JPS6259929B2 - - Google Patents

Info

Publication number
JPS6259929B2
JPS6259929B2 JP54007868A JP786879A JPS6259929B2 JP S6259929 B2 JPS6259929 B2 JP S6259929B2 JP 54007868 A JP54007868 A JP 54007868A JP 786879 A JP786879 A JP 786879A JP S6259929 B2 JPS6259929 B2 JP S6259929B2
Authority
JP
Japan
Prior art keywords
piezoelectric element
electrode
circuit board
piezoelectric
case body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54007868A
Other languages
Japanese (ja)
Other versions
JPS55100719A (en
Inventor
Jiro Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NOTO DENSHI KOGYO KK
Original Assignee
NOTO DENSHI KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NOTO DENSHI KOGYO KK filed Critical NOTO DENSHI KOGYO KK
Priority to JP786879A priority Critical patent/JPS55100719A/en
Publication of JPS55100719A publication Critical patent/JPS55100719A/en
Publication of JPS6259929B2 publication Critical patent/JPS6259929B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/0504Holders; Supports for bulk acoustic wave devices
    • H03H9/0514Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

【発明の詳細な説明】 本発明は圧電共振子や圧電波器等に使用され
る圧電素子の支持構造に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a support structure for a piezoelectric element used in a piezoelectric resonator, a piezoelectric wave device, etc.

従来、この種の圧電素子の支持構造としては、
実公昭44−24888号公報(考案の名称「小型磁器
濾波器」)、特開昭52−110547号公報(発明の名称
「小型磁器濾波器」)、実公昭41−24095号公報(考
案の名称「圧電型波器支持体」)、あるいは実公
昭43−24122号公報(考案の名称「圧電共振子の
支持装置」)等において種々のものが提案されて
いる。
Conventionally, the support structure for this type of piezoelectric element is as follows:
Publication of Utility Model Publication No. 44-24888 (name of the invention: ``Small porcelain filter''), Japanese Patent Application Laid-open No. 110547 (Sho 52-110547) (title of invention: ``Small porcelain filter''), Publication of Utility Model Publication No. 41-24095 (name of the invention: ``Small porcelain filter'') Various types have been proposed in Japanese Utility Model Publication No. 43-24122 (named "Piezoelectric Resonator Support Device") and others.

これら公報に開示されているものは、いずれも
燐青鋼等の弾性を有する金属板からなる端子板に
舌片や突起を設け、これら舌片や突起のバネ力に
よつて、上記端子板の間に圧電素子を支持するよ
うにした構造を有している。
In all of the devices disclosed in these publications, tongues or protrusions are provided on a terminal plate made of an elastic metal plate such as phosphorescent steel, and the spring force of these tongues or protrusions creates a space between the terminal plates. It has a structure that supports a piezoelectric element.

例えば、上記実公昭44―24888号公報において
提案されている「小型磁器濾波器」においては、
第1図aおよびbに示す如き電極分割型3端子磁
器圧電素子1の分割電極側には、第2図に示すよ
うに、中央部に舌片6を有する入力端子用金属板
5および両脇に舌片9を設けたU字状の出力端子
用金属板8を、中央部を切除した絶縁板7を介し
て積み重ねて、舌片6と入力電極2(第1図a参
照)、舌片9と出力電極3とをそれぞれ当接さ
せ、全面電極4側は中央部に舌片11を有する共
通端子用金属板10を配し舌片11と全面電極4
とを当接させて、磁器圧電素子1を保持するよう
に内ケース14、外ケース13内に収容してな
り、かつ各金属板の磁器圧電素子1に対する圧力
バランスをとるように選んだ構造を有している。
For example, in the "small porcelain filter" proposed in the above-mentioned Japanese Utility Model Publication No. 44-24888,
As shown in FIG. 2, on the split electrode side of the split electrode type three-terminal porcelain piezoelectric element 1 as shown in FIGS. A U-shaped output terminal metal plate 8 with a tongue piece 9 provided thereon is stacked with an insulating plate 7 whose center portion is cut out interposed therebetween, and the tongue piece 6, the input electrode 2 (see FIG. 1a), and the tongue piece are stacked together. 9 and the output electrode 3 respectively, and on the whole surface electrode 4 side, a common terminal metal plate 10 having a tongue piece 11 in the center is arranged, and the tongue piece 11 and the whole surface electrode 4
The inner case 14 and the outer case 13 hold the porcelain piezoelectric element 1 in contact with each other, and the structure is selected to balance the pressure of each metal plate against the porcelain piezoelectric element 1. have.

