JPS6262463B2 - - Google Patents
Info
- Publication number
- JPS6262463B2 JPS6262463B2 JP57028519A JP2851982A JPS6262463B2 JP S6262463 B2 JPS6262463 B2 JP S6262463B2 JP 57028519 A JP57028519 A JP 57028519A JP 2851982 A JP2851982 A JP 2851982A JP S6262463 B2 JPS6262463 B2 JP S6262463B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- chuck
- supply
- unloading
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 description 87
- 230000003028 elevating effect Effects 0.000 description 5
- 239000010409 thin film Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、CVD装置用ウエハセツターに関す
る。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a wafer setter for a CVD apparatus.
従来、CVD装置の加熱板上に被処理体である
ウエハを設置する場合、キヤリア上のウエハをバ
キユームピンセツトで吸着して保持し、手作業に
よつてバキユームピンセツトを加熱板の上方に移
送することにより行つていた。また、処理後の被
処理体は、バキユームピンセツトを使用して前述
の設置操作と同様の操作を逆の手順ですることに
より、キヤリア上に収納されていた。
Conventionally, when placing a wafer as an object to be processed on the heating plate of a CVD device, the wafer on the carrier was attracted and held with vacuum tweezers, and the vacuum tweezers were manually moved above the heating plate. This was done by transferring it to Further, the processed object was stored on the carrier by performing the same operation as the above-mentioned installation operation in reverse order using vacuum tweezers.
このようなバキユームピンセツトを使用してウ
エハを加熱板上に設置し、またキヤリア上に収納
するものでは、次のような欠点がある。
Using such vacuum tweezers to place the wafer on a heating plate and storing it on a carrier has the following drawbacks.
バキユームピンセツトで吸着する際に、ウエ
ハの表面に傷がつく。 The surface of the wafer is scratched when it is picked up with vacuum tweezers.
被処理後のウエハをバキユームチヤツクで吸
着して保持する際に、ウエハの表面に形成され
た薄膜にバキユームチヤツクの傷が付き、不良
製品が発生する。 When the wafer to be processed is sucked and held by a vacuum chuck, the thin film formed on the surface of the wafer is scratched by the vacuum chuck, resulting in defective products.
バキユームチヤツクによるウエハの設置及び
回収は、手作業で行われるため、作業時間が長
くなる。 The installation and collection of wafers using a vacuum chuck is performed manually, which requires a long working time.
本発明は、薄膜形成処理の前後でウエハの表面
に損傷が発生するのを防止し、かつ、ウエハの移
送操作を自動化して作業性の向上を図つたCVD
装置用ウエハセツターを提供するものである。
The present invention aims to improve workability by preventing damage to the wafer surface before and after thin film forming processing, and by automating the wafer transfer operation.
The present invention provides a wafer setter for equipment.
〔発明の概要〕
本発明は、ウエハを水平状態で固定する吸着部
を備えた供給用チヤツク及び搬出用チヤツクをウ
エハ供給搬出部に設け、このウエハ供給搬出部か
らウエハを水平状態で収容する収容部を備えたバ
キユームヘツドによりウエハを搬出してヒータブ
ロツク上に供給し、処理後にヒータブロツクから
ウエハ供給搬出部に戻すようにしたので、薄膜形
成処理の前後でウエハの表面に損傷が発生するの
を防止し、かつ、ウエハの移送操作を自動化して
作業性を向上させることができるCVD装置用ウ
エハセツターである。[Summary of the Invention] The present invention provides a storage system in which a wafer supply/unloading section is provided with a supply chuck and an unloading chuck equipped with a suction section for fixing wafers in a horizontal state, and a storage system is provided in which wafers are received horizontally from the wafer supply/unloading section. The wafer is carried out and fed onto the heater block using a vacuum head equipped with a section, and after processing is returned from the heater block to the wafer supply and carry-out section, thereby preventing damage to the wafer surface before and after the thin film forming process. This is a wafer setter for CVD equipment that can prevent this and improve work efficiency by automating the wafer transfer operation.
