JPH03106793U - - Google Patents

Info

Publication number
JPH03106793U
JPH03106793U JP1430990U JP1430990U JPH03106793U JP H03106793 U JPH03106793 U JP H03106793U JP 1430990 U JP1430990 U JP 1430990U JP 1430990 U JP1430990 U JP 1430990U JP H03106793 U JPH03106793 U JP H03106793U
Authority
JP
Japan
Prior art keywords
electronic circuit
pin
heat sink
round hole
circuit component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1430990U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1430990U priority Critical patent/JPH03106793U/ja
Publication of JPH03106793U publication Critical patent/JPH03106793U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案による電子回路モジユールの
一実施例を示す外観図、第2図は第1図の断面C
Cを示す図、第3図は従来の代表的な電子回路モ
ジユールを示す外観図、第4図は第3図の断面A
Aを示す図、第5図は第3図に示す電子回路モジ
ユールを実装した電子機器の外観図、第6図は第
5図の断面BBを示す図である。 図において、1……電子回路モジユール、2…
…プリント配線板、3……放熱板、4……IC、
5……LSI、6……シヤーシ、7……開口部、
8……カバー、9……隔壁、10……通風ダクト
、11……放熱フイン、12……外部ダクト、1
3……冷却空気、14……溝、15……端部、1
6……ピン、17……丸穴、18……サラ穴、1
9……ハンダフイレツト、20……熱伝導ラバー
である。なお、各図中同一符号は同一又は相当部
分を示す。
Fig. 1 is an external view showing an embodiment of an electronic circuit module according to this invention, and Fig. 2 is a cross section C of Fig. 1.
Figure 3 is an external view of a typical conventional electronic circuit module, Figure 4 is cross section A of Figure 3.
5 is an external view of an electronic device in which the electronic circuit module shown in FIG. 3 is mounted, and FIG. 6 is a view showing cross section BB of FIG. 5. In the figure, 1...electronic circuit module, 2...
...Printed wiring board, 3... Heat sink, 4... IC,
5... LSI, 6... Chassis, 7... Opening,
8... Cover, 9... Partition wall, 10... Ventilation duct, 11... Heat radiation fin, 12... External duct, 1
3...Cooling air, 14...Groove, 15...End, 1
6... Pin, 17... Round hole, 18... Flat hole, 1
9...Solder fillet, 20...Heat conductive rubber. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 矩形平板状の外形をなし、かつ一面にはグリツ
ド状に配置されたピンを有する電子回路部品と、
上記電子回路部品と対向する一面は、上記ピンの
太さより若干大きな丸穴を備え、かつ反対面には
上記丸穴を面取りしたサラ穴を形成するとともに
、上記丸穴に上記電子回路部品のピンが挿入され
た金属製の平板状の放熱板と、上記放熱板と上記
電子回路部品との双方に対し密着するように配せ
られたポリオレフイン系エストラマーとAl
系フイラーを主成分とする熱伝導性ラバーと、
上記ピンが挿入されるとともにハンダ付けされた
スルーホールを備え、かつ上記放熱板の上記熱伝
導ラバーと密着する面と反対側の面に接するよう
に配されたプリント配線板とで構成したことを特
徴とする電子回路モジユール。
An electronic circuit component having a rectangular flat plate shape and having pins arranged in a grid on one side;
One side facing the electronic circuit component has a round hole slightly larger than the thickness of the pin, and the opposite side has a chamfered countersunk hole, and the round hole is provided with a round hole that is slightly larger than the thickness of the pin. A flat metal heat sink into which is inserted, a polyolefin elastomer and Al 2 O arranged so as to be in close contact with both the heat sink and the electronic circuit component.
A thermally conductive rubber whose main component is 3- type filler,
The printed wiring board is provided with a through hole into which the pin is inserted and soldered, and is arranged so as to be in contact with a surface of the heat sink that is in close contact with the heat conductive rubber and a surface on the opposite side. Characteristic electronic circuit module.
JP1430990U 1990-02-16 1990-02-16 Pending JPH03106793U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1430990U JPH03106793U (en) 1990-02-16 1990-02-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1430990U JPH03106793U (en) 1990-02-16 1990-02-16

Publications (1)

Publication Number Publication Date
JPH03106793U true JPH03106793U (en) 1991-11-05

Family

ID=31517678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1430990U Pending JPH03106793U (en) 1990-02-16 1990-02-16

Country Status (1)

Country Link
JP (1) JPH03106793U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130021141A (en) * 2011-08-22 2013-03-05 엘지전자 주식회사 An information management system for home appliance

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130021141A (en) * 2011-08-22 2013-03-05 엘지전자 주식회사 An information management system for home appliance

Similar Documents

Publication Publication Date Title
JPS6441192U (en)
JPH03106793U (en)
JPH042091U (en)
JPH03112995U (en)
JPS6441195U (en)
JPS6444689U (en)
JPS6439697U (en)
JPS6439696U (en)
JPS6441191U (en)
JPS6377399U (en)
JPH042090U (en)
JPS6444690U (en)
JPH042089U (en)
JPH0211395U (en)
JPS5910790Y2 (en) package structure
JPS63165891U (en)
JPH0222956Y2 (en)
JPS6444688U (en)
JPH0455194U (en)
JPS59177955U (en) Heatsink used for printed wiring boards
JPH02146890U (en)
JPH0472692U (en)
JPS6318890U (en)
JPS6444692U (en)
JPS6127391U (en) Heat dissipation structure of input/output unit