しかしながら、圧電素子の支持構造を上記の如
き構造とした場合、燐青銅等の高価な材料からな
る端子板が必要となる一方、端子板に設けた舌片
や突起のバネ力が一定の範囲の値となるように規
制するのは困難で、圧電素子によつて特性にバラ
ツキが生ずる欠点があつた。
However, when the support structure of the piezoelectric element is constructed as described above, a terminal board made of an expensive material such as phosphor bronze is required, and the spring force of the tongue piece or protrusion provided on the terminal board is limited within a certain range. It is difficult to regulate the value so that the piezoelectric element has a certain value, and there is a drawback that the characteristics vary depending on the piezoelectric element.

また、圧電素子の電極にリード線を直接半田付
するタイプのものも提案されているが、上記リー
ド線が寄生振動を起す欠点があつた。
A type in which lead wires are directly soldered to the electrodes of the piezoelectric element has also been proposed, but this has the disadvantage that the lead wires cause parasitic vibration.

本発明は従来の圧電素子の支持構造における上
記欠点を解消すべくなされたものであつて、圧電
素子を収容する内部空間の内壁の少くとも一部に
外部に達する導電部に突起状接点を設けたケース
本体と、他の電気部品に至る電極膜を有するとと
もに上記圧電素子を間にしてケース本体を固定し
得るようにした回路基板とを設ける一方、該回路
基板と圧電素子との間に導電性弾性材料(金属バ
ネ材をのぞく)よりなる接触部材を介装し、その
弾性によつて上記圧電素子を接触部材と上記突起
状接点との間に狭持することにより、接触部材の
弾性のバラツキが小さいことを利用して特性のバ
ラツキを少くする一方、圧電素子を回路基板に直
接取り付けて、部品点数と組立工数の削減を図る
ようにした圧電素子の支持構造を提供することを
目的としている。
The present invention has been made in order to eliminate the above-mentioned drawbacks in the conventional support structure for a piezoelectric element, and is to provide a protruding contact point on a conductive portion reaching the outside on at least a part of the inner wall of an internal space that accommodates a piezoelectric element. A circuit board having an electrode film extending to other electrical parts and capable of fixing the case body with the piezoelectric element in between is provided. By interposing a contact member made of a resilient elastic material (excluding metal spring material) and using its elasticity to sandwich the piezoelectric element between the contact member and the protruding contact, the elasticity of the contact member can be reduced. The purpose of the present invention is to provide a support structure for a piezoelectric element that takes advantage of the small variation to reduce the variation in characteristics, while also attaching the piezoelectric element directly to a circuit board to reduce the number of parts and assembly man-hours. There is.

以下、本発明を圧電波器に適用した場合の実
施例について説明する。
Hereinafter, an embodiment in which the present invention is applied to a piezoelectric wave device will be described.

第3図および第4図において、21は四角形状
に焼成加工したチタン酸ジルコン酸鉛等の圧電磁
器板22の輪郭振動を利用した、第1図に示すも
のと全く同一の構成を有する、電極分割型3端子
磁器圧電素子である。該電極分割型3端子磁器圧
電素子21の上記圧電磁器板22の一方の面の周
縁部には一定巾を有するリング電極23を形成す
るとともに、該リング電極23と同心に四角形状
のドツト電極24を形成し、これらリング電極2
3とドツト電極24とがギヤツプgによつて分割
されるようにする一方、上記圧電磁器板22の他
方の面全体には、全面電極25を形成している。
3 and 4, reference numeral 21 denotes an electrode having exactly the same configuration as that shown in FIG. 1, which utilizes contour vibration of a piezoelectric ceramic plate 22 made of lead zirconate titanate or the like fired into a rectangular shape. This is a split type three-terminal porcelain piezoelectric element. A ring electrode 23 having a constant width is formed on the peripheral edge of one surface of the piezoelectric ceramic plate 22 of the electrode split type three-terminal porcelain piezoelectric element 21, and a square dot electrode 24 is formed concentrically with the ring electrode 23. These ring electrodes 2
3 and the dot electrode 24 are separated by a gap g, while an entire surface electrode 25 is formed on the entire other surface of the piezoelectric ceramic plate 22.

