JPH0241495U - - Google Patents

Description

[Brief explanation of the drawing]

Figure 1 shows an embodiment of this invention, and is a perspective view of the entire electronic device, Figure 2 is a detailed view of section A in Figure 1, Figure 3 is a sectional view taken along line B--B in Figure 1, and Figure 4 is a detailed view of the prior art shown in the same position as section A in Figure 1, and Figure 5 is a sectional view of the prior art electronic device taken from the same direction as the cross section taken along line B--B in Figure 1. be. In the figure, 1 is an electronic device, 2 is a circuit module, 3 is a printed wiring board, 4 is a circuit component, 5 is a box, 6 is a notch, 7 is a metal fitting made of a shape memory alloy according to this invention, and 8 is a heat exchanger. 9 is the refrigerant, 10 is the motherboard, 11 is the connector on the motherboard, 12 is the connector on the circuit module, 13 is the center of the thickness of the circuit module, and 14 is the center of the width of the cut.
Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Scope of utility model registration request] In an electronic device, a circuit module in which circuit components are mounted on a printed wiring board is provided in a box body, and a notch having a rectangular cross section perpendicular to the direction in which the module is inserted is provided at a position corresponding to the module. Shape memory alloy metal fittings having a substantially U-shaped cross section are fixed to both ends, and when the electronic device is at a high temperature, the shape memory alloy metal fittings attached to both ends of the module are deformed by heat. A heat dissipation structure for an electronic device, characterized in that the structure follows the rectangular notch of the electronic device.