本発明の実施例について図面を参照して説明す
る。第１図は、本発明の一実施例の正面図、第２
図は、同実施例の側面図である。図中１は、ウエ
ハ供給搬出部である。ウエハ供給搬出部１には、
供給用チヤツク２……と搬出用チヤツク３……が
複数個設けられている。供給用チヤツク２……及
び搬出用チヤツク３……は昇降シリンダー４を取
付けた基台５上に立設されている。供給用チヤツ
ク２……及び搬出用チヤツク３……は、昇降シリ
ンダー４によつて昇降動するようになつている。
供給用チヤツク２……及び搬出用チヤツク３……
の先端部には、ウエハ６を水平状態で固定する吸
着部７が設けられている。吸着部７は、供給用チ
ヤツク２……搬出用チヤツク３……の中空部を介
して図示しない排気機構に連通した開口を先端面
に有しており、排気機構により中空部内を減圧状
態にしてウエハ６を固定するようになつている。
吸着部７の近傍には、ウエハセンサ８とウエハス
トツパ９が夫々設けられている。ウエハストツパ
９は、供給用チヤツク２……及び搬出用チヤツク
３……の昇降動方向に沿つて上下動するようにな
つている。ウエハ供給搬出部１の近傍には、処理
前のウエハ６が収納されたキヤリアエレベータ１
０と、処理後のウエハ６が収納されるキヤリアエ
レベータ１１とが昇降自在に設けられている。こ
れらのキヤリアエレベータ１０，１１と供給用チ
ヤツク２……及び搬出用チヤツク３……間には搬
送ベルト１２が介在されている。キヤリアエレベ
ータ１０，１１は、供給用チヤツク２……と搬出
用チヤツク３……及びウエハストツパ９の昇降動
に同期して上下動するようになつている。供給用
チヤツク２……及び搬出用チヤツク３……の上方
には、これらに対向してバキユームヘツド１３が
設けられている。バキユームヘツド１３は、支持
アーム１４に取付けられている。支持アーム１４
は、ウエハ供給搬出部１と図示しないCVD装置
本体内に出入するヒータブロツク１５間の上方に
架設されたヘツドガイド１６上を駆動モータ２３
によつて往復動するようになつている。支持アー
ム１４には、バキユームヘツド１３をヘツドガイ
ド１６とヒータブロツク１５間で上下動させる昇
降シリンダ１７が取付けられている。バキユーム
ヘツド１３の先端部には、第３図に示す如く、ウ
エハ６を水平状態で保持するようにすり鉢状の収
容部１８が形成されている。バキユームヘツド１
３は、この収容部１８に開口した中空部１９を介
して図示しない排気機構に連通しており、排気機
構によつて収容部１８内を減圧状態にすることに
より、ウエハ６を保持するようになつている。ま
た、バキユームヘツド１３には、ヒータブロツク
１５上のヒータプレート２０面にウエハ６が当接
する際の衝撃を緩和するためのばね２１と、任意
の角度のヒータプレート２０面に対してウエハ６
が完全に密着するように球面軸受２２が内蔵され
ている。また、ヒータブロツク１５には、ヒータ
プレート２０のパルス当りの移動量と単位時間当
りのパルス数で表わされるヒータプレート２０の
移動速度とを算出するロータリーエンコーダ２４
が取付けられている。支持アーム１４には、同様
にバキユームヘツド１３の移動量と移動速度を算
出するロータリーエンコーダ２５が取付けられて
いる。
Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of one embodiment of the present invention, and FIG.
The figure is a side view of the same embodiment. 1 in the figure is a wafer supply and carry-out section. The wafer supply and unloading section 1 includes
A plurality of supply chucks 2 . . . and discharge chucks 3 . . . are provided. The supply chuck 2 . . . and the unloading chuck 3 . The supply chuck 2 . . . and the unloading chuck 3 .
Supply chuck 2... and unloading chuck 3...