一方、26は上記電極分割型3端子磁器圧電素
子21を収容するケース本体であつて、該ケース
本体26は肉厚の薄い真鍮等の金属板を、四角形
状の部分の各辺の中央部から小さいカシメ爪2
7,…,27が夫々突出する形状に打ち抜いた
後、プレス加工によつて、内部に上記電極分割型
3端子磁器圧電素子21を収容する内部空間28
を形成するように、上記の四角形状の部分を四角
錐台状に絞り加工している。
On the other hand, 26 is a case body that accommodates the electrode split type three-terminal porcelain piezoelectric element 21, and the case body 26 is a case body in which a thin metal plate such as brass is inserted from the center of each side of a rectangular portion. small caulking nail 2
7,..., 27 are punched out into a protruding shape, and then press work is performed to form an internal space 28 in which the electrode split type three-terminal porcelain piezoelectric element 21 is accommodated.
The above-mentioned square-shaped part is drawn into a truncated quadrangular pyramid shape so as to form.

ケース本体26の底部29には、上記のプレス
加工時に、該底部29の中心部を内部空間28側
に、半球状に押し出して突起状接点30を形成し
ている。
A protruding contact 30 is formed on the bottom 29 of the case body 26 by extruding the center of the bottom 29 toward the internal space 28 in a hemispherical shape during the above-described press working.

31は電極分割型3端子磁器圧電素子21を間
にして上記ケース本体26を取り付けることによ
り、トランジスタ、コンデンサ(いずれも図示せ
ず。)等の他の電気部品とともに上記電極分割型
3端子磁器圧電素子21を組み込むプリント基板
等の回路基板である。
Reference numeral 31 designates the split electrode type three-terminal porcelain piezoelectric element 21 as shown in FIG. This is a circuit board such as a printed circuit board into which the element 21 is incorporated.

上記回路基板31はいわゆる両面プリント基板
であつて、次に述べるゴム接点32,33および
34を夫々取り付けるための3個の丸孔35,3
6および37を設けるとともに、ケース本体26
のカシメ爪27,…,27を嵌入する4個の角孔
38,39,40および41を設けている。
The circuit board 31 is a so-called double-sided printed circuit board, and has three round holes 35, 3 for attaching rubber contacts 32, 33, and 34, which will be described next.
6 and 37, and the case body 26
Four square holes 38, 39, 40 and 41 are provided into which the caulking claws 27, . . . , 27 are inserted.

また、上記回路基板31の上面には、3個の上
記丸孔35,36および37のうち、2個の丸孔
35および36から他の電気部品に至る電極膜4
2、残りの丸孔37から他の電気部品に至る電極
膜43を形成する。回路基板31の下面には、4
個の角孔38,39,40および41のうち、角
孔38から他の電気部品に至る電極膜44を形成
する。上記電極42および43の引き出し部の上
には、レジストインク等(図示せず)によつて、
絶縁膜を形成して、後述するように、回路基板3
1にケース本体26を取り付けたときに、電極膜
42もしくは43とケース本体26とが導通する
のを防止している。もちろん、ケース本体26が
電極膜42や43に接触しないようケース本体の
該当個所に切欠きを設けてもよい。
Further, on the upper surface of the circuit board 31, there are electrode films 4 extending from two of the three round holes 35, 36 and 37 to other electrical components.
2. Form an electrode film 43 extending from the remaining round hole 37 to other electrical components. On the bottom surface of the circuit board 31, there are 4
Of the square holes 38, 39, 40, and 41, an electrode film 44 extending from the square hole 38 to other electrical components is formed. On the lead-out portions of the electrodes 42 and 43, resist ink or the like (not shown) is applied.
After forming an insulating film, as described later, the circuit board 3
When the case body 26 is attached to the case body 1, electrical conduction between the electrode film 42 or 43 and the case body 26 is prevented. Of course, a notch may be provided at a corresponding location in the case body so that the case body 26 does not come into contact with the electrode films 42 and 43.

