CN210297663U - SMD quartz crystal resonator - Google Patents
SMD quartz crystal resonator Download PDFInfo
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- CN210297663U CN210297663U CN201920809701.8U CN201920809701U CN210297663U CN 210297663 U CN210297663 U CN 210297663U CN 201920809701 U CN201920809701 U CN 201920809701U CN 210297663 U CN210297663 U CN 210297663U
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Abstract
The utility model discloses a SMD quartz crystal resonator, which comprises a ceramic base; a first boss; a second boss; a first metal coating; a second metal coating; a third metal coating; a first, a second, a third and a fourth electrode metal coating; a first hole; a second hole; the third hole is communicated with the third metal coating and the third electrode metal coating, and conductive paste is poured into the third hole to electrically connect the third metal coating and the third electrode metal coating; the fourth hole is communicated with the third metal coating and the fourth electrode metal coating, and conductive slurry is poured into the fourth hole to electrically connect the third metal coating and the fourth electrode metal coating; a wafer; the flexible pressing piece is arranged on the upper surface of the wafer and is opposite to the second boss; the upper cover covers the cavity opening and presses the flexible pressing piece on the wafer; the first metal coating and the second metal coating are respectively bonded with the electrode of the wafer through point conductive adhesive; the height of the flexible pressing piece is equal to the distance between the upper surface of the wafer and the lower surface of the upper cover. It has small volume and good shock resistance.
Description
Technical Field
The utility model relates to a quartz crystal, concretely relates to SMD quartz crystal syntonizer.
Background
Compared with the original direct-insertion type quartz crystal, the existing Surface Mount Device (SMD) quartz crystal has good miniaturization effect, but the internal space of the SMD quartz crystal is reduced, so that the shock resistance of the SMD quartz crystal is reduced, and the SMD quartz crystal is easy to generate resonance or is easy to crack due to external force during wave soldering.
Disclosure of Invention
An object of the utility model is to provide a cracked SMD quartz crystal syntonizer of wafer is difficult. The utility model adopts the following technical proposal:
an SMD quartz crystal resonator comprising:
the upper surface of the ceramic base is provided with an inwards concave cuboid cavity;
the first boss is arranged on the bottom surface of one end of the concave cavity;
the second boss is arranged on the bottom surface of the other end of the concave cavity and is opposite to the first boss;
the first metal coating is printed on one position of the upper surface of the first boss;
the second metal coating is printed on the other part of the upper surface of the first boss;
the third metal coating is printed on the upper surface and the outer side surface of the cavity wall of the concave cavity;
the first, second, third and fourth electrode metal coatings are printed on the four positions of the lower surface of the ceramic base correspondingly;
the first hole is communicated with the first metal coating and the first electrode metal coating, and conductive slurry is poured into the first hole to electrically connect the first metal coating and the first electrode metal coating;
the second hole is communicated with the second metal coating and the second electrode metal coating, and conductive slurry is poured into the second hole to electrically connect the second metal coating and the second electrode metal coating;
the third hole is communicated with the third metal coating and the third electrode metal coating, and conductive paste is poured into the third hole to electrically connect the third metal coating and the third electrode metal coating;
the fourth hole is communicated with the third metal coating and the fourth electrode metal coating, and conductive slurry is poured into the fourth hole to electrically connect the third metal coating and the fourth electrode metal coating;
the wafer is horizontally placed in the concave cavity and supported by the first boss and the second boss;
the flexible pressing piece is arranged on the upper surface of the wafer and is opposite to the second boss;
the upper cover covers the cavity opening and presses the flexible pressing piece on the wafer, and the upper cover is electrically connected with the third metal coating;
wherein, the first and second metal coating are respectively bonded with the electrode of the wafer through point conductive adhesive; the height of the flexible pressing piece is equal to the distance between the upper surface of the wafer and the lower surface of the upper cover.