A suction portion 7 for fixing the wafer 6 in a horizontal state is provided at the tip thereof. The suction unit 7 has an opening in its tip face that communicates with an exhaust mechanism (not shown) through the hollow parts of the supply chuck 2...the unloading chuck 3, and the exhaust mechanism reduces the pressure inside the hollow part. The wafer 6 is fixed therein.
A wafer sensor 8 and a wafer stopper 9 are provided near the suction section 7, respectively. The wafer stopper 9 is adapted to move up and down along the up-and-down movement direction of the supply chuck 2 . . . and the unloading chuck 3 . In the vicinity of the wafer supply/unloading section 1, there is a carrier elevator 1 in which wafers 6 to be processed are stored.
0 and a carrier elevator 11 in which processed wafers 6 are stored are provided so as to be movable up and down. A conveyor belt 12 is interposed between these carrier elevators 10, 11 and the supply chuck 2 and the unloading chuck 3. The carrier elevators 10 and 11 are designed to move up and down in synchronization with the up-and-down movement of the supply chuck 2 . . . , the unloading chuck 3 . A vacuum head 13 is provided above and facing the supply chuck 2 and the discharge chuck 3. Vacuum head 13 is attached to support arm 14. Support arm 14
A drive motor 23 moves over a head guide 16 installed above between the wafer supply/unloading section 1 and a heater block 15 that goes in and out of the CVD apparatus main body (not shown).
It is designed to move back and forth. An elevating cylinder 17 is attached to the support arm 14 to move the vacuum head 13 up and down between the head guide 16 and the heater block 15. As shown in FIG. 3, a mortar-shaped accommodating portion 18 is formed at the tip of the vacuum head 13 so as to hold the wafer 6 in a horizontal state. Vacuum head 1
3 communicates with an exhaust mechanism (not shown) through a hollow part 19 opened in the accommodation part 18, and the wafer 6 is held by reducing the pressure inside the accommodation part 18 by the exhaust mechanism. It's summery. Further, the vacuum head 13 includes a spring 21 for alleviating the impact when the wafer 6 comes into contact with the heater plate 20 surface on the heater block 15, and a spring 21 for relieving the impact when the wafer 6 contacts the heater plate 20 surface at an arbitrary angle.
A spherical bearing 22 is built in so that the two are in close contact with each other. The heater block 15 also includes a rotary encoder 24 that calculates the moving amount of the heater plate 20 per pulse and the moving speed of the heater plate 20 expressed in the number of pulses per unit time.
is installed. A rotary encoder 25 is attached to the support arm 14 to similarly calculate the amount and speed of movement of the vacuum head 13.
而して、このように構成されたCVD装置用ウ
エハセツター３０によれば、次のようにしてウエ
ハ６をヒータブロツク１５に設置し、処理後のウ
エハ６をヒータブロツク１５から回収することが
できる。 According to the wafer setter 30 for a CVD apparatus configured as described above, the wafer 6 can be placed on the heater block 15 in the following manner, and the wafer 6 can be recovered from the heater block 15 after being processed.