次に、ゴム接点32,33および34は、一例
として等方導電性ゴムを小さなビス状に成型する
ようにしたのであつて、これらゴム接点32,3
3および34は、ビスの頭部に相当する部分を接
点部とするとともに、ネジ部に相当する部分を上
記丸孔35,36および37への嵌入部とするよ
うにしている。なお、ゴム接点32,33および
34は等方導電性ゴムに限らず、感圧導電性や異
方導電性ゴムであつてもよい。
Next, the rubber contacts 32, 33, and 34 are made by molding isotropically conductive rubber into a small screw shape, as an example.
3 and 34, the portion corresponding to the head of the screw is used as a contact portion, and the portion corresponding to the screw portion is used as a fitting portion into the round holes 35, 36, and 37. Note that the rubber contacts 32, 33, and 34 are not limited to isotropically conductive rubber, but may be pressure-sensitive conductive or anisotropically conductive rubber.

本実施例における圧電波器は以上の構成を有
する各部品からなつているが、回路基板31の丸
孔35,36および37にゴム接点32,33お
よび34の上記嵌入部を夫々嵌入して、これらゴ
ム接点32,33および34を上記回路基板31
に取り付けた後、電極分割型3端子磁器素子21
をリング電極23およびドツト電極24側から上
記回路基板31に重ね合せ、その上からケース本
体26を被せ、ケース本体26の外側にシリコン
ゴム(図示せず。)等をコーテイングして内部を
シールしている。
The piezoelectric wave device in this embodiment is made up of the components having the above-mentioned configuration. These rubber contacts 32, 33 and 34 are connected to the circuit board 31.
After installing the electrode split type three-terminal ceramic element 21
are stacked on the circuit board 31 from the ring electrode 23 and dot electrode 24 sides, the case body 26 is placed over it, and the outside of the case body 26 is coated with silicone rubber (not shown) or the like to seal the inside. ing.

しかる後、電極分割型3端子磁器素子21が、
上記ゴム接点32,33および34の弾性によ
り、ケース本体26の突起状接点30に付勢され
る状態で、上記ケース本体26のカシメ爪27,
…,27を回路基板31の角孔38,39,40
および41に嵌入してその先端部を折り曲げ、角
孔38に嵌入されたカシメ爪27の先端部を半田
47によつて電極膜44に固着させ、残りのカシ
メ爪27は必要に応じ回路基板31の裏面に形成
した電極膜48,…,48に固着する。
After that, the electrode split type three-terminal ceramic element 21 is
Due to the elasticity of the rubber contacts 32, 33, and 34, the caulking claws 27,
..., 27 to the square holes 38, 39, 40 of the circuit board 31
and 41 and bend its tip, and the tip of the caulking pawl 27 fitted into the square hole 38 is fixed to the electrode film 44 with solder 47, and the remaining caulking pawl 27 is attached to the circuit board 31 as necessary. It is fixed to the electrode films 48, .

また、上記の3つのゴム接点32,33および
34のうち、2つのゴム接点32,33は電極分
割型3端子磁器素子21のリング電極24の一対
の対向辺の略中央部に、また、いま一つのゴム接
点34がドツト電極24の略中央部に夫々当接す
るように、回路基板31の丸孔35,36および
37を設け、上記リング電極23およびドツト電
極24が電極膜42および43に夫々導電するよ
うにしている。
Furthermore, among the three rubber contacts 32, 33 and 34 mentioned above, two rubber contacts 32, 33 are located approximately at the center of the pair of opposing sides of the ring electrode 24 of the split electrode type three-terminal ceramic element 21. Round holes 35, 36 and 37 are provided in the circuit board 31 so that one rubber contact 34 comes into contact with the approximate center of the dot electrode 24, respectively, and the ring electrode 23 and the dot electrode 24 are connected to the electrode films 42 and 43, respectively. It is made to conduct electricity.