The flexible pressing piece is characterized by further comprising a first protrusion arranged on the inner surface of the cavity wall on one side of the cavity and positioned above one end of the second boss, a second protrusion arranged on the inner surface of the cavity wall on the other side of the cavity and positioned above the other end of the second boss and opposite to the first protrusion, wherein a first positioning groove is formed between the first protrusion and the inner surface of the cavity wall at the end where the second boss of the cavity is positioned, a second positioning groove is formed between the second protrusion and the inner surface of the cavity wall at the end where the second boss of the cavity is positioned, notches are formed between the first protrusion and the second protrusion, and two ends of the flexible pressing piece are respectively arranged in the.
The first and second protrusions are integrally formed with the ceramic base.
When the width of the notch is smaller than that of the wafer, the flexible pressing piece is provided with a pressing part which penetrates through the notch and presses the corresponding part on the upper surface of the wafer.
The flexible pressing piece is fixedly connected to the lower surface of the upper cover at a position corresponding to the second boss.
The first boss and the second boss are integrally manufactured with the ceramic base.
The utility model discloses a department sets up flexible casting die back to the body with second boss at wafer upper surface, and the upper cover lid fits the cavity opening and presses flexible casting die in the wafer, and first, two metal coating departments bond with the wafer through some conducting resin respectively to and the distance between highly equals wafer upper surface and the upper cover lower surface of flexible casting die, and its wafer is difficult for producing resonance, and can overcome and receive other easy cracked problems of external force. The utility model discloses it is small, the shock resistance is good.
Drawings
Fig. 1 is a schematic structural view (top view) of the present invention.
Fig. 2 is a sectional view a-a of fig. 1.
Fig. 3 is a top view of fig. 1 without the cover.
Fig. 4 is a bottom view of the present invention.
Fig. 5 is a top view of the present invention shown in fig. 1 without the upper cover and the flexible pressing member.
Fig. 6 is a schematic perspective view of the flexible pressing member of the present invention.
Detailed Description
In order to explain the technical features and functions of the present invention in detail and to realize the same according to the content of the present specification, the following will further explain embodiments of the present invention with reference to the accompanying drawings.
Unless specifically stated otherwise, the terms "first," "second," "third," "fourth," and the like herein do not denote any order or importance, nor do they denote any importance associated with the terms.
Fig. 1-5 illustrate an embodiment of an SMD quartz crystal resonator among many embodiments of the present invention. The SMD quartz crystal resonator comprises a ceramic base 1, a first boss 2, a second boss 3, a first metal coating 4, a second metal coating 5, a third metal coating 6, a first, a second, a third and a fourth electrode metal coatings 7, 8, 9, 10, a first hole 11, a second hole 12, a third hole 13, a fourth hole 14, a wafer 15, a flexible pressing piece 16 and an upper cover 17.
Referring also to fig. 5, the ceramic base 1 is of a generally rectangular parallelepiped configuration having a concave rectangular parallelepiped cavity 18 in an upper surface thereof. The first boss 2 is disposed on the bottom surface of one end of the cavity 18. The second boss 3 is disposed on the bottom surface of the other end of the cavity 18 and opposite to the first boss 2. The first metal coating 4 is printed on the first boss 2. The second metal coating 5 is printed on the other position of the upper surface of the first boss 2. The third metal coating 6 is printed on the upper surface and the outer side surface of the cavity wall of the concave cavity 18.
Referring to fig. 4, one of the first, second, third and fourth electrode metal coatings 7, 8, 9 and 10 is printed on the lower surface of the ceramic base 1. The first hole 11 communicates the first metal coating 4 and the first electrode metal coating 7, and a conductive paste is poured therein to electrically connect the first metal coating 4 and the first electrode metal coating 7. The second hole 12 communicates the second metal coating 5 and the second electrode metal coating 8, and a conductive paste is poured into the second hole to electrically connect the second metal coating 5 and the second electrode metal coating 8. The third hole 13 communicates the third metal coating 6 with the third electrode metal coating 9, and a conductive paste is poured therein to electrically connect the third metal coating 6 with the third electrode metal coating 9. The fourth hole 14 communicates the third metal coating and the fourth electrode metal coating, and a conductive paste is poured into the fourth hole to electrically connect the third metal coating 6 and the fourth electrode metal coating 10. For example, the conductive paste may be a conductive paste that is cured by high temperature (typically 120 ℃) after being poured.
