CN209184568U - A kind of resonator being readily produced - Google Patents

Abstract

A kind of resonator being readily produced, it include: ceramic base, quartz wafer, cover board, first conducting resinl, second conducting resinl, sealing-in glue and sealing compound, first face of ceramic base is printed with internal wiring and dispensing position, second face of ceramic base is printed with the first pad and the second pad, ceramic base offers first through hole and the second through-hole, first conducting resinl is arranged in first through hole and the second through-hole, quartz wafer is provided with connected unit, the one side of connected unit is connected by the first face of sealing-in glue and ceramic base, the another side of connected unit is connect by sealing compound with cover board, quartz wafer is provided with electrode, electrode on quartz wafer is connect by the second conducting resinl with dispensing position.The step of quartz wafer is provided with connected unit, and connected unit plays the role of support and protection quartz chip, saves quartz wafer installation; technique is saved, first through hole and the second through-hole are provided with, is realized and is electrically connected by the first conducting resinl; outside lead is avoided, the air-tightness of resonator is enhanced.

Description

A kind of resonator being readily produced

Technical field

The utility model relates to technical field of electronic components, in particular to a kind of resonator being readily produced.

Background technique

Quartz-crystal resonator is a kind of piezoelectric effect using quartz crystal and manufactured resonant element, is widely used in In various electronic products, it can be applied in each electronic product such as clock, timer, mobile phone, music player, to provide Fixed frequency, in the prior art, quartz-crystal resonator are made of quartz wafer, ceramic base and cover board, in manufacturing process In, quartz wafer is mounted on ceramic base by conducting resinl, and quartz wafer is easy to appear damaged damage during the installation process, from And the product qualified rate of quartz-crystal resonator is affected, production process processing technology requires harsh, equipment requirement height, is processed into This height.

Utility model content

The technical problem to be solved by the utility model is to provide a kind of resonators being readily produced.

The technical solution that the utility model solves above-mentioned technical problem is as follows: a kind of resonator being readily produced, including pottery Porcelain pedestal, quartz wafer, cover board, the first conducting resinl, the second conducting resinl, sealing-in glue and sealing compound, the first of the ceramic base Face is printed with internal wiring and dispensing position, and the second face of the ceramic base is printed with the first pad and the second pad, and described The both ends in the second face of the ceramic base are arranged in one pad and second pad, and it is logical that the ceramic base offers first Hole and the second through-hole, the first through hole setting is in first welding disking area, and the second through-hole setting is in second weldering Disk area, first conducting resinl are arranged in the first through hole and second through-hole, and the internal wiring passes through described First conducting resinl is connect with first pad and second pad respectively, and the quartz wafer is provided with connected unit, described The one side of connected unit is connect by the sealing-in glue with the first face of the ceramic base, and the another side of the connected unit passes through institute It states sealing compound to connect with the cover board, the quartz wafer is provided with electrode, and the electrode on the quartz wafer passes through described the Two conducting resinls are connect with the dispensing position.

Further, the ceramic base and the cover board are plate.

Further, wave structure is arranged in the side wall of the side wall of the first through hole and second through-hole.

Further, first conducting resinl and second conducting resinl are conductive silver glue.

Further, the ceramic base is LTCC low-temp ceramics pedestal.

Further, first pad and second pad are coated with nickel gold.

Further, the connected unit and the quartz wafer are integrally formed.

The beneficial effects of the utility model are: quartz wafer is provided with connected unit, connected unit plays support and protection quartz The effect of chip, quartz wafer are connect with ceramic base and cover board by connected unit and are packaged into resonator, and quartz wafer is eliminated The step of installation, avoids quartz crystal from damaging during installation due to contacting firmly, simplifies technique, improves work efficiency, Meanwhile it being provided with first through hole and the second through-hole, the electrical connection of internal wiring and external pads is realized by the first conducting resinl, is kept away Exempt from outside lead, enhanced the air-tightness of resonator, improves the quality of resonator.

Detailed description of the invention

Top view when Fig. 1 is a kind of unassembled upper cover plate of resonator for being readily produced of one embodiment；

Fig. 2 is a kind of cross-sectional view of resonator being readily produced of one embodiment；

Fig. 3 is the first face structural schematic diagram of ceramic base in one embodiment；

Fig. 4 is the second face structural schematic diagram that the first conducting resinl is not added for ceramic base in one embodiment.

Specific embodiment

It should be noted that in the absence of conflict, the feature in the embodiments of the present invention and embodiment can To be combined with each other.Below with reference to the attached drawing of the utility model embodiment, the technical solution of the utility model is done and is further retouched It states, the utility model is not limited only to following specific embodiments.