圧電波器を上記構成とすれば、電極分割型3
端子磁器素子21は、ゴム接点32,33および
34を介して、回路基板31に直接、取り付ける
ことができるため、従来のように、電極分割型3
端子磁器圧電素子21を支持する特殊な端子板や
特別なケース等も省略することができるばかりで
なく、圧電波器の組立を回路基板に他の電気部
品を取り付ける工程で行うことができる。
If the piezoelectric wave device has the above configuration, electrode split type 3
Since the terminal ceramic element 21 can be directly attached to the circuit board 31 via the rubber contacts 32, 33 and 34, it is possible to attach the terminal ceramic element 21 directly to the circuit board 31 via the rubber contacts 32, 33 and 34.
Not only can a special terminal board and special case for supporting the terminal ceramic piezoelectric element 21 be omitted, but also the piezoelectric wave device can be assembled in the process of attaching other electrical components to the circuit board.

一方、電極分割型3端子磁器圧電素子21の支
持力を10グラムから200グラムまで変化させて、
第2図と第3図の圧電波器の各挿入損失を夫々
測定すると、第2図の圧電波器では、第5図に
おいて実線で示すように、上記の支持力の範囲に
おいて、挿入損失が大略2.6dBから3.2dBまで変
化するのに対し、第3図の圧電波器の挿入損失
は、第5図において点線で示すように、略一定の
値2.6dBとなり、支持力が変化しても挿入損失が
殆ど変化しないことが分る。
On the other hand, the supporting force of the electrode split type three-terminal porcelain piezoelectric element 21 was varied from 10 grams to 200 grams,
When the insertion losses of the piezoelectric wave devices shown in FIGS. 2 and 3 are measured, it is found that the piezoelectric wave device shown in FIG. In contrast, the insertion loss of the piezoelectric transducer shown in Figure 3 is approximately constant at 2.6 dB, as shown by the dotted line in Figure 5, even when the supporting force changes. It can be seen that the insertion loss hardly changes.

また、上記と同様に、電極分割型3端子磁器圧
電素子21の支持力を10グラムから200グラムま
で変化させて、圧電波器の中心周波数の変化を
測定すると、第2図の圧電波器では、第6図に
実線で示すように、略455.2KHzから455.9KHzま
で変化するのに対し、第3図の圧電波器では、
点線で示すように、略一定の値455.0KHzから殆
んど変化しないことが分る。
In addition, in the same way as above, when the supporting force of the electrode split type three-terminal porcelain piezoelectric element 21 is changed from 10 grams to 200 grams and the change in the center frequency of the piezoelectric wave device is measured, the piezoelectric wave device shown in FIG. , as shown by the solid line in Figure 6, changes from approximately 455.2KHz to 455.9KHz, whereas in the piezoelectric wave generator shown in Figure 3,
As shown by the dotted line, it can be seen that there is almost no change from the approximately constant value of 455.0 KHz.

なお、第2図に示したような従来例では、入力
端子用金属板5の舌片6を入力電極2の中央部
(振動の節部でもある)に当接させ、出力端子用
金属板8の舌片9を出力電極3の一対の対向辺の
中央部(振動の節部でもある)に当接させなけれ
ばならない。したがつて、舌片6、2つの舌片9
は、一直線上に並らぶことになり、圧電素子1は
これら舌片6,9でしか保持されていないため傾
いて不必要に出力端子用金属板8や共通端子用金
属板10に接触しいろいろ弊害がでるおそれがあ
り、これを防ぐための対策をこうじたりしなけれ
ばならない。しかしながら、ゴム接点35,3
6,37を用い、ゴム接点35,36を結ぶ線を
底辺とする二等辺三角形の頂点にゴム接点35,
36,37を配置するとバランスよく圧電素子1
が保持されることになり傾かない。したがつて傾
き防止のための対策をこうじなくてもよいし、特
性劣化もない。
In the conventional example shown in FIG. 2, the tongue piece 6 of the input terminal metal plate 5 is brought into contact with the central part (also the node of vibration) of the input electrode 2, and the output terminal metal plate 8 The tongue piece 9 must be brought into contact with the center portion of the pair of opposing sides of the output electrode 3 (which is also the node of vibration). Therefore, the tongue 6, the two tongues 9
are lined up in a straight line, and since the piezoelectric element 1 is held only by these tongues 6 and 9, it tilts and unnecessarily contacts the output terminal metal plate 8 and the common terminal metal plate 10, causing various problems. There is a risk that harmful effects may occur, and measures must be taken to prevent this. However, the rubber contacts 35,3
Using rubber contacts 35 and 37, attach the rubber contacts 35 and 37 to the vertices of an isosceles triangle whose base is the line connecting the rubber contacts 35 and 36.
Piezoelectric element 1 is well balanced when 36 and 37 are arranged.
will be held and will not tilt. Therefore, there is no need to take measures to prevent tilting, and there is no characteristic deterioration.