Referring to fig. 2 and 3, the wafer 15 is placed flat in the cavity 18 and supported by the first and second bosses 2 and 3. The flexible pressing member 16 is disposed on the upper surface of the wafer 15 opposite to the second boss 3.
Referring to fig. 1 and 2, the upper cover 17 covers the opening of the cavity 18 and presses the flexible pressing member 16 against the wafer 15, so that the wafer 15 is pressed against the second boss 3 by the flexible pressing member 16. The upper cover 17 is electrically connected with the third metal coating 6, and the upper cover 17 is of a flat plate structure.
Referring to fig. 2 and 3, the first and second metal coatings 4 and 5 are respectively adhered to the electrodes of the wafer 15 by a spot conductive adhesive 24. The height of the flexible compression element 16 is equal to the distance between the upper surface of the wafer 16 and the lower surface of the upper cover 17.
The utility model discloses a wafer 15 is kept flat in cavity 18 and by first, two bosss 2, 3 support, flexible casting die 16 sets up in the position that carries on the back mutually with second boss 3 of wafer 15 upper surface, upper cover 17 approximately fits cavity 18 opening and presses flexible casting die 16 in second boss 3, it is first, two metal coating 4, 5 punishment do not bond and the distance between wafer 16 upper surface and the upper cover 17 lower surface through some conducting resin and wafer 15, when receiving external force (for example wave soldering or other external force), wafer 15 only produces slight vibrations, can not produce resonance, and flexible casting die 16 has elasticity, it has the damping action to vibrate wafer 15, can consume the vibrations energy, wafer 15 is difficult cracked, also be difficult for coming off from first boss 2, make the frequency more accurate.
In some embodiments, referring to fig. 5 together, the present invention further includes a first protrusion 19 disposed on the inner surface of the cavity wall on one side of the cavity 18 and located above one end of the second protrusion 3, and a second protrusion 20 disposed on the inner surface of the cavity wall on the other side of the cavity 18 and located above the other end of the second protrusion 3 and opposite to the first protrusion 19, a first positioning groove 21 is formed between the first protrusion 19 and the inner surface of the cavity wall on the end where the second protrusion 3 of the cavity 18 is located, a second positioning groove 22 is formed between the second protrusion and the inner surface of the cavity wall on the end where the second protrusion of the cavity is located, a gap is formed between the first protrusion 19 and the second protrusion 20, and two ends of the flexible pressing member 16 are respectively disposed in the first positioning groove 21 and the. This allows for easy and quick assembly of the flexible compression element 16. Referring also to fig. 6, when the width of the notch is smaller than the width of the wafer 15, the wafer 15 cannot pass through the notch, and the flexible pressing member 16 has a pressing portion 23 which presses the upper surface of the wafer 15 through the notch.
In addition to the above-mentioned structure for positioning the flexible pressing member 16, the flexible pressing member 16 is fixedly connected to the lower surface of the upper cover 17 at a position corresponding to the second boss 3, so as to achieve the effect of easily and quickly assembling the flexible pressing member 16.
In some embodiments, the first and second protrusions 2, 3 are preferably integrally formed with the ceramic base 1.
In some embodiments, the first and second bosses 2, 3 are preferably formed integrally with the ceramic susceptor 1.
The utility model discloses ceramic base 1 adopts first metal coating 4 of printing, second metal coating 5, third metal coating 6, first, two, three, four electrode metal coating 7, 8, 9, 10, sinters again to and will correspond metal coating electrical connection through filling electrically conductive thick liquid and high temperature setting, make stable in structure, the support nature is strong, external force is not fragile ceramic base 1, and the wafer is difficult cracked, and whole antidetonation effect is better.
