JPS6257226A - Pickup mechanism - Google Patents

Abstract

PURPOSE:To respond to the change in kinds of materials immediately, by sucking and conveying a material to be conveyed with two pickups in the normal operation, and sucking and conveying a small material to be conveyed by operating only any one of the pickups. CONSTITUTION:When an LSI chip to be conveyed is large, a control part 16 uses both pickups 4 and 5. Therefore both solenoid valves 11 and 12 are driven. Namely, the pickups 4 and 5 are moved to a positioning part, where an LSI chip 21 is placed, by the movement of a mounting head 18. The pickups are moved and lowered so that the intermediate central position is brought to the approximately central part of the LSI chip 21. The pickups 4 and 5 are contacted with the LSI 21. Then the solenoid valves 11 and 12 are turned ON under the instruction of the control part 16. The pickups 4 and 5 are communicated to a vacuum source 15. The LSI 21 is sucked owing to the pressure reduction. The LSI 21 is pushed to a specified position on a substrate with the movement of the mounting head 18. When the change in kinds of the chips is instructed, the control part 16 turns OFF the solenoid valve 12 and the pickup 5 is released to free air. Only the solenoid valve 11 is turned ON and OFF, and the pickup 4 is operated. Thus the chip is conveyed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a pickup mechanism suitable for handling small parts of various sizes.

[Technical background of the invention and its problems]

There are various types of assembly equipment for assembling semiconductor devices, such as a mounter for bonding an LSI chip to a substrate, a die bonder for bonding it to a lead frame, and the like. In these assembly devices, the LS
A pickup mechanism is used that attracts and holds the I-chip. However, if these LSIs are always assembled with the same dimensions, there will be no problem, but recently they have been produced in small quantities of many different types, and the types often change. In times like this,
The pickup, which is a tubular body that holds the direct parts of the pickup mechanism, needs to be replaced depending on the type of LSI.The easiest way to replace the pickup is for the operator to go to the desired pickup and replace it. There are various methods, such as a tool changer that arranges various pickups and automatically replaces them with the desired one, and a tool that is equipped with a turret head and the desired head is prepared by the rotation of the turret. . However, the method performed by an operator is inefficient and troublesome, and those equipped with a tool changer result in a large loss of time if the tool type is frequently replaced. Still the disadvantage is that those with turrets are very expensive.

[Purpose of the invention]

The present invention has been made to solve the above-mentioned disadvantages, and an object of the present invention is to provide a pick-up mechanism that can immediately respond to the change of product types and has a simple configuration. ] In the present invention, two pickups (C tube bodies) are added to a movable pickup main body, and the pickups are configured to be attracted and released separately. Normally, two pickups are used to pick up and release objects. This pickup mechanism is designed to be able to immediately respond to changes in product types by suctioning and conveying small objects and operating only one of the pickups to suction and convey small objects.[Embodiment of the Invention] ] The details of the present invention will be explained below with reference to an embodiment shown in FIGS. 1 to 3. Note that this embodiment uses an LSI chip, for example -
It is attached to a mounter that adheres items with sides of about 2 to 8 inches to a board.

(1) is a main body consisting of a square block, and two suction/exhaust holes (2) and (3) penetrating from the top surface to the bottom surface are provided.

The upper surface opening and the lower surface opening are located substantially diagonally apart from each other on the upper surface and the lower surface, and pick-ups (4) and (5) each consisting of a tube are protruded and fixed to the lower surface opening, The length of the protrusion is the same, one lower end is open to the atmosphere, and the other upper end has a suction and exhaust hole (
2) and (3) are airtightly connected.