なお、上記第3図の実施例において、ゴム接点
32,33および34は、回路基板31に丸孔3
5,36および37を設けて上記回路基板31に
取り付けるようにする代りに、第7図に示すよう
に、回路基板31の電極膜42および43上に、
ケース本体26の開口端面よりもやや大きな形状
および寸法を有するシリコンゴム膜50を形成
し、該シリコンゴム膜50から突出させて、回路
基板31上に3つのゴム接点32,33および3
4を形成するようにしてもよい。
In the embodiment shown in FIG.
5, 36 and 37 to be attached to the circuit board 31, as shown in FIG.
A silicone rubber film 50 having a shape and dimensions slightly larger than the opening end surface of the case body 26 is formed, and three rubber contacts 32 , 33 and 3 are formed on the circuit board 31 by protruding from the silicone rubber film 50 .
4 may be formed.

このようにすれば、シリコンゴム膜50を回路
基板31上に形成すると同時にゴム接点32,3
3および34が上記回路基板31上に形成するこ
とができる一方、ケース本体26の開口周縁が上
記シリコンゴム膜50に圧接して内部がシールさ
れるため、ケース本体26のシール対策は不要と
なる。また、このようにすれば、第4図に示すよ
うな、レジストインクによる絶縁膜は不要とな
る。
By doing this, the silicone rubber film 50 can be formed on the circuit board 31 and the rubber contacts 32 and 3 can be formed at the same time.
3 and 34 can be formed on the circuit board 31, while the opening periphery of the case body 26 comes into pressure contact with the silicone rubber film 50 and the inside is sealed, so there is no need for sealing measures for the case body 26. . Further, in this case, an insulating film made of resist ink as shown in FIG. 4 becomes unnecessary.

なお、本発明を圧電共振子に適用するには、上
記実施例において、電極分割型3端子磁器圧電素
子21の代りに2端子磁器圧電素子(図示せ
ず。)を用い、該2端子磁器圧電素子を、ケース
本体26の突起状接点30の回路基板31に取り
付けられた1つのゴム接点(図示せず。)によつ
て支持する構成とすればよい。
In addition, in order to apply the present invention to a piezoelectric resonator, a two-terminal ceramic piezoelectric element (not shown) is used in place of the electrode split type three-terminal ceramic piezoelectric element 21 in the above embodiment, and the two-terminal ceramic piezoelectric The element may be supported by one rubber contact (not shown) attached to the circuit board 31 of the protruding contact 30 of the case body 26.

以上の説明において本発明の基本的な実施例に
ついて説明したが、本発明は上記実施例に限定さ
れるものではなく、例えば、電極分割型3端子磁
器圧電素子21や2端子磁器圧電素子は、第8図
aおよびbに示すような、円板状の圧電磁器板2
2の径方向振動を利用するものや、電極分割型3
端子磁器圧電素子21については、第8図cに示
すように、H字型に形成した圧電磁器の多重モー
ド振動を利用するものであつてもよい。
Although the basic embodiments of the present invention have been described above, the present invention is not limited to the above embodiments. For example, the electrode split type three-terminal porcelain piezoelectric element 21 or the two-terminal porcelain piezoelectric element A disk-shaped piezoelectric ceramic plate 2 as shown in FIGS. 8a and 8b.
2) that utilizes radial vibration, and electrode split type 3.
The terminal ceramic piezoelectric element 21 may be one that utilizes multi-mode vibration of a piezoelectric ceramic formed in an H shape, as shown in FIG. 8c.