ウエハ６を設置する場合には、先ずキヤリアエ
レベータ１０が降下し、搬出されるウエハ６が所
定位置に来たところで降下を止め、搬送ベルト１
２によつて供給用チヤツク２……の吸着部７に搬
出される。これと同期してウエハストツパ９が上
昇する。ウエハ６は、ウエハストツパ９に当接し
て吸着部７の所定位置に載置されると共に、ウエ
ハセンサ８の上方を通過した際に所定の信号をキ
ヤリアエレベータ１０の駆動機構に供給する。駆
動機構は、この信号を受けて再び次のウエハ６が
所定位置に現われるまで降下し、同様の操作によ
り次の供給用チヤツク２……にウエハ６を搬出す
る。全ての供給用チヤツク２……上にウエハ６が
載置されると、ウエハセンサ８の信号を受けて排
気機構は吸着部７を所定の減圧状態にする。その
結果、ウエハ６は吸着部７に吸着して固定され
る。次いで、昇降シリンダ４が駆動して供給用チ
ヤツク２……を、バキユームヘツド１３の収容部
１８にウエハ６が達するまで上昇させる。収容部
にウエハ６が収容されると排気機構によつてバキ
ユームヘツド１３の収容部１８内が所定の減圧状
態に設定されると共に、供給用チヤツク２……内
の減圧状態が解除され、ウエハ６は収容部１８内
に固定される。次いで、駆動モータ２３を駆動し
てバキユームヘツド１３をヘツドガイド１６に沿
つてヒータブロツク１５の上方まで移動させる。
バキユームヘツド１３がヒータブロツク１５の所
定位置の上方に設定されたところで昇降シリンダ
１７によりバキユームヘツド１３を降下し、ヒー
タプレート２０上にウエハ６を当接させ、収容部
１８内の減圧状態を解除してウエハ６を載置す
る。然る後、バキユームヘツド１３をヘツドガイ
ド１６に戻し、駆動モータ２３を逆回転させてウ
エハ供給搬出部１上にまで戻す。同様の操作を繰
り返すことによつてヒータプレート２０上に所定
枚数のウエハ６を載置する。 When installing the wafer 6, the carrier elevator 10 first descends, stops descending when the wafer 6 to be unloaded reaches a predetermined position, and then the transport belt 1
2 to the suction section 7 of the supply chuck 2 . In synchronization with this, the wafer stopper 9 is raised. The wafer 6 is placed in a predetermined position on the adsorption section 7 in contact with the wafer stopper 9, and also supplies a predetermined signal to the drive mechanism of the carrier elevator 10 when passing above the wafer sensor 8. Upon receiving this signal, the drive mechanism descends again until the next wafer 6 appears at a predetermined position, and carries out the wafer 6 to the next supply chuck 2 by the same operation. When the wafers 6 are placed on all the supply chucks 2, the exhaust mechanism receives a signal from the wafer sensor 8 and brings the suction section 7 into a predetermined reduced pressure state. As a result, the wafer 6 is attracted and fixed to the attraction section 7. Next, the elevating cylinder 4 is driven to raise the supply chuck 2 until the wafer 6 reaches the storage section 18 of the vacuum head 13. When the wafer 6 is accommodated in the accommodating section, the inside of the accommodating section 18 of the vacuum head 13 is set to a predetermined reduced pressure state by the exhaust mechanism, and the reduced pressure state in the supply chuck 2 is released, and the wafer 6 is released. It is fixed within the housing section 18. Next, the drive motor 23 is driven to move the vacuum head 13 along the head guide 16 to above the heater block 15.
When the vacuum head 13 is set above the predetermined position of the heater block 15, the vacuum head 13 is lowered by the elevating cylinder 17, the wafer 6 is brought into contact with the heater plate 20, and the reduced pressure state in the housing section 18 is released to remove the wafer. Place 6. Thereafter, the vacuum head 13 is returned to the head guide 16, and the drive motor 23 is reversely rotated to return it to the top of the wafer supply/unloading section 1. By repeating similar operations, a predetermined number of wafers 6 are placed on the heater plate 20.
このようにして多枚数のウエハ６が載置された
ヒータブロツク１５はCVD装置内に挿入され、
ウエハ６の表面に所定のCVD膜が形成される。 The heater block 15 on which a large number of wafers 6 are placed in this manner is inserted into the CVD apparatus, and
A predetermined CVD film is formed on the surface of the wafer 6.