It is to be appreciated that in the attached drawing of embodiment, the same or similar label correspond to the same or similar components.At this In the description of utility model, it is to be understood that if having term " on ", "lower", "front", "rear", "left", "right", "top", "bottom" The orientation or positional relationship of equal instructions is to be based on the orientation or positional relationship shown in the drawings, and being merely for convenience of description, this is practical new Type and simplified description, rather than the equipment of indication or suggestion meaning or element must have a particular orientation, with specific orientation Construction and operation, therefore the terms describing the positional relationship in the drawings are only for illustration, should not be understood as to this patent Limitation, for the ordinary skill in the art, can understand the concrete meaning of above-mentioned term as the case may be.

As shown in Figure 1, Figure 2, Figure 3 and Figure 4, in one embodiment, a kind of resonator being readily produced, including ceramic bottom Seat 100, quartz wafer 200, cover board 300, the first conducting resinl 400, the second conducting resinl 500, sealing-in glue 600 and sealing compound 700, institute The first face for stating ceramic base 100 is printed with internal wiring 101 and dispensing position 102, and the second face of the ceramic base is printed with First pad 103 and the second pad 104, first pad 103 and second pad 104 are arranged in the ceramic base The both ends in 100 the second face, the ceramic base 100 offer first through hole 105 and the second through-hole 106, the first through hole In 103 region of the first pad, second through-hole 106 is arranged in 104 region of the second pad, i.e., described for 105 settings First through hole 105 is aligned in the first pad 103, and second through-hole 106 is aligned in second pad 104, and described first leads Electric glue 400 is arranged in the first through hole 105 and second through-hole 106, that is, in first through hole 105 and the second through-hole 106 The first conducting resinl 400 is inside respectively set, the internal wiring 101 is welded with described first respectively by first conducting resinl 400 Disk 103 and second pad 104 connection, the internal wiring 101 by the first conducting resinl 400 in first through hole 105 with First pad 103 connects, and the internal wiring 101 passes through the first conducting resinl 400 and the second pad in the second through-hole 106 104 connections, the quartz wafer 200 are provided with connected unit 201, and the connected unit 201 integrally connects with the quartz wafer 200 It connects, and the connected unit 201 is connected to the outer ledge of the quartz wafer 200, the one side of the connected unit 201 passes through described Sealing-in glue 600 is connect with the first face of the ceramic base 100, and the another side of the connected unit 201 passes through the sealing compound 700 It is connect with the cover board 300.The quartz wafer 200 is provided with electrode (not shown), the electrode on the quartz wafer 200 (not shown) is connect by second conducting resinl 500 with the dispensing position 102.

In the present embodiment, cover board 300, ceramic base 100 and connected unit 201 connect internal formation seal chamber, quartz wafer 200 are set in seal chamber.

Specifically, the first face and the second face of the ceramic base 100 are disposed opposite to each other, the first of the ceramic base 100 Face is the front of the ceramic base 100, and the second face of the ceramic base 100 is the bottom surface of the ceramic base 100, institute Ceramic base 100 is stated after cleaning, drying processing is clean, according to specific needs, using silk-screen printing, in the ceramic base 100 The first face print the internal wiring 101 and the dispensing position 102, print described first in basic second face of the ceramics Pad 103 and second pad 104, the sinter molding in sintering furnace, then according to specific line condition, in the inner wire The position that road 101 is overlapped with projection of first pad 103 on the ceramic base 100 opens up institute using laser boring First through hole 105 is stated, is overlapped in the internal wiring 101 with projection of second pad 104 on the ceramic base 100 Position second through-hole 106 is opened up by laser boring, be added in the first through hole 105 and second through-hole 106 First conducting resinl 400, puts oven into and is solidified, thus realize the electrical connection of the internal wiring 101 and external pads, The quartz wafer 200 and the connected unit 201 are handled by chemical attack, corrode 201 shape of connected unit and quartz out The electrode of chip 200, is integrally formed, and the connected unit 201 is fixedly connected on the ceramic base by the sealing-in glue 600 On 100 the first face, so that the quartz wafer 200 is mounted on the ceramic base 100, the quartz wafer 200 Electrode and the dispensing position 102 correspond dispensing with second conducting resinl 500, realize the quartz wafer 200 and described The electrical connection of dispensing position 102 uses the envelope to realize being electrically connected for the quartz wafer 200 and the internal wiring 101 The cover board 300 and the connected unit 201 are bonded by chewing-gum 700, the resonator being readily produced described in encapsulation formation.Quartz wafer It is provided with connected unit, connected unit is integrally formed in quartz wafer preparation process to be obtained, and connected unit plays support and protection stone The effect of English chip, quartz wafer are connect with ceramic base and cover board by connected unit and are packaged into resonator, and quartz-crystal is eliminated The step of piece is installed, avoids quartz crystal from damaging during installation due to contacting firmly, simplifies technique, improves work effect Rate, meanwhile, it is provided with first through hole and the second through-hole, being electrically connected for internal wiring and external pads is realized by the first conducting resinl It connects, avoids outside lead, enhance the air-tightness of resonator, improve the quality of resonator.