一方、ゴム接点32,33および34等は、具
体的には図示しないが、一枚の異方導電性ゴムシ
ートにおきかえてもよく、また、ケース本体26
は絶縁樹脂に導電膜を形成したもの、あるいは、
絶縁樹脂に導電性フアイバーを混入したものであ
つてもよい。
On the other hand, although the rubber contacts 32, 33, 34, etc. are not specifically shown, they may be replaced with a single anisotropically conductive rubber sheet.
is a material in which a conductive film is formed on an insulating resin, or
It may also be made of insulating resin mixed with conductive fibers.

さらに、回路基板として、電極膜42,43も
電極膜44と同様に図からみて下面側に設け、各
孔35〜41にスルーホールメツキを施した、い
わゆる片面プリントのスルーホール基板を用いて
もよい。
Furthermore, as a circuit board, a so-called single-sided printed through-hole board may be used, in which the electrode films 42 and 43 are also provided on the lower surface side as seen from the figure, and the holes 35 to 41 are plated with through holes. good.

以上、詳細に説明したことからも明らかなよう
に、本発明は、回路基板上のたとえばゴム接点
等、金属バネを除く弾性材の弾性によつて圧電素
子をケース本体に設けた突起状接点と上記弾性材
との間に支持するようにしたから、圧電素子は弾
性材の安定した弾力によつて支持されるため、本
発明を適用した圧電波器や圧電共振器ではその
電気的特性のバラツキが非常に小さくなる一方、
弾性材を回路基板に取り付けて圧電素子を支持す
るようにしているため、回路基板上に直接、圧電
波器や圧電共振器を形成することができ、これ
ら圧電波器や圧電共振器の組立は回路基板への
他の電気部品の取付と同時に行うことができる。
また、本発明によれば、従来のように、圧電素子
を支持する高価な金属からなる端子板や特別な収
容ケース等も必要としないため、圧電波器や圧
電共振器の部品点数が少くなり、そのコストを大
巾に引き下げることができる。
As is clear from the above detailed explanation, the present invention is applicable to protruding contacts such as rubber contacts on a circuit board, in which a piezoelectric element is provided on a case body using the elasticity of an elastic material other than a metal spring. Since the piezoelectric element is supported between the elastic material and the elastic material, the piezoelectric element is supported by the stable elasticity of the elastic material. becomes very small, while
Since the elastic material is attached to the circuit board to support the piezoelectric element, piezoelectric wave devices and piezoelectric resonators can be formed directly on the circuit board, and the assembly of these piezoelectric wave devices and piezoelectric resonators is easy. This can be done simultaneously with the attachment of other electrical components to the circuit board.
Furthermore, according to the present invention, there is no need for a terminal plate made of expensive metal or a special housing case to support the piezoelectric element, as in the past, so the number of parts for the piezoelectric wave device or piezoelectric resonator is reduced. , the cost can be drastically reduced.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aおよびbは夫々電極分割型3端子磁器
圧電素子を一面側および他面側から見た場合の斜
視図、第2図は従来の圧電波器の分解斜視図、
第3図は本発明を適用した圧電波器の縦断面
図、第4図は第3図の分解斜視図、第5図は第2
図の圧電波器と第3図の圧電波器の支持力に
対する挿入損失特性図、第6図は第2図の圧電
波器と第3図の圧電波器の支持力に対する中心
周波数の変動特性図、第7図は第3図の実施例の
変形例の縦断面図、第8図a,bおよびcは夫々
各種の形状を有する圧電素子の斜視図である。 21…電極分割型3端子磁器圧電素子、22…
圧電磁器板、23…リング電極、24…ドツト電
極、25…全面電極、26…ケース本体、27…
カシメ爪、28…内部空間、30…突起状接点、
31…回路基板、32,33,34…ゴム接点、
42,43,44…電極膜。
Figures 1a and b are perspective views of a split-electrode type three-terminal porcelain piezoelectric element as seen from one side and the other side, respectively; Figure 2 is an exploded perspective view of a conventional piezoelectric wave device;
FIG. 3 is a vertical cross-sectional view of a piezoelectric wave device to which the present invention is applied, FIG. 4 is an exploded perspective view of FIG. 3, and FIG.
Figure 6 shows the insertion loss characteristics of the piezoelectric transducer shown in Fig. 2 and the piezoelectric transducer shown in Fig. 3 with respect to their supporting force, and Fig. 6 shows the center frequency fluctuation characteristics of the piezoelectric transducer shown in Fig. 7 are longitudinal sectional views of a modification of the embodiment shown in FIG. 3, and FIGS. 8a, b, and c are perspective views of piezoelectric elements having various shapes, respectively. 21... Electrode split type 3-terminal porcelain piezoelectric element, 22...
Piezoelectric ceramic plate, 23... Ring electrode, 24... Dot electrode, 25... Whole surface electrode, 26... Case body, 27...
Caulking claw, 28...Inner space, 30...Protruding contact,
31... Circuit board, 32, 33, 34... Rubber contact,
42, 43, 44...electrode film.