次に、CVD装置から引き出されたヒータブロ
ツク１５上の処理後のウエハ６を回収する操作に
ついて説明する。まず、駆動モータ２３によつて
ヘツドガイド１６に沿つてバキユームヘツド１３
が処理後のウエハ６の上方まで移動する。次い
で、昇降シリンダ１７によつてヘツドガイド１６
が降下し、ウエハ６が収容部１８内に収容された
ところで降下を停止する。次いで、排気機構によ
つて収容部１８内が減圧状態に設定され、ウエハ
６が収容部１８に固定される。次に、収容部１８
にウエハ６を固定した状態でバキユームヘツド１
３がヘツドガイド１６まで上昇し、駆動モータ２
３の逆回転によつてウエハ供給搬出部１の搬出用
チヤツク３……の上方まで戻る。このバキユーム
ヘツド１３に保持されたウエハ６に吸着部７が当
接するまで昇降シリンダ４によつて搬出用チヤツ
ク３……が上昇する。次いで、バキユームヘツド
１３の減圧状態が解除されると共に、搬出用チヤ
ツク３の方が減圧状態に設定され、ウエハ６は、
バキユームヘツド１３から搬出用チヤツク３に移
される。次に、搬出用チヤツク３……が降下し、
所定位置に達したところで搬送ベルト１２が駆動
すると共に、搬出用チヤツク３……内の減圧状態
が解除されてウエハ６は搬送ベルト１２によりキ
ヤリアエレベータ１１に搬出される。 Next, the operation of recovering the processed wafer 6 on the heater block 15 pulled out from the CVD apparatus will be explained. First, the vacuum head 13 is moved along the head guide 16 by the drive motor 23.
moves above the processed wafer 6. Next, the head guide 16 is moved by the lifting cylinder 17.
is lowered, and the lowering is stopped when the wafer 6 is housed in the housing section 18. Next, the inside of the storage section 18 is set to a reduced pressure state by the exhaust mechanism, and the wafer 6 is fixed in the storage section 18 . Next, the housing section 18
With the wafer 6 fixed on the vacuum head 1
3 rises to the head guide 16, and the drive motor 2
3 returns to above the unloading chuck 3 of the wafer supplying and unloading section 1. The unloading chuck 3 is raised by the elevating cylinder 4 until the suction portion 7 comes into contact with the wafer 6 held by the vacuum head 13. Next, the reduced pressure state of the vacuum head 13 is released, and the unloading chuck 3 is set to a reduced pressure state, and the wafer 6 is
It is transferred from the vacuum head 13 to the unloading chuck 3. Next, the unloading chuck 3... is lowered,
When the wafer 6 reaches a predetermined position, the conveyor belt 12 is driven, the reduced pressure inside the unloading chuck 3 is released, and the wafer 6 is conveyed to the carrier elevator 11 by the conveyor belt 12.
なお、バキユームヘツド１３及び供給用チヤツ
ク２……、搬出用チヤツク３……の動作は、ロー
タリーエンコーダ２４，２５の指令によつて行わ
れ、各々同期をとりながら例えばバキユームヘツ
ド１３の昇降動作と両チヤツク２，３……の動作
は同時にも行われることは勿論である。 The vacuum head 13, the supply chuck 2, the unloading chuck 3, etc. are operated in accordance with the commands from the rotary encoders 24, 25. For example, the vacuum head 13 is raised and lowered and both chucks 2 are operated in synchronization with each other. , 3... are of course performed at the same time.
このようにこのCVD装置用ウエハセツター３
０は、次の効果を有する。 In this way, this wafer setter 3 for CVD equipment
0 has the following effect.
バキユームヘツド１３の移動量等をロータリ
ーエンコーダ２４，２５の指分によつてパルス
信号として制御できるので、ウエハ６の移動量
を正確に設定して作業性を向上できる。 Since the amount of movement of the vacuum head 13 and the like can be controlled as pulse signals by the indications of the rotary encoders 24 and 25, the amount of movement of the wafer 6 can be set accurately and work efficiency can be improved.
このロータリーエンコーダ２４，２５と小型
コンピユータとの併用により、バキユームヘツ
ド１３及び供給用チヤツク２……、搬出用チヤ
ツク３……の操作を正確に同期して行うことが
できる。 By using the rotary encoders 24, 25 together with a small computer, the vacuum head 13, the supply chuck 2, the unloading chuck 3, etc. can be operated in accurate synchronization.
