JPS6260814B2 - - Google Patents

Info

Publication number
JPS6260814B2
JPS6260814B2 JP57218351A JP21835182A JPS6260814B2 JP S6260814 B2 JPS6260814 B2 JP S6260814B2 JP 57218351 A JP57218351 A JP 57218351A JP 21835182 A JP21835182 A JP 21835182A JP S6260814 B2 JPS6260814 B2 JP S6260814B2
Authority
JP
Japan
Prior art keywords
heat transfer
intermediate heat
electronic device
fluid
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57218351A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59110144A (ja
Inventor
Motohiro Sato
Toshihiro Yamada
Asao Nishimura
Takahiro Ooguro
Noryuki Ashiwake
Keizo Kawamura
Fumyuki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57218351A priority Critical patent/JPS59110144A/ja
Publication of JPS59110144A publication Critical patent/JPS59110144A/ja
Publication of JPS6260814B2 publication Critical patent/JPS6260814B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/774—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57218351A 1982-12-15 1982-12-15 電子装置の冷却装置 Granted JPS59110144A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57218351A JPS59110144A (ja) 1982-12-15 1982-12-15 電子装置の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57218351A JPS59110144A (ja) 1982-12-15 1982-12-15 電子装置の冷却装置

Publications (2)

Publication Number Publication Date
JPS59110144A JPS59110144A (ja) 1984-06-26
JPS6260814B2 true JPS6260814B2 (member.php) 1987-12-18

Family

ID=16718510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57218351A Granted JPS59110144A (ja) 1982-12-15 1982-12-15 電子装置の冷却装置

Country Status (1)

Country Link
JP (1) JPS59110144A (member.php)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5177906B2 (ja) * 2010-01-28 2013-04-10 Ｎｅｃアクセステクニカ株式会社 電気機器のヒートシンク機構
CN117156790A (zh) * 2022-05-24 2023-12-01 华为技术有限公司 一种发热模块、散热装置和通信设备

Also Published As

Publication number Publication date
JPS59110144A (ja) 1984-06-26

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