In one embodiment, the ceramic base 100 and the cover board 300 are plate.The plate ceramics Pedestal 100 facilitates the processing of subsequent quartz wafer, simplifies technique, and the cover board 300 uses plate cover board, and plate is set It counts simple and easy to get, avoids using cover design, so that the investment for comparing high request equipment is avoided, so that cost is saved, it can In high volume, it produces at low cost.It should be understood that in one embodiment, the ceramic base 100 is LTCC low-temp ceramics Pedestal.The ceramic base sheet 100 is made of LTCC (Low Temperature Co-fired Ceramic) low-temp ceramics, LTCC low-temp ceramics have excellent electronics, machinery and thermodynamic property, are adapted to the requirement of high current and high-temperature stability, can By property height, it can be applicable to severe working environment, so as to extend the service life of the resonator, improve the resonance The quality of device.

In one embodiment, wave knot is arranged in the side wall of the side wall of the first through hole 105 and second through-hole 106 Structure.By the way that wave structure is arranged, first conducting resinl 400 and the first through hole 105 and second through-hole can be made 106 surface can preferably connect together, and first conducting resinl 400 of stating realizes the internal wiring 101 and institute The electrical connection of outer pad is stated, to reach better turn-on effect.

In one embodiment, first conducting resinl 400 and second conducting resinl 500 are conductive silver glue.It is described First conducting resinl 400 is used to realize the electrical connection of the internal wiring 101 and the outer pad, and second conducting resinl 500 is used To realize the electrical connection of the quartz wafer 200 and the internal wiring 101, conductive silver glue high, electric conductivity with adhesive strength The characteristics such as energy is good, resistance is low, easily operated, working efficiency can be improved in simple process, is the material being preferably conductively connected.

In one embodiment, first pad 103 and second pad 104 are coated with nickel gold.It should be understood that It is that first pad 103 and second pad 104 are copper pad, since nickel fitting has better inoxidizability, described First pad 103 and 104 plated with nickel of the second pad gold, can prevent first pad 103 and second pad 104 It is oxidized or corrodes, to promote the quality of the resonator.

In one embodiment, frosted layer, the frosted layer at the both ends of connected unit is respectively set in the surface at the both ends of connected unit It is connect respectively with sealing-in glue 600 and sealing compound 700, frosted layer can increase the frictional force on connected unit surface, so that even It is consecutive more firm with the connection of sealing-in glue 600 and sealing compound 700, be conducive to the leakproofness for improving seal chamber.

Obviously, the above embodiments of the present invention is merely examples for clearly illustrating the present invention, and It is not limitations of the embodiments of the present invention.For those of ordinary skill in the art, in above description On the basis of can also make other variations or changes in different ways.There is no need and unable to give all embodiments Exhaustion.Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention etc., should be included in Within the protection scope of the utility model claims.

Claims (7)

1. a kind of resonator being readily produced characterized by comprising ceramic base, quartz wafer, cover board, the first conducting resinl, Second conducting resinl, sealing-in glue and sealing compound, the first face of the ceramic base are printed with internal wiring and dispensing position, the ceramics Second face of pedestal is printed with the first pad and the second pad, and first pad and second pad are arranged in the ceramics The both ends in the second face of pedestal, the ceramic base offer first through hole and the second through-hole, and the first through hole is arranged in institute State the first welding disking area, the second through-hole setting is in second welding disking area, and the first conducting resinl setting is described the In one through-hole and second through-hole, the internal wiring by first conducting resinl respectively with first pad and described The connection of second pad, the quartz wafer are provided with connected unit, and the one side of the connected unit passes through the sealing-in glue and the pottery First face of porcelain pedestal connects, and the another side of the connected unit is connect by the sealing compound with the cover board, the quartz-crystal Piece is provided with electrode, and the electrode on the quartz wafer is connect by second conducting resinl with the dispensing position.

2. the resonator being readily produced as described in claim 1, which is characterized in that the ceramic base and the cover board are It is plate.

3. the resonator being readily produced as described in claim 1, which is characterized in that the side wall of the first through hole and described Wave structure is arranged in the side wall of two through-holes.

4. the resonator being readily produced as described in claim 1, which is characterized in that first conducting resinl and described second is led Electric glue is conductive silver glue.

5. the resonator being readily produced as described in claim 1, which is characterized in that the ceramic base is LTCC low-temp ceramics Pedestal.

6. the resonator being readily produced as described in claim 1, which is characterized in that first pad and second pad It is coated with nickel gold.

7. the resonator being readily produced as described in claim 1, which is characterized in that the connected unit and the quartz wafer one It is body formed.