バキユームヘツド１３及び供給用チヤツク２
……、搬出用チヤツク３……は、ウエハ６の表
面を局所的に直接把持しないので、処理前後の
ウエハ６の表面に損傷が発生するのを防止でき
る。 Vacuum head 13 and supply chuck 2
Since the unloading chuck 3 does not locally directly grip the surface of the wafer 6, it is possible to prevent damage to the surface of the wafer 6 before and after processing.
ウエハ６の処理前後の搬送操作を全て自動化
して作業性を向上できる。 All the transport operations before and after processing the wafer 6 can be automated to improve work efficiency.
ウエハ供給搬出部１に設けたウエハストツパ
９によりウエハ６の位置決めを高精度で行い作
業性を向上できる。 The wafer stopper 9 provided in the wafer supply/unloading section 1 allows the wafer 6 to be positioned with high precision, thereby improving work efficiency.
バキユームヘツド１３内に内蔵されたばね２
１により、ウエハ６とヒータプレート２０との
接触強さを小さくすると共に、球面軸受２２に
よりウエハ６を任意の傾斜角のヒータプレート
２０面に倣つて密着させることができるので、
ウエハ６をヒータプレート２０に着脱する際に
損傷が生じるのを防止できる。 Spring 2 built into vacuum head 13
1, the contact strength between the wafer 6 and the heater plate 20 can be reduced, and the spherical bearing 22 can bring the wafer 6 into close contact with the surface of the heater plate 20 having an arbitrary inclination angle.
Damage to the wafer 6 when it is attached to and removed from the heater plate 20 can be prevented.
本発明に係るCVD装置用ウエハセツターによ
れば、薄膜形成処理の前後でウエハの表面に損傷
が発生するのを防止し、かつ、ウエハの移送操作
を自動化して作業性を著しく向上させることがで
きる等顕著な効果を奏するものである。
According to the wafer setter for CVD equipment according to the present invention, it is possible to prevent damage to the wafer surface before and after the thin film forming process, and to automate the wafer transfer operation, thereby significantly improving work efficiency. It has a remarkable effect.
第１図は、本発明の一実施例の正面図、第２図
は、同実施例の側面図、第３図は、同実施例のバ
キユームヘツドの断面図である。
１……ウエハ供給搬出部、２……供給用チヤツ
ク、３……搬出用チヤツク、４……昇降シリン
ダ、５……基台、６……ウエハ、７……吸着部、
８……ウエハセンサ、９……ウエハストツパ、１
０，１１……キヤリアエレベータ、１２……搬送
ヘツド、１３……バキユームヘツド、１４……支
持アーム、１５……ヒータブロツク、１６……ヘ
ツドガイド、１７……昇降シリンダ、１８……収
容部、１９……中空部、２０……ヒータプレー
ト、２１……ばね、２２……球面軸受、２３……
駆動モータ、２４，２５……ロータリーエンコー
ダ、３０……CVD装置用ウエハセツター。
FIG. 1 is a front view of one embodiment of the present invention, FIG. 2 is a side view of the same embodiment, and FIG. 3 is a sectional view of the vacuum head of the same embodiment. DESCRIPTION OF SYMBOLS 1... Wafer supply/unloading part, 2... Supply chuck, 3... Unloading chuck, 4... Lifting cylinder, 5... Base, 6... Wafer, 7... Adsorption unit,
8...Wafer sensor, 9...Wafer stopper, 1
0, 11...Carrier elevator, 12...Transportation head, 13...Vacuum head, 14...Support arm, 15...Heater block, 16...Head guide, 17...Elevating cylinder, 18...Accommodating section, 19 ... Hollow part, 20 ... Heater plate, 21 ... Spring, 22 ... Spherical bearing, 23 ...
Drive motor, 24, 25... rotary encoder, 30 ... wafer setter for CVD equipment.
