Figure 1, and Figures 5 and 7 are views of the conventional technology seen from the same direction as the cross section taken along line B-B in Figure 1. 1 is a cross-sectional view of an electronic device according to the technique of FIG. In the figure, 1 is an electronic device, 2 is a circuit module, 3 is a printed wiring board, 4 is a heat sink, 5 is a circuit component, 6 is a box, 7 is a notch, 8 is a leaf spring according to this invention, 9 is a refrigerant, 10 is heat flow, 11,
12 is a leaf spring according to the prior art. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims

[Scope of utility model registration request]

In an electronic device configured by housing a required number of circuit modules in which circuit components are mounted on a printed wiring board via a heat sink in a box, the circuit modules are located in a direction perpendicular to the direction in which the circuit modules are inserted into the box. , and a notch having a rectangular cross section is provided on the inner surface of the box facing inward with respect to the center of the box, and when the module is inserted into the box, both ends of the module bite into the notch. Furthermore, a metal plate spring having a substantially S-shaped cross section is installed between the heat dissipation plate on the module and the concave surface created by providing a notch in the inner surface of the box. By inserting the heat dissipating plate on the module, the leaf spring, and the box body, the heat dissipation plate on the module, the leaf spring, and the box body can be spaced by the required area or more, even if the position or angle of the module with respect to the notch on the inner surface of the box body is misaligned. A heat dissipation structure for an electronic device, characterized in that it can be brought into contact with each other.