Claims (1)

【特許請求の範囲】[Claims] 1 圧電基板の表裏に少なくとも一つの電極を
夫々形成した圧電素子と、該圧電素子を収容する
内部空間を有するとともに少なくともその内壁の
一部に外部に達する導電部を有するケース本体
と、他の電気部品に至る電極膜を有するととも上
記圧電素子を間にしてケース本体を固定し得るよ
うにした回路基板を設け、ケース本体の上記導電
部の一部を突出させて形成した突起状接点を圧電
素子の表面側の電極に導電せしめる一方、上記回
路基板と圧電素子との間に非金属バネ導電性弾性
材料よりなる接触部材を介装し、圧電素子の裏面
側の電極と回路基板の上記電極とを互いに導電さ
せて圧電素子を上記他の部品とともに回路基板上
に直接取り付けたことを特徴とする圧電素子の支
持構造。
1. A piezoelectric element having at least one electrode formed on the front and back sides of a piezoelectric substrate, a case body having an internal space for accommodating the piezoelectric element and having a conductive part reaching the outside on at least a part of its inner wall, and other electrical A circuit board is provided which has an electrode film extending to the component and which can fix the case body with the piezoelectric element in between, and a protruding contact formed by protruding a part of the conductive part of the case body is connected to the piezoelectric element. While the electrode on the front side of the element conducts electricity, a contact member made of a non-metal spring conductive elastic material is interposed between the circuit board and the piezoelectric element, and the electrode on the back side of the piezoelectric element and the above electrode on the circuit board are interposed between the circuit board and the piezoelectric element. 1. A support structure for a piezoelectric element, characterized in that the piezoelectric element is directly mounted on a circuit board together with the other components mentioned above by making the elements conductive with each other.
JP786879A 1979-01-25 1979-01-25 Support structure of piezoelectric element Granted JPS55100719A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP786879A JPS55100719A (en) 1979-01-25 1979-01-25 Support structure of piezoelectric element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP786879A JPS55100719A (en) 1979-01-25 1979-01-25 Support structure of piezoelectric element

Publications (2)

Publication Number Publication Date
JPS55100719A JPS55100719A (en) 1980-07-31
JPS6259929B2 true JPS6259929B2 (en) 1987-12-14

Family

ID=11677609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP786879A Granted JPS55100719A (en) 1979-01-25 1979-01-25 Support structure of piezoelectric element

Country Status (1)

Country Link
JP (1) JPS55100719A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5830322U (en) * 1981-08-21 1983-02-28 株式会社精工舎 piezoelectric vibrator
JPH0611620Y2 (en) * 1984-10-29 1994-03-23 株式会社大真空 Crystal oscillator
JP3050382B2 (en) * 1988-05-18 2000-06-12 日本電波工業株式会社 Surface acoustic wave device
KR19990044074A (en) * 1995-08-25 1999-06-25 사또 아끼오 Piezoelectric vibrator parts, supporting structure of piezoelectric vibrator and installation method of piezoelectric vibrator
JPH1131856A (en) * 1997-07-10 1999-02-02 Mitsui Chem Inc Supproting structure of piezoelectric substrate for piezoelectric transformer, and the piezoelectric transformer provided with it
JP4848789B2 (en) * 2006-02-10 2011-12-28 大日本印刷株式会社 Manufacturing method of electronic device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49102667U (en) * 1972-12-25 1974-09-04

Also Published As

Publication number Publication date
JPS55100719A (en) 1980-07-31

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