There are joints (6) on the top openings of the suction and exhaust holes (2), (3).
, (7) are attached, and one ends of flexible conduits (8), (9) made of rubber or the like are connected to these. In addition, the first openings of solenoid valves aυ and Q3 are connected to the other ends of these conduits (8) and (9), respectively, and the second openings of these solenoid valves - and ano are respectively connected. It is connected to a vacuum source α, and each third opening is open to the atmosphere. In other words, these solenoid valves −, α2
is picked up by switching ON and OFF (4),
The openings in (5) can be alternately and separately communicated with the vacuum source α5 or the atmosphere. aO is a control unit that controls ON/OFF switching of the electromagnetic valves (11) and (13), and is controlled by a signal from the main device (mounter) to which the pickup mechanism of this embodiment is attached. Q8) is mounted on an XY table (not shown) by the mount head of the main device, and is driven horizontally and vertically. The main body (1) is attached to the guide groove so that its position in the vertical direction can be adjusted. Also, solenoid valve α
BCl2+, vacuum source (I), control unit (Iυ, etc.) are attached to the fixed part of the main device.

Next, the operation of this embodiment will be explained. LSI to be transported
If the chip is large, for example, 8 vertically x 8 horizontally, the control section will pick up both pickups (4) according to the signal from the main device.
(5), both solenoid valves αυ.

Drive a. In other words, by moving the mount head for Q seconds, the positioning part (
The pickups (4) and (5) are moved to the LSI chip (not shown) and are transported so that their intermediate center position is almost at the center of the LSI chip (21), and then lowered to the pickup (4).
) and (5) contact LSIQυ. Next, control section α
According to the command of Q, the stain magnetic valve Ql), (12 is turned on, the vacuum source a9 and the pickups (4) and (5) are connected to reduce the pressure, the LSI (2υ) is attracted, and the mount head brocade is moved. 0, the LSI@l) is pressed to a predetermined position on the board by be done.

Next, when a command is issued from the main equipment to change the product type, the controller αe switches to transporting a small LSI (33 (see Figure 3)).In other words, the controller αe controls the solenoid valve a OF
Fl. Leave the pickup (5) open to the atmosphere, and turn on only the solenoid valve αB as in the above case.

OFF L, operate the pickup (4) and transport.

At this time, it is desirable to align one pickup (4) with the center of the LSI (22).

Although this embodiment describes pickups with the same inner diameter, one inner diameter may be made larger (as in the case described above) and the other inner diameter may be made smaller. In this case, the pick-up range of the LSI may be reduced. Can be expanded. In addition, although we have described the case where the transported object is an LSI, it can also be applied to transporting Herad chips of tape recorders, Herad chips of VTRs, and various other chip parts.If suction is possible, TV assembly using a wide variety of parts can be applied. It may also be used for transporting parts on a line or the like.

〔Effect of the invention〕

As detailed above, the pickup mechanism of the present invention has two
Although the configuration is extremely simple and inexpensive because it is constructed using two pickups, it is difficult to use one or two pickups or knobs as appropriate, and it is difficult to adjust the dimensions in an extremely wide range without replacing pickups. Can handle different objects.

[Brief explanation of the drawing]

Fig. 1 is a configuration diagram of the pickup mechanism of the present invention, Fig. 2 is a bottom view similarly seen from the arrow ■ direction in Fig. 1, and Fig. 3 similarly shows only the main parts of Fig. 1 and shows another mode of use. It is an explanatory diagram. (1)...Main body, (4), (5)...Pickup, circle, L12)...Switching valve, 05)...Reducing pressure source. Agent Patent Attorney Noriyuki Chika Yudo Kikuo Takehana Figure 2

Claims (2)

[Claims] (1) A movably supported main body, two pickups made of tubular bodies that protrude from the main body by approximately the same length, are fixed to the main body, and have one protruding end open to the atmosphere, and the other ends of these pickups. A pickup mechanism characterized in that the pickup mechanism is equipped with two switching valves that separately communicate with each other to switch communication between the pickup and a reduced pressure source and communication between these pickups and the atmosphere or a high pressure source for each pickup. (2) The pickup mechanism according to claim 1, wherein the two pickups have different inner diameters.