It should be noted that the various features described in the foregoing embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the present invention does not describe every possible combination.
The present invention has been described in detail with reference to the embodiments, which are illustrative rather than restrictive, and variations and modifications may be effected without departing from the general inventive concept within the scope thereof.
Claims (6)
1. An SMD quartz crystal resonator, comprising:
the upper surface of the ceramic base is provided with an inwards concave cuboid cavity;
the first boss is arranged on the bottom surface of one end of the concave cavity;
the second boss is arranged on the bottom surface of the other end of the concave cavity and is opposite to the first boss;
the first metal coating is printed on one position of the upper surface of the first boss;
the second metal coating is printed on the other part of the upper surface of the first boss;
the third metal coating is printed on the upper surface and the outer side surface of the cavity wall of the concave cavity;
the first, second, third and fourth electrode metal coatings are printed on the four positions of the lower surface of the ceramic base correspondingly;
the first hole is communicated with the first metal coating and the first electrode metal coating, and conductive slurry is poured into the first hole to electrically connect the first metal coating and the first electrode metal coating;
the second hole is communicated with the second metal coating and the second electrode metal coating, and conductive slurry is poured into the second hole to electrically connect the second metal coating and the second electrode metal coating;
the third hole is communicated with the third metal coating and the third electrode metal coating, and conductive paste is poured into the third hole to electrically connect the third metal coating and the third electrode metal coating;
the fourth hole is communicated with the third metal coating and the fourth electrode metal coating, and conductive slurry is poured into the fourth hole to electrically connect the third metal coating and the fourth electrode metal coating;
the wafer is horizontally placed in the concave cavity and supported by the first boss and the second boss;
the flexible pressing piece is arranged on the upper surface of the wafer and is opposite to the second boss;
the upper cover covers the cavity opening and presses the flexible pressing piece on the wafer, and the upper cover is electrically connected with the third metal coating;
wherein, the first and second metal coating are respectively bonded with the electrode of the wafer through point conductive adhesive; the height of the flexible pressing piece is equal to the distance between the upper surface of the wafer and the lower surface of the upper cover.
2. The SMD quartz crystal resonator of claim 1, further comprising a first protrusion disposed on an inner surface of the cavity wall at one side of the cavity and located above one end of the second protrusion, and a second protrusion disposed on an inner surface of the cavity wall at the other side of the cavity and located above the other end of the second protrusion and opposite to the first protrusion, wherein a first positioning groove is formed between the first protrusion and the inner surface of the cavity wall at the end of the cavity where the second protrusion is located, a second positioning groove is formed between the second protrusion and the inner surface of the cavity wall at the end of the cavity where the second protrusion is located, a gap is formed between the first protrusion and the second protrusion, and two ends of the flexible pressing member are respectively disposed in the first positioning groove and the second positioning groove in a one.
3. The SMD quartz crystal resonator of claim 2, wherein the first and second projections are integrally formed with the ceramic base.
4. The SMD quartz crystal resonator as claimed in claim 3, wherein said flexible presser has a pressing portion pressed through the notch to a corresponding portion of the upper surface of said wafer when the width of said notch is smaller than the width of said wafer.
5. The SMD quartz crystal resonator as claimed in claim 1, wherein said flexible pressing member is fixedly attached to a position of the lower surface of said upper cover corresponding to said second boss.
6. The SMD quartz crystal resonator according to any of the claims 1-5, characterised in that said first and second projections are made in one piece with the ceramic base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920809701.8U CN210297663U (en) | 2019-05-31 | 2019-05-31 | SMD quartz crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920809701.8U CN210297663U (en) | 2019-05-31 | 2019-05-31 | SMD quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210297663U true CN210297663U (en) | 2020-04-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920809701.8U Active CN210297663U (en) | 2019-05-31 | 2019-05-31 | SMD quartz crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210297663U (en) |
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2019
- 2019-05-31 CN CN201920809701.8U patent/CN210297663U/en active Active
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