Claims (1)
らウエハ供給搬出部の上方に架設されたヘツドガ
イドと、該ヘツドガイドに移動自在に取付けられ
たバキユームヘツドと、該バキユームヘツドを前
記ヘツドガイドと前記ヒータブロツク間で昇降せ
しめる昇降機構と、該バキユームヘツドに前記ウ
エハを水平状態で収容するように形成されたすり
鉢状の収容部と、前記ウエハ供給搬出部に該収容
部と対向して昇降自在に設けられた供給用チヤツ
ク及び該供給用チヤツクより前記ヒータブロツク
に近接して設けられた搬出用チヤツクと、該供給
用チヤツク及び該搬出用チヤツクに前記ウエハを
水平状態で固定するように形成された吸着部と、
該供給用チヤツクに前記ウエハを供給し、かつ、
該搬出用チヤツクから前記ウエハを搬出するウエ
ハ移送手段とを具備することを特徴とするCVD
装置用ウエハセツター。1. A head guide installed from above the heater block on which the wafer is placed to above the wafer supply/unloading section, a vacuum head movably attached to the head guide, and a vacuum head installed between the head guide and the heater block. a lifting mechanism for raising and lowering the wafer; a mortar-shaped storage section formed in the vacuum head to store the wafer in a horizontal state; and a supply provided in the wafer supply/unloading section so as to be movable up and down, facing the storage section. an unloading chuck and an unloading chuck provided closer to the heater block than the supply chuck, and a suction portion formed to horizontally fix the wafer to the supply chuck and the unloading chuck;
supplying the wafer to the supply chuck, and
A CVD characterized by comprising a wafer transfer means for carrying out the wafer from the carrying chuck.
Wafer setter for equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2851982A JPS58147039A (en) | 1982-02-24 | 1982-02-24 | Wafer setter for cvd apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2851982A JPS58147039A (en) | 1982-02-24 | 1982-02-24 | Wafer setter for cvd apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58147039A JPS58147039A (en) | 1983-09-01 |
| JPS6262463B2 true JPS6262463B2 (en) | 1987-12-26 |
Family
ID=12250924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2851982A Granted JPS58147039A (en) | 1982-02-24 | 1982-02-24 | Wafer setter for cvd apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58147039A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57211746A (en) * | 1981-06-23 | 1982-12-25 | Fujitsu Ltd | Wafer conveying apparatus |
-
1982
- 1982-02-24 JP JP2851982A patent/JPS58147039A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57211746A (en) * | 1981-06-23 | 1982-12-25 | Fujitsu Ltd | Wafer conveying apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58147039A (en) | 1983-09-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101265859B1 (en) | System for cutting plate glass | |
| JPH0964148A (en) | Feeding-return device for wafer ring | |
| JP3198401B2 (en) | Wafer ring supply / return device | |
| CN112456140A (en) | Automatic feeding system for aluminum inflation soaking plate | |
| KR20210033887A (en) | Machining apparatus | |
| JPS6262463B2 (en) | ||
| CN214269317U (en) | Automatic feeding system for aluminum inflation soaking plate | |
| KR100268599B1 (en) | Transport robot for a machining or processing line for lead frames | |
| CN112045475B (en) | Machining system and machining method for manufacturing automobile parts | |
| JPS59156666A (en) | Automatic work loading mechanism in surface grinder | |
| TW202226445A (en) | Tape mounter | |
| JPH0755701B2 (en) | Device for taking out containers in boxes | |
| KR102548018B1 (en) | Feeding apparatus and feeding method | |
| CN220155512U (en) | Wafer feeding mechanism | |
| JP3800562B2 (en) | Workpiece unloading apparatus and work unloading method for plate material processing machine | |
| CN217334020U (en) | Feeding mechanism for semiconductor device processing equipment | |
| CN216582923U (en) | Tray dish unloader | |
| CN111203745B (en) | Feeding structure and feeding and discharging device | |
| JPH0624182B2 (en) | Substrate exchange device | |
| JP2952566B2 (en) | Work cleaning device | |
| JPS60154841A (en) | Transfer device in press machine | |
| JP2875653B2 (en) | Transport equipment for semiconductor devices | |
| JPS62141731A (en) | Wafer handling apparatus | |
| KR19980039723A (en) | Station of Wafer Mounting System for Semiconductor Package | |
| CN117262728A (en) | Conveying